公开(公告)号：US20110291260A1

公开(公告)日：2011-12-01

申请号：US12788110

申请日：2010-05-26

申请人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

发明人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

IPC分类号： H01L23/498 ,  C09J163/00 ,  H01L21/56

CPC分类号： H01L23/293 ,  C08K3/014 ,  C08K5/13 ,  C08L79/08 ,  C09J163/00 ,  H01L21/563 ,  H01L2224/73204 ,  H01L2224/83192 ,  C08K3/0041

摘要： A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

摘要翻译： 一种半导体封装胶粘剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）抗氧化剂。

公开(公告)号：US09024455B2

公开(公告)日：2015-05-05

申请号：US12788110

申请日：2010-05-26

申请人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

发明人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

IPC分类号： H01L23/29 ,  C09J163/00 ,  H01L21/56

CPC分类号： H01L23/293 ,  C08K3/014 ,  C08K5/13 ,  C08L79/08 ,  C09J163/00 ,  H01L21/563 ,  H01L2224/73204 ,  H01L2224/83192 ,  C08K3/0041

摘要： A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.

摘要翻译： 一种半导体封装胶粘剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）抗氧化剂。

公开(公告)号：US08674502B2

公开(公告)日：2014-03-18

申请号：US12838291

申请日：2010-07-16

申请人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

发明人： Kazutaka Honda ,  Tetsuya Enomoto ,  Yuuki Nakamura

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L21/563 ,  C08G59/42 ,  C08L63/00 ,  C09J163/00 ,  C09J163/04 ,  C09J179/08 ,  H01L23/293 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81805 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/05341 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator.

摘要翻译： 本发明涉及半导体封装胶粘剂，半导体封装膜状粘合剂，半导体装置的制造方法以及半导体装置。 本发明提供了包含（a）环氧树脂和（b）由与环氧树脂反应的有机酸和固化促进剂形成的化合物的半导体封装粘合剂。

公开(公告)号：US20120315062A1

公开(公告)日：2012-12-13

申请号：US13591543

申请日：2012-08-22

申请人： Tetsushi Uneme ,  Takahito Ueno ,  Yuuki Nakamura

发明人： Tetsushi Uneme ,  Takahito Ueno ,  Yuuki Nakamura

IPC分类号： G03G21/18

CPC分类号： G03G15/0812 ,  G03G21/1867

摘要： A cartridge detachably mountable to a main assembly of an electrophotographic image forming apparatus includes a developer carrying member for developing an electrostatic latent image formed on an image bearing member, and an electroconductive developer layer thickness regulating member for regulating a layer thickness of a developer deposited on the developer carrying member. A part of the developer layer thickness regulating member is directly contactable to the main assembly electrical contact.

摘要翻译： 可拆卸地安装到电子照相图像形成装置的主组件上的盒子包括用于显影形成在图像承载部件上的静电潜像的显影剂承载部件和用于调节沉积在图像承载部件上的显影剂的层厚度的导电显影剂层厚度调节部件 显影剂承载构件。 显影剂层厚度调节构件的一部分可直接接触主组件电接点。

公开(公告)号：US08232185B2

公开(公告)日：2012-07-31

申请号：US12594634

申请日：2008-03-31

申请人： Yuuki Nakamura ,  Tsutomu Kitakatsu ,  Youji Katayama ,  Keiichi Hatakeyama

发明人： Yuuki Nakamura ,  Tsutomu Kitakatsu ,  Youji Katayama ,  Keiichi Hatakeyama

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/46 ,  H01L21/78

CPC分类号： C09J201/00 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  B28D5/0082 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/73 ,  H01L24/83 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/29006 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： There is provided a method that allows semiconductor chips to be obtained from a semiconductor wafer at high yield, while sufficiently inhibiting generation of chip cracks and burrs. The method for manufacturing a semiconductor chip comprises a step of preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order, the semiconductor wafer being partitioned into multiple semiconductor chips and notches being formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction, and a step of stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5% and the tensile breaking elongation of less than 110% of the elongation at maximum load.

摘要翻译： 提供了一种允许以高产率从半导体晶片获得半导体芯片的方法，同时充分抑制了芯片裂纹和毛刺的产生。 制造半导体芯片的方法包括制备具有半导体晶片的层叠体，半导体用粘合膜和切割带，其顺序层叠，将半导体晶片划分成多个半导体芯片，并由半导体形成沟槽 使得至少一部分用于半导体的粘合膜在其厚度方向上保持未切割，并且在使多个半导体芯片分开的方向上伸出切割带的步骤，以分离用于 沿着凹口的半导体。 半导体用粘合膜的拉伸断裂伸长率小于5％，拉伸断裂伸长率小于最大载荷下伸长率的110％。

公开(公告)号：US08180251B2

公开(公告)日：2012-05-15

申请号：US12912016

申请日：2010-10-26

申请人： Yuuki Nakamura ,  Yoshifumi Takeyama

发明人： Yuuki Nakamura ,  Yoshifumi Takeyama

IPC分类号： G03G21/18 ,  G03G15/02 ,  G03G15/08 ,  G03G15/00

CPC分类号： G03G21/1828

摘要： An electrophotographic image forming apparatus detachably mountable to a main assembly of the apparatus, includes a rotatable image bearing member on which a latent image is to be formed; charging means for contacting said image bearing member to charge a surface of said image bearing member; a frame supporting said image bearing member and said charging means; a covering member, demountably mounted to said frame, for protecting the surface of said image bearing member; and a spacer member including a spacing portion, movably provided on said covering member, for entering between said image bearing member and said charging means to space them therebetween, and a retaining portion, contacting said covering member when said spacing portion is not between said image bearing member and said charging means, for preventing said spacer member from disengaging from said covering member.

摘要翻译： 可拆卸地安装到装置的主组件上的电子照相图像形成装置包括可在其上形成潜像的可旋转图像承载构件; 用于接触所述图像承载部件以对所述图像承载部件的表面充电的充电装置; 支撑所述图像承载部件和所述充电装置的框架; 可拆卸地安装到所述框架的用于保护所述图像承载部件的表面的覆盖部件; 以及间隔部件，包括可移动地设置在所述覆盖部件上的间隔部分，用于进入所述图像承载部件和所述充电装置之间以将它们间隔开;以及保持部分，当所述间隔部分不在所述图像之间时与所述覆盖部件接触 轴承构件和所述充电装置，用于防止所述间隔构件从所述覆盖构件脱离。

公开(公告)号：US20110210407A1

公开(公告)日：2011-09-01

申请号：US13060670

申请日：2009-08-25

申请人： Youji Katayama ,  Yuuki Nakamura ,  Masanobu Miyahara ,  Koichi Kimura ,  Tsutomu Kitakatsu

发明人： Youji Katayama ,  Yuuki Nakamura ,  Masanobu Miyahara ,  Koichi Kimura ,  Tsutomu Kitakatsu

IPC分类号： H01L29/66 ,  B32B7/12 ,  H01L23/58

CPC分类号： H01L24/83 ,  C08G73/1046 ,  C08G73/14 ,  C09J7/20 ,  C09J179/08 ,  C09J2201/134 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2479/08 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29386 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2924/00013 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2874 ,  Y10T428/2878 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00

摘要： A double-faced adhesive film including: a supporting film; a first adhesive layer laminated on one surface of the supporting film; and a second adhesive layer laminated on the other surface of the supporting film, wherein the glass transition temperatures, after curing, of the first adhesive layer and the second adhesive layer are each 100° C. or lower, and the first adhesive layer and the second adhesive layer are the layers capable of being formed by a method including the steps of directly applying a varnish to the supporting film and drying the applied varnish.

摘要翻译： 一种双面粘合膜，包括：支撑膜; 层压在所述支撑膜的一个表面上的第一粘合剂层; 以及层叠在所述支撑膜的另一个表面上的第二粘合剂层，其中所述第一粘合层和所述第二粘合层的固化后的玻璃化转变温度各自为100℃以下，所述第一粘合层和 第二粘合剂层是能够通过包括以下步骤形成的层：将清漆直接涂布到支撑膜上并干燥涂布的清漆。

公开(公告)号：US20100112783A1

公开(公告)日：2010-05-06

申请号：US12594847

申请日：2008-03-31

申请人： Yuuki Nakamura ,  Tsutomu Kitakatsu ,  Youji Katayama ,  Keiichi Hatakeyama

发明人： Yuuki Nakamura ,  Tsutomu Kitakatsu ,  Youji Katayama ,  Keiichi Hatakeyama

IPC分类号： H01L21/78 ,  B32B7/12 ,  C08G77/26 ,  C08L83/08

CPC分类号： C09J183/10 ,  C08G73/106 ,  C08G77/26 ,  C08G77/452 ,  C09D183/08 ,  C09J179/08 ,  C09J183/08 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/296 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/274 ,  H01L2224/29006 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  Y10T428/2826 ,  Y10T428/2896 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： There is provided an adhesive film for a semiconductor, which can be attached to a semiconductor wafer at low temperature and which allows semiconductor chips to be obtained at high yield from the semiconductor wafer while sufficiently inhibiting generation of chip cracks and burrs. The adhesive film for a semiconductor comprises a polyimide resin that can be obtained by reaction between a tetracarboxylic dianhydride containing 4,4′-oxydiphthalic dianhydride represented by chemical formula (I) below and a diamine containing a siloxanediamine represented by the following general formula (II) below, and that can be attached to a semiconductor wafer at 100° C. or below.

摘要翻译： 提供了一种用于半导体的粘合膜，其可以在低温下附着到半导体晶片，并且允许从半导体晶片以高产率获得半导体芯片，同时充分抑制芯片裂纹和毛刺的产生。 半导体用粘合膜包括聚酰亚胺树脂，其可以通过以下化学式（I）表示的含有4,4'-氧联二邻苯二甲酸二酐的四羧酸二酐和由以下通式（II）表示的含有硅氧烷二胺的二胺 ），并且可以在100℃或更低温度下连接到半导体晶片。

公开(公告)号：US5236784A

公开(公告)日：1993-08-17

申请号：US876979

申请日：1992-05-01

申请人： Toshihiro Kobayashi ,  Tokuhisa Tsutsui ,  Yuuki Nakamura

发明人： Toshihiro Kobayashi ,  Tokuhisa Tsutsui ,  Yuuki Nakamura

IPC分类号： F16C33/16 ,  F16C33/20

CPC分类号： F16C33/201 ,  F16C33/16 ,  F16C33/20 ,  Y10S384/907 ,  Y10S384/908 ,  Y10S384/909 ,  Y10S384/91 ,  Y10T428/25 ,  Y10T428/30 ,  Y10T428/31678

摘要： A bearing material mainly comprising plastics and a plastic bearing made thereof. The bearing material is composed of 30 to 98 wt % of glassy carbon and 70 to 2 wt % of plastics, and has persistent, excellent abrasion resistance, sliding properties, and heat resistance.

摘要翻译： 主要包括塑料的轴承材料和由其制成的塑料轴承。 轴承材料由30〜98重量％的玻璃碳和70〜2重量％的塑料构成，具有持久的，优异的耐磨性，滑动性和耐热性。

公开(公告)号：US08687994B2

公开(公告)日：2014-04-01

申请号：US12546136

申请日：2009-08-24

申请人： Yuuki Nakamura ,  Takahito Ueno

发明人： Yuuki Nakamura ,  Takahito Ueno

IPC分类号： G03G15/00

CPC分类号： G03G15/0896 ,  G03G21/1652 ,  G03G2221/166

摘要： A cartridge detachably mountable to a main assembly of an image forming apparatus, the main assembly including a main assembly electrical contact, includes a roller including an electroconductive shaft, the roller being rotatable with the shaft; and a supporting member rotatably supporting the shaft and provided with a hole portion for exposing a part of a surface of a longitudinal end of the shaft to directly contact the part to the main assembly electrical contact and an end surface positioning portion for determining a position of the end surface with respect to a longitudinal direction of the shaft by contacting another part of the end surface.

摘要翻译： 一种可拆卸地安装到图像形成设备的主组件的盒，所述主组件包括主组件电接触件，包括包括导电轴的辊，所述辊可与所述轴一起旋转; 以及支撑构件，其可旋转地支撑所述轴并且设置有孔部分，用于暴露所述轴的纵向端部的表面的一部分以将所述部分直接接触所述主组件电接触件;以及端面定位部分，用于确定 所述端面相对于所述轴的纵向方向通过接触所述端表面的另一部分。