公开(公告)号：US07879713B2

公开(公告)日：2011-02-01

申请号：US11653954

申请日：2007-01-17

申请人： Joji Fujimori ,  Seiki Sakuyama ,  Toshiya Akamatsu

发明人： Joji Fujimori ,  Seiki Sakuyama ,  Toshiya Akamatsu

IPC分类号： H01L21/44

CPC分类号： H01L24/05 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81204 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2224/05552

摘要： A mounting method of a semiconductor element whereby the semiconductor element is mounted on a wiring board via an outside connection projection electrode not containing lead (Pb), the mounting method includes a step of applying a reflow heating process for connecting the outside connection projection electrode of the semiconductor element and the wiring board and then cooling the connected semiconductor element and wiring board at a cooling rate equal to and lower than 0.5° C./s.

摘要翻译： 一种半导体元件的安装方法，其中半导体元件经由不包含引线（Pb）的外部连接投影电极安装在布线板上，该安装方法包括以下步骤：将回流加热工艺连接到外部连接突起电极 半导体元件和布线板，然后以等于或等于0.5℃的冷却速率冷却连接的半导体元件和布线板。

公开(公告)号：US20080124834A1

公开(公告)日：2008-05-29

申请号：US11653954

申请日：2007-01-17

申请人： Joji Fujimori ,  Seiki Sakuyama ,  Toshiya Akamatsu

发明人： Joji Fujimori ,  Seiki Sakuyama ,  Toshiya Akamatsu

IPC分类号： H01L21/58

CPC分类号： H01L24/05 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/5222 ,  H01L23/5329 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81204 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2224/05552

摘要： A mounting method of a semiconductor element whereby the semiconductor element is mounted on a wiring board via an outside connection projection electrode not containing lead (Pb), the mounting method includes a step of applying a reflow heating process for connecting the outside connection projection electrode of the semiconductor element and the wiring board and then cooling the connected semiconductor element and wiring board at a cooling rate equal to and lower than 0.5° C./s.

摘要翻译： 一种半导体元件的安装方法，其中半导体元件经由不包含引线（Pb）的外部连接投影电极安装在布线板上，该安装方法包括以下步骤：将回流加热工艺连接到外部连接突起电极 半导体元件和布线板，然后以等于或等于0.5℃的冷却速率冷却连接的半导体元件和布线板。

公开(公告)号：US20120193800A1

公开(公告)日：2012-08-02

申请号：US13313349

申请日：2011-12-07

申请人： Toshiya Akamatsu ,  Nobuhiro Imaizumi ,  Seiki Sakuyama ,  Keisuke Uenishi ,  Tetsuhiro Nakanishi

发明人： Toshiya Akamatsu ,  Nobuhiro Imaizumi ,  Seiki Sakuyama ,  Keisuke Uenishi ,  Tetsuhiro Nakanishi

IPC分类号： H01L23/488 ,  H05K1/02 ,  C22C30/04 ,  B23K31/02 ,  C22C12/00 ,  C22C30/06

CPC分类号： H05K3/3463 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/36 ,  B23K2101/40 ,  C22C12/00 ,  C22C13/00 ,  C22C30/04 ,  C22C30/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16506 ,  H01L2224/81065 ,  H01L2224/81097 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15311 ,  Y10T428/12708 ,  H01L2924/01083 ,  H01L2924/0105 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

摘要翻译： 焊料包括Sn（锡），Bi（铋）和Zn（锌），其中焊料的Zn含量为0.01重量％至0.1重量％。

公开(公告)号：US08673762B2

公开(公告)日：2014-03-18

申请号：US13313349

申请日：2011-12-07

申请人： Toshiya Akamatsu ,  Nobuhiro Imaizumi ,  Seiki Sakuyama ,  Keisuke Uenishi ,  Tetsuhiro Nakanishi

发明人： Toshiya Akamatsu ,  Nobuhiro Imaizumi ,  Seiki Sakuyama ,  Keisuke Uenishi ,  Tetsuhiro Nakanishi

IPC分类号： H01L21/44

CPC分类号： H05K3/3463 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/36 ,  B23K2101/40 ,  C22C12/00 ,  C22C13/00 ,  C22C30/04 ,  C22C30/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16506 ,  H01L2224/81065 ,  H01L2224/81097 ,  H01L2224/81192 ,  H01L2224/81211 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15311 ,  Y10T428/12708 ,  H01L2924/01083 ,  H01L2924/0105 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.

摘要翻译： 焊料包括Sn（锡），Bi（铋）和Zn（锌），其中焊料的Zn含量为0.01重量％至0.1重量％。

公开(公告)号：US07743966B2

公开(公告)日：2010-06-29

申请号：US11475001

申请日：2006-06-27

申请人： Toshiya Akamatsu ,  Seiki Sakuyama

发明人： Toshiya Akamatsu ,  Seiki Sakuyama

IPC分类号： B23K1/20

CPC分类号： B23K3/0623 ,  B23K1/203 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： The method for bonding a semiconductor element comprises the step of applying to solder bumps 10 of a semiconductor chip 12 a soldering flux 16 which contains a thermosetting resin, a polyhydric alcohol and an organic acid and in which the thermosetting resin remains uncured after reflow-bonding, the step of reflow-bonding the solder bumps 10 to the electrodes 18 of the circuit board 20 with the soldering flux 16 while melting the solder bumps 10, and the step of filling an underfill material 22 between the semiconductor chip 12 and the circuit board 20 with the soldering flux 16 being left, the underfill material 22 containing a thermosetting resin of the same group as the thermosetting resin contained in the soldering flux 16 and at least one of a curing agent and a cure catalyst for curing the thermosetting resins.

摘要翻译： 用于接合半导体元件的方法包括以下步骤：向半导体芯片12的焊料凸块10施加包含热固性树脂，多元醇和有机酸的焊剂16，并且其中热固性树脂在回流焊后保持未固化 在熔化焊料凸块10的同时用焊剂16将焊锡凸块10回流到电路板20的电极18的步骤，以及在半导体芯片12和电路板之间填充底部填充材料22的步骤 20，其中剩下焊剂16，底部填充材料22包含与焊剂16中所含的热固性树脂相同组的热固性树脂，以及用于固化热固性树脂的固化剂和固化催化剂中的至少一种。

公开(公告)号：US08556157B2

公开(公告)日：2013-10-15

申请号：US13113305

申请日：2011-05-23

申请人： Seiki Sakuyama ,  Toshiya Akamatsu ,  Masateru Koide

发明人： Seiki Sakuyama ,  Toshiya Akamatsu ,  Masateru Koide

IPC分类号： B23K31/02

CPC分类号： H05K1/0271 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16506 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81411 ,  H01L2224/81805 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/01083

摘要： A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component.

摘要翻译： 一种制造包括第一和第二部件的电子设备的方法，包括：在第一部件和第二部件之一上形成第一焊料凸块; 在所述第一部件和所述第二部件中的另一个上形成第二焊料凸块; 使得第一焊料凸点在比第一和第二焊料凸块中的任何一个的液相线温度高的温度下与第二焊料凸块接触，使得第一和第二焊料凸块熔合在一起以形成合金的焊接接头 具有比第一和第二焊料凸块中的任一个更低的液相线温度; 并固化第一和第二部件之间的焊接接头。

公开(公告)号：US20110220398A1

公开(公告)日：2011-09-15

申请号：US13113305

申请日：2011-05-23

申请人： Seiki Sakuyama ,  Toshiya Akamatsu ,  Masateru Koide

发明人： Seiki Sakuyama ,  Toshiya Akamatsu ,  Masateru Koide

IPC分类号： H05K1/09 ,  H01L21/50 ,  B23K31/02

CPC分类号： H05K1/0271 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16506 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/814 ,  H01L2224/81411 ,  H01L2224/81805 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/01083

摘要： A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component.

摘要翻译： 一种制造包括第一和第二部件的电子设备的方法，包括：在第一部件和第二部件之一上形成第一焊料凸块; 在所述第一部件和所述第二部件中的另一个上形成第二焊料凸块; 使得第一焊料凸点在比第一和第二焊料凸块中的任何一个的液相线温度高的温度下与第二焊料凸块接触，使得第一和第二焊料凸块熔合在一起以形成合金的焊接接头 具有比第一和第二焊料凸块中的任一个更低的液相线温度; 并固化第一和第二部件之间的焊接接头。

公开(公告)号：US20070221710A1

公开(公告)日：2007-09-27

申请号：US11475001

申请日：2006-06-27

申请人： Toshiya Akamatsu ,  Seiki Sakuyama

发明人： Toshiya Akamatsu ,  Seiki Sakuyama

IPC分类号： B23K1/20

CPC分类号： B23K3/0623 ,  B23K1/203 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： The method for bonding a semiconductor element comprises the step of applying to solder bumps 10 of a semiconductor chip 12 a soldering flux 16 which contains a thermosetting resin, a polyhydric alcohol and an organic acid and in which the thermosetting resin remains uncured after reflow-bonding, the step of reflow-bonding the solder bumps 10 to the electrodes 18 of the circuit board 20 with the soldering flux 16 while melting the solder bumps 10, and the step of filling an underfill material 22 between the semiconductor chip 12 and the circuit board 20 with the soldering flux 16 being left, the underfill material 22 containing a thermosetting resin of the same group as the thermosetting resin contained in the soldering flux 16 and at least one of a curing agent and a cure catalyst for curing the thermosetting resins.

摘要翻译： 用于接合半导体元件的方法包括以下步骤：向半导体芯片12的焊料凸块10施加包含热固性树脂，多元醇和有机酸的焊剂16，并且其中热固性树脂在回流焊后保持未固化 在熔化焊料凸块10的同时用焊剂16将焊锡凸块10回流到电路板20的电极18的步骤，以及在半导体芯片12和电路板之间填充底部填充材料22的步骤 20，其中剩下焊剂16，底部填充材料22包含与焊剂16中所含的热固性树脂相同组的热固性树脂，以及用于固化热固性树脂的固化剂和固化催化剂中的至少一种。

公开(公告)号：US5611481A

公开(公告)日：1997-03-18

申请号：US504080

申请日：1995-07-19

申请人： Toshiya Akamatsu ,  Kazuaki Karasawa ,  Teru Nakanishi ,  Kozo Shimizu

发明人： Toshiya Akamatsu ,  Kazuaki Karasawa ,  Teru Nakanishi ,  Kozo Shimizu

IPC分类号： B23K35/26 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L21/58

CPC分类号： H01L24/16 ,  B23K35/26 ,  H01L24/13 ,  H01L24/81 ,  H05K3/3436 ,  H01L2224/1147 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13201 ,  H01L2224/13211 ,  H01L2224/133 ,  H01L2224/16506 ,  H01L2224/81097 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81805 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  Y02P70/613

摘要： An integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board. One embodiment according to the present invention is a method for fabricating an integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board, both surfaces of the first and second electrodes having an adhesive tendency to molten metal, the method comprising the steps of forming a metal bump on the first electrode, the metal bump being made of a soldering metal alloy consisting of a solid phase component and a liquid phase component at an operating temperature; and forming an electric connection between the first electrode and the second electrode by heating the soldering metal alloy so as to adhere to the surface of the second electrode.

摘要翻译： 一种在半导体芯片的第一电极和电路板的第二电极之间具有电连接的集成电子设备。 根据本发明的一个实施例是一种用于制造在半导体芯片的第一电极和电路板的第二电极之间具有电连接的集成电子器件的方法，所述第一和第二电极的两个表面具有粘合倾向 所述方法包括以下步骤：在所述第一电极上形成金属凸块，所述金属凸块由在工作温度下由固相组分和液相组分组成的焊接金属合金制成; 以及通过加热所述焊接金属合金以在所述第一电极和所述第二电极的表面之间形成电连接。

公开(公告)号：US07604152B2

公开(公告)日：2009-10-20

申请号：US11340620

申请日：2006-01-27

申请人： Masayuki Ochiai ,  Hiroki Uchida ,  Toshiya Akamatsu

发明人： Masayuki Ochiai ,  Hiroki Uchida ,  Toshiya Akamatsu

IPC分类号： H05K3/00

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L2924/15311 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2203/043 ,  H05K2203/1476

摘要： A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of electronic parts having connection terminals with different metal compositions are connected by soldering, a plurality of solder pastes comprising solder components with different compositions are used, and when the electronic parts are connected by soldering to the substrate, a solder paste having a solder component with a different composition is used for each of the metal compositions for the connection terminals of the electronic parts.

摘要翻译： 提供了可以确保整个电子设备的可靠性的焊接技术，特别是无铅焊接技术。 在制造具有基板的电子设备用印刷电路板的制造方法中，使用具有不同金属成分的连接端子的多个电子部件通过焊接连接的基板，使用包含不同成分的焊料成分的多个焊膏， 电子部件通过焊接连接到基板，对于电子部件的连接端子的金属组合物，使用具有不同组成的焊料成分的焊膏。