公开(公告)号：US5874354A

公开(公告)日：1999-02-23

申请号：US48560

申请日：1998-03-26

申请人： Josef Heitzer ,  Josef Kirschbauer ,  Peter Stampka

发明人： Josef Heitzer ,  Josef Kirschbauer ,  Peter Stampka

IPC分类号： H01L21/607 ,  H01L21/44

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48624 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/8518 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L24/45 ,  H01L24/78 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/20752

摘要： A method for electrically connecting a semiconductor chip to at least one contact surface uses a thin wire having a first end welded to the at least one contact surface and a second end connected to a contact zone of the semiconductor chip. In order to produce a good connection between the wire and the contact zone of the semiconductor chip, the second end of the wire is welded to a metal piece in the form of a wedge which is disposed on the contact zone of the semiconductor chip and is connected in a conductive manner thereto. The metal piece is formed by a nailhead contact having a free end which is guided in a loop and is connected to the nailhead by a wedge contact. A smart card module and a smart card are produced by the method.

摘要翻译： 用于将半导体芯片电连接到至少一个接触表面的方法使用具有焊接到至少一个接触表面的第一端的细线，以及连接到半导体芯片的接触区的第二端。 为了在电线和半导体芯片的接触区域之间产生良好的连接，电线的第二端被焊接到金属片上，该金属片呈楔形的形式，其设置在半导体芯片的接触区上，并且是 以导电方式连接到其上。 金属片由具有自由端的钉头接头形成，该自由端以环形方式被引导并且通过楔形接触件连接到钉头。 通过该方法生产智能卡模块和智能卡。

公开(公告)号：US06185507B2

公开(公告)日：2001-02-06

申请号：US09255991

申请日：1999-02-23

申请人： Michael Huber ,  Peter Stampka ,  Josef Heitzer

发明人： Michael Huber ,  Peter Stampka ,  Josef Heitzer

IPC分类号： G01N2710

CPC分类号： G07F7/1008 ,  G06F21/86 ,  G06F21/87 ,  G06K19/07 ,  G06K19/0716 ,  G06K19/073 ,  G06K19/07372 ,  G06Q20/341 ,  G07F7/082

摘要： A microprocessor has a control unit with a housing surrounding the control unit. The invention also relates to a chip card having such a microprocessor that is protected against manipulations. At least one sensor indicates ambient states and is connected to the control unit and is provided in a region of the housing of the microprocessor. The control unit is configured in such a way that it can be placed in an inactive state if a measurement signal that indicates a predetermined ambient state is and/or is not fed to the control unit from the sensor.

摘要翻译： 微处理器具有控制单元，其具有围绕控制单元的壳体。 本发明还涉及具有这种微处理器的芯片卡，该微处理器被保护以防止操作。 至少一个传感器指示环境状态并且连接到控制单元并且设置在微处理器的壳体的区域中。 如果指示预定环境状态的测量信号和/或没有从传感器馈送到控制单元，则控制单元被配置为使其能够处于非活动状态。

公开(公告)号：US06313524B1

公开(公告)日：2001-11-06

申请号：US09274506

申请日：1999-03-23

申请人： Frank Pueschner ,  Michael Huber ,  Peter Stampka ,  Jürgen Fischer ,  Josef Heitzer

发明人： Frank Pueschner ,  Michael Huber ,  Peter Stampka ,  Jürgen Fischer ,  Josef Heitzer

IPC分类号： H01L2328

CPC分类号： G06K19/07747 ,  G06K19/07743 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/181 ,  H05K3/284 ,  H05K3/3426 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49146 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A chip module has a contact area disposed on its outer side formed of a plurality of essentially flat contact elements of electrically conductive material insulated from one another. At least one semiconductor chip having one or more integrated semiconductor circuits that are electrically connected to the contact elements of the contact area via bonding wires. The contact elements of the chip module are formed by a prefabricated lead frame for supporting the at least one semiconductor chip and have on two opposing sides of the chip module outwardly offset terminals arranged in rows next to one another. The outwardly offset terminals are provided for surface mounting the chip module on the mounting surface of an external printed circuit board or an external circuit board substrate.

摘要翻译： 芯片模块具有设置在其外侧上的接触区域，该接触区域由彼此绝缘的导电材料的多个基本平坦的接触元件形成。 至少一个具有一个或多个集成半导体电路的半导体芯片，其通过接合线与接触区域的接触元件电连接。 芯片模块的接触元件由用于支撑至少一个半导体芯片的预制引线框架形成，并且在芯片模块的两个相对侧上向外偏移端子排列成彼此相邻的行。 外部偏移端子用于将芯片模块表面安装在外部印刷电路板或外部电路板基板的安装表面上。

公开(公告)号：US06288904B1

公开(公告)日：2001-09-11

申请号：US09281693

申请日：1999-03-30

申请人： Detlef Houdeau ,  Peter Stampka ,  Michael Huber ,  Josef Heitzer

发明人： Detlef Houdeau ,  Peter Stampka ,  Michael Huber ,  Josef Heitzer

IPC分类号： H05K702

CPC分类号： G06K19/07745 ,  H01L23/3121 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399

摘要： The chip module is particularly suitable for implanting in a smart card body. The module has a carrier and a chip fitted on the carrier. A pedestal or base-type elevation formed on the carrier laterally surrounds the chip completely or partly.

摘要翻译： 芯片模块特别适用于植入智能卡体内。 该模块具有载体和芯片安装在载体上。 形成在载体上的基座或基座型高度横向围绕芯片完全或部分地围绕。

公开(公告)号：US6088901A

公开(公告)日：2000-07-18

申请号：US211107

申请日：1998-12-14

申请人： Michael Huber ,  Peter Stampka ,  Detlef Houdeau ,  Jurgen Fischer ,  Josef Heitzer ,  Helmut Graf

发明人： Michael Huber ,  Peter Stampka ,  Detlef Houdeau ,  Jurgen Fischer ,  Josef Heitzer ,  Helmut Graf

IPC分类号： H01L23/24 ,  B21D35/00

CPC分类号： H01L23/24 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/97 ,  Y10T156/1039 ,  Y10T156/1056 ,  Y10T29/49906

摘要： A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.

摘要翻译： 用于半导体芯片的载体元件，特别是内置于智能卡中。 载体元件具有承载芯片的基板和还承载芯片的加强板，并且具有用于接收芯片的凹部及其连接引线。 凹部的边缘设置有从片材一体地形成的框架。

公开(公告)号：US06191951B1

公开(公告)日：2001-02-20

申请号：US09390494

申请日：1999-09-03

申请人： Detlef Houdeau ,  Josef Mundigl ,  Frank Pueschner ,  Peter Stampka ,  Michael Huber ,  Josef Heitzer

发明人： Detlef Houdeau ,  Josef Mundigl ,  Frank Pueschner ,  Peter Stampka ,  Michael Huber ,  Josef Heitzer

IPC分类号： H05K500

CPC分类号： G06K19/07747 ,  G06K19/07743 ,  H01L2224/16

摘要： A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

摘要翻译： 智能卡模块包括导电地连接到形成有接触区域的金属引线框架的半导体芯片。 半导体芯片和接触区域通过设置在施加到半导体芯片的电绝缘保护层的表面上的连接区域导电接触。 该表面背离半导体芯片。 可以通过使用焊接接头或导电粘合剂粘合在连接区域和接触区域之间建立接触。 还提供了包括智能卡模块的智能卡。

公开(公告)号：US06719205B1

公开(公告)日：2004-04-13

申请号：US09333322

申请日：1999-06-15

申请人： Frank Püschner ,  Jürgen Fischer ,  Josef Heitzer

发明人： Frank Püschner ,  Jürgen Fischer ,  Josef Heitzer

IPC分类号： G06K1906

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48471 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.

摘要翻译： 用于半导体芯片的载体元件，特别是用于并入智能卡。 载体元件具有保护半导体芯片的封装组合物。 载体元件连接仅沿两个相对的边缘设置在封装组合物的一个主表面上。 它们由导电材料制成，并且在彼此面对的端部处具有减小的厚度，该截面仅在一侧具有台阶。 半导体芯片设置在厚度较小部分的区域中的连接处并机械连接到连接。

公开(公告)号：US06806562B2

公开(公告)日：2004-10-19

申请号：US10057127

申请日：2002-01-25

申请人： Bernd Barchmann ,  Erik Heinemann ,  Josef Heitzer ,  Frank Pueschner

发明人： Bernd Barchmann ,  Erik Heinemann ,  Josef Heitzer ,  Frank Pueschner

IPC分类号： H01L2302

CPC分类号： H01L21/563 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81898 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/113 ,  H05K3/325 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/209 ,  H01L2224/05639 ,  H01L2924/00014

摘要： A device having a semiconductor component and a printed circuit board are described. The semiconductor component has external contacts and the printed circuit board has contact terminals. The contact terminals display a central blind opening, into which the external contacts of the semiconductor component protrude and are in a force-locking engagement with the contact terminal areas. In the method of electromechanically connecting the two parts to form a device, after they have been aligned, the two components are merely pressed onto each other.

摘要翻译： 描述具有半导体部件和印刷电路板的器件。 半导体元件具有外部触点，并且印刷电路板具有接触端子。 接触端子显示中央盲孔，半导体部件的外部触点突出并且与接触端子区域形成力锁定接合。 在机电地连接两部分以形成装置的方法中，在它们对准之后，两个部件仅被压在彼此上。