公开(公告)号：US09818921B2

公开(公告)日：2017-11-14

申请号：US13703127

申请日：2011-06-10

申请人： Johann Ramchen ,  David Racz ,  Hans-Christoph Gallmeier ,  Stefan Grötsch ,  Simon Jerebic

发明人： Johann Ramchen ,  David Racz ,  Hans-Christoph Gallmeier ,  Stefan Grötsch ,  Simon Jerebic

IPC分类号： H01L29/227 ,  H01L33/60 ,  H01L33/46 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L31/0232 ,  H01L33/54 ,  H01L33/62 ,  H01L25/16 ,  H01L23/60

CPC分类号： H01L33/60 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/60 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L25/167 ,  H01L31/0232 ,  H01L33/46 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01079 ,  H01L2924/05032 ,  H01L2924/05432 ,  H01L2924/12036 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099

摘要： An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.

公开(公告)号：US20130200412A1

公开(公告)日：2013-08-08

申请号：US13703127

申请日：2011-06-10

申请人： Johann Ramchen ,  David Racz ,  Hans-Christoph Gallmeier ,  Stefan Grötsch ,  Simon Jerebic

发明人： Johann Ramchen ,  David Racz ,  Hans-Christoph Gallmeier ,  Stefan Grötsch ,  Simon Jerebic

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/60 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L25/167 ,  H01L31/0232 ,  H01L33/46 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01079 ,  H01L2924/05032 ,  H01L2924/05432 ,  H01L2924/12036 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099

摘要： An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.

摘要翻译： 光电子半导体部件包括载体和安装在载体顶部上的至少一个光电子半导体芯片。 所述半导体部件包括至少一个所述半导体芯片电接触的接合线，以及安装在所述主辐射侧并且突出超过所述接合线的至少一个覆盖体。 至少一个反射封装组件横向包围半导体芯片，并且至少延伸至半导体芯片的主辐射侧。 接合线完全被反射性灌封化合物覆盖，或完全由反射灌封料与覆盖体一起覆盖。

公开(公告)号：US08684540B2

公开(公告)日：2014-04-01

申请号：US13378308

申请日：2010-06-15

申请人： Stefan Grötsch ,  Simon Kocur ,  Matthias Sabathil

发明人： Stefan Grötsch ,  Simon Kocur ,  Matthias Sabathil

IPC分类号： G03B21/20 ,  G03B21/26 ,  F21V9/00 ,  F21V9/16 ,  F21V23/02

CPC分类号： H04N9/3111 ,  G03B21/2013 ,  G03B21/204 ,  G03B33/08 ,  H01L25/0756 ,  H01L27/15 ,  H01L33/22 ,  H01L33/382 ,  H01L2924/0002 ,  H04N9/3164 ,  H01L2924/00

摘要： An optical projection apparatus includes a first light source, a second light source, and an imaging element, which is illuminated by the first light source and the second light source during operation. The light source includes a light-emitting diode chip that emits red light during operation. The second light source includes a first light-emitting diode chip, which emits green light during operation. A second light-emitting diode chip emits blue light during operation. The second light-emitting diode chip is arranged on the first light-emitting diode chip at a radiation exit surface of the first light-emitting diode chip. Electromagnetic radiation generated in the first light-emitting diode chip during operation passes through the second light-emitting diode chip.

摘要翻译： 光学投影设备包括第一光源，第二光源和成像元件，其在操作期间由第一光源和第二光源照射。 光源包括在操作期间发出红光的发光二极管芯片。 第二光源包括在操作期间发出绿光的第一发光二极管芯片。 第二个发光二极管芯片在运行期间发出蓝光。 第二发光二极管芯片被布置在第一发光二极管芯片的第一发光二极管芯片的辐射出射表面处。 在操作中在第一发光二极管芯片中产生的电磁辐射通过第二发光二极管芯片。

公开(公告)号：US08154031B2

公开(公告)日：2012-04-10

申请号：US11885204

申请日：2006-02-10

申请人： Stefan Grötsch ,  Berthold Hahn ,  Stefan Illek ,  Wolfgang Schnabel

发明人： Stefan Grötsch ,  Berthold Hahn ,  Stefan Illek ,  Wolfgang Schnabel

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041

摘要： A module comprising a regular arrangement of individual radiation-emitting semiconductor bodies (1) which are applied on a mounting area (6) of a carrier (2), wherein a wire connection is fitted between two adjacent radiation-emitting semiconductor bodies (1) on a top side, opposite to the mounting area (6), of the two radiation-emitting semiconductor bodies (1).

摘要翻译： 一种模块，包括施加在载体（2）的安装区域（6）上的各个辐射发射半导体体（1）的规则排列，其中，线连接装配在两个相邻的发射辐射半导体体（1）之间， 在两个辐射发射半导体本体（1）的顶侧上与安装区域（6）相对。

公开(公告)号：US20100295073A1

公开(公告)日：2010-11-25

申请号：US12666557

申请日：2008-06-23

申请人： Stefan Grötsch ,  Norbert Linder

发明人： Stefan Grötsch ,  Norbert Linder

IPC分类号： H01L33/46

CPC分类号： H01L33/46 ,  H01L33/405 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/00014

摘要： An optoelectronic semiconductor chip (1) comprises a radiation passage area (3), a contact metallization (2a) applied to the radiation passage area (3), and a first reflective layer sequence (2b) applied to that surface of the contact metallization (2a) which is remote from the radiation passage area (3). An optoelectronic component comprising such a chip is also specified.

摘要翻译： 光电子半导体芯片（1）包括辐射通道区域（3），施加到辐射通道区域（3）的接触金属化（2a）和应用于接触金属化表面的第一反射层序列（2b） 2a），其远离辐射通道区域（3）。 还规定了包括这种芯片的光电子部件。

公开(公告)号：US20100230697A1

公开(公告)日：2010-09-16

申请号：US12673800

申请日：2008-08-11

申请人： Steffen Köhler ,  Moritz Engl ,  Frank Singer ,  Stefan Grötsch ,  Thomas Zeiler ,  Mathias Weiss

发明人： Steffen Köhler ,  Moritz Engl ,  Frank Singer ,  Stefan Grötsch ,  Thomas Zeiler ,  Mathias Weiss

IPC分类号： H01L33/48 ,  H01L33/60 ,  H01L21/50

CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2924/00

摘要： An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.

摘要翻译： 光电子半导体模块包括芯片载体，安装在芯片载体上的发光半导体芯片和具有至少部分透光的盖板的覆盖元件，该盖元件布置在半导体芯片背离芯片载体的一侧， 并且具有框架部分，其中横向包围半导体芯片的框架部分以接合层的方式接合到盖板并且在远离盖板的一侧与芯片载体相连接。

公开(公告)号：US07510890B2

公开(公告)日：2009-03-31

申请号：US10979359

申请日：2004-11-01

申请人： Hubert Ott ,  Stefan Grötsch ,  Herbert Brunner

发明人： Hubert Ott ,  Stefan Grötsch ,  Herbert Brunner

IPC分类号： H01L21/00

CPC分类号： H01L33/58 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method for producing a luminescence diode chip, in which provision is made of a semiconductor body is provided having an epitaxially grown semiconductor layer sequence having an active zone and a radiation coupling-out area, the active zone emitting an electromagnetic radiation during operation of the luminescence diode, a large part of said electromagnetic radiation being coupled out via the radiation coupling-out area. A luminescence conversion material is arranged downstream of the radiation coupling-out area in an emission direction of the semiconductor body. A radiation-transmissive covering body having a first main area, a second main area opposite to the first main area, and also side areas connecting the first and second main areas. The covering body is applied to the radiation coupling-out area of the semiconductor layer sequence in such a way that the first main area faces the radiation coupling-out area. The application of the covering body is preceded by the application of a first conversion layer, having a luminescence conversion material, to the first main area of the covering body.

摘要翻译： 提供一种制造发光二极管芯片的方法，其中提供具有半导体本体的外延生长的半导体层序列，其具有活性区和辐射耦合区域，所述有源区域在操作期间发射电磁辐射 发光二极管，所述电磁辐射的大部分经由辐射耦合输出区被耦合输出。 发光转换材料被布置在半导体本体的发射方向上的辐射耦合输出区域的下游。 具有第一主区域，与第一主区域相对的第二主区域以及连接第一主区域和第二主区域的侧面区域的辐射透射覆盖体。 将覆盖体施加到半导体层序列的辐射耦合出区域，使得第一主区域面向辐射耦合输出区域。 覆盖体的应用之前是将具有发光转换材料的第一转换层应用于覆盖体的第一主区域。

公开(公告)号：US07501660B2

公开(公告)日：2009-03-10

申请号：US11169861

申请日：2005-06-29

申请人： Josef Schmid ,  Stefan Grötsch ,  Michael Hiegler ,  Moritz Engl ,  Georg Bogner ,  Karlheinz Arndt ,  Markus Schneider

发明人： Josef Schmid ,  Stefan Grötsch ,  Michael Hiegler ,  Moritz Engl ,  Georg Bogner ,  Karlheinz Arndt ,  Markus Schneider

IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L31/0203 ,  H01L23/60 ,  H01L25/167 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).

摘要翻译： 为具有至少两个与壳体接触的连接部分（4a，4b）的电子部件规定了外壳。 壳体的至少子区域的电导率被设定为限定的方式，并且通过壳体的电流通路形成在连接部件之间。 因此，壳体具有与电子部件（1）并联连接的限定电阻（2），并为部件（1）提供ESD保护。

公开(公告)号：US07414269B2

公开(公告)日：2008-08-19

申请号：US10558461

申请日：2004-05-28

申请人： Stefan Grötsch ,  Patrick Kromotis

发明人： Stefan Grötsch ,  Patrick Kromotis

IPC分类号： H01L27/15 ,  H01L21/00

CPC分类号： F21K99/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier (1) and a reflector arrangement (2) disposed on said system carrier (1), the reflector arrangement comprising a number of reflectors each of which serves to receive at least one radiation-emitting component and which are fastened to one another by means of a holding device (4).

摘要翻译： 本发明提出了一种用于至少两个辐射发射部件（特别是LED）的壳体，其包括设置在所述系统载体（1）上的系统载体（1）和反射器装置（2），所述反射器装置包括多个反射器 其用于接收至少一个辐射发射部件，并且通过保持装置（4）彼此紧固。

公开(公告)号：US06835603B2

公开(公告)日：2004-12-28

申请号：US09932878

申请日：2001-08-20

申请人： Bruno Acklin ,  Stefan Grötsch

发明人： Bruno Acklin ,  Stefan Grötsch

IPC分类号： H01L2150

CPC分类号： H01S5/02476 ,  H01L21/4875 ,  H01L2224/48463 ,  H01S5/02272 ,  H01S5/4025

摘要： A method for producing semiconductor laser components in which, a number of chip mounting areas are formed on a cooling element having an electrically insulating carrier that is in the form of a plate. A number of semiconductor laser chips are then fit to the cooling element, with one semiconductor laser chip being arranged on each chip mounting area. Finally, the cooling element, with the semiconductor bodies fit on it, is subdivided into a number of semiconductor laser components.

摘要翻译： 一种制造半导体激光器部件的方法，其中在具有板状形式的电绝缘载体的冷却元件上形成有多个芯片安装区域。 然后将多个半导体激光芯片装配到冷却元件，在每个芯片安装区域上设置一个半导体激光器芯片。 最后，将半导体本体安装在其上的冷却元件被细分成多个半导体激光器部件。