公开(公告)号：US5050446A

公开(公告)日：1991-09-24

申请号：US146349

申请日：1988-01-21

申请人： Kazutoshi Takashima ,  Hiroaki Fujimoto ,  Masaki Okazaki

发明人： Kazutoshi Takashima ,  Hiroaki Fujimoto ,  Masaki Okazaki

IPC分类号： F16F15/12 ,  F16F15/124 ,  F16F15/126 ,  F16F15/136 ,  F16F15/14 ,  F16F15/167 ,  F16F15/173

CPC分类号： F16F15/124 ,  F16F15/1442 ,  F16F15/167 ,  F16F15/173 ,  Y10T464/50

摘要： Several embodiments of combined torsional and elastic couplings for transmitting power from an engine output shaft that experiences torque fluctuations and a driveshaft. In each embodiment, the flexible coupling includes an inertial member that is coupled either elastically or by means of a viscous body to the engine output shaft for absorbing the torsional vibrations. In addition, an elastic coupling couples the engine output shaft to the driveshaft for permitting limited relative rotation to absorb torque flux variations in the engine output shaft.

摘要翻译： 用于从经受扭矩波动的发动机输出轴和驱动轴传递动力的组合的扭转和弹性联轴器的几个实施例。 在每个实施例中，柔性联轴器包括惯性构件，该惯性构件弹性地或通过粘性体耦合到发动机输出轴以吸收扭转振动。 此外，弹性联轴器将发动机输出轴连接到驱动轴，以允许有限的相对旋转以吸收发动机输出轴中的扭矩磁通变化。

公开(公告)号：US07005310B2

公开(公告)日：2006-02-28

申请号：US10651087

申请日：2003-08-29

申请人： Kenji Hanada ,  Masaki Nakanishi ,  Tomoo Matsuzawa ,  Koji Shida ,  Kazutoshi Takashima

发明人： Kenji Hanada ,  Masaki Nakanishi ,  Tomoo Matsuzawa ,  Koji Shida ,  Kazutoshi Takashima

IPC分类号： H01L21/00 ,  H04N5/225

CPC分类号： H01L24/97 ,  H01L24/45 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/01029 ,  H01L2924/12043 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/10977 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.

摘要翻译： 传感器芯片和容纳在其中的传感器芯片的透镜架安装在布线基板的表面上，并且在其中容纳透镜的透镜架与透镜安装座联接。 在布线基板的后表面上安装有逻辑芯片，存储芯片和无源部件，并用密封树脂密封。 传感器芯片的电极焊盘通过接合线电连接到布线基板的表面上的电极，但是在布线基板的表面上的电极上还形成有凸块，并且该凸块与接合 线。 在布线基板的表面上，用各向异性导电膜和接合材料粘结柔性基板。 当制造相机模块时，在组装布线基板的背面侧之后组装布线基板的表面侧。

公开(公告)号：US4857023A

公开(公告)日：1989-08-15

申请号：US155209

申请日：1988-02-12

申请人： Kazutoshi Takashima

发明人： Kazutoshi Takashima

IPC分类号： B63H21/38 ,  F01P5/12 ,  F01P11/02

CPC分类号： F01P5/12 ,  F01P11/02 ,  B63B2770/00

摘要： An arrangement for purging the cooling jacket of a marine engine from coolant when the engine is stopped. The system comprises an electrically operated pump that is operated for a predetermined period of time once the engine is shut off so as to purge the cooling jacket.

摘要翻译： 当发动机停止时，用于从冷却剂清洗船用发动机的冷却套的装置。 该系统包括电动泵，其在发动机关闭之后被操作预定时间段，以便吹扫冷却套。

公开(公告)号：US20050250254A1

公开(公告)日：2005-11-10

申请号：US11178423

申请日：2005-07-12

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

公开(公告)号：US5513608A

公开(公告)日：1996-05-07

申请号：US112442

申请日：1993-08-26

申请人： Kazutoshi Takashima ,  Tomohiro Kanamaru

发明人： Kazutoshi Takashima ,  Tomohiro Kanamaru

IPC分类号： F01M1/02 ,  F01M1/10 ,  F01M3/00 ,  F02B61/04 ,  F02B75/02 ,  F02B75/22 ,  F01L3/00

CPC分类号： F01M1/02 ,  F01M3/00 ,  F01M1/10 ,  F02B2075/025 ,  F02B61/045 ,  F02B75/22 ,  F02F2200/06

摘要： A lubricating system for a reciprocating machine such as a two cycle internal combustion engine having the cylinder bores horizontally disposed. A drain system is provided for draining lubricant from the lowermost crankcase chambers to the upper cylinders so as to maintain uniformity of lubrication and insure even and smooth running. A check valve is provided for precluding reverse flow and the lubricant is delivered both to the crankcase chambers and to the piston through either the piston and/or cylinder liner. The lubricant supplied to the piston is supplied at its upper area so as to insure complete lubrication of its circumference and of the associated cylinder bore.

摘要翻译： 用于往复运动机械的润滑系统，例如具有水平设置的气缸孔的两循环内燃机。 提供一种排水系统，用于将润滑剂从最下面的曲轴箱室排出到上部气缸，以保持润滑的均匀性，并保证平稳运行。 提供止回阀以防止反向流动，并且润滑剂通过活塞和/或气缸套被输送到曲轴箱室和活塞。 提供给活塞的润滑剂在其上部区域供应，以确保其圆周和相关气缸孔的完全润滑。

公开(公告)号：US5067453A

公开(公告)日：1991-11-26

申请号：US578934

申请日：1990-09-07

申请人： Kazutoshi Takashima

发明人： Kazutoshi Takashima

IPC分类号： F01M1/08 ,  F02B25/14 ,  F02B75/02 ,  F02F1/22 ,  F02F3/00 ,  F16J1/08

CPC分类号： F02F3/00 ,  F02B25/14 ,  F02F1/22 ,  F01M2001/086 ,  F02B2075/025 ,  F02F2200/04 ,  F05C2203/0808 ,  F05C2253/16

摘要： Two embodiments of piston constructions for two-cycle, crankcase compression, internal combustion engines wherein the piston is formed with a blow by passage so that blow by gases escaping past the piston rings will not pass across the skirt portion of the piston to deteriorate the lubricant thereon. In one embodiment, holes formed in the piston permit the blow by gases to flow into the interior of the piston and in another embodiment, the piston pin boss is formed with a relief that permits the blow by gases to exit through one of the scavenge passages.

摘要翻译： 用于双循环曲轴箱压缩的内燃机的活塞结构的两个实施例，其中活塞通过通道形成吹气，以便通过气体逸出的活塞环的吹气不会穿过活塞的裙部，从而使润滑剂变坏 上。 在一个实施例中，形成在活塞中的孔允许气体吹入流入活塞的内部，并且在另一个实施例中，活塞销凸起形成有浮雕，允许气体吹动通过其中一个清扫通道 。

公开(公告)号：US06946306B2

公开(公告)日：2005-09-20

申请号：US10983689

申请日：2004-11-09

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

摘要翻译： 公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。 半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。 作为在矩阵基板（27）的检查中被判断为有缺陷的块，在布线基板（2）上附着缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e） 并且省略其上具有缺陷标记（2e）的布线基板（2）的组装工作以实现生产线的合理化。

公开(公告)号：US06852553B2

公开(公告)日：2005-02-08

申请号：US10129305

申请日：2001-02-15

申请人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

发明人： Akio Ishizu ,  Kazutoshi Takashima ,  Shiro Oba ,  Yoshihiko Kobayashi ,  Tsutomu Ida ,  Shigeru Haga ,  Susumu Takada ,  Iwamichi Koujiro ,  Norinaga Arai ,  Yuji Kakegawa

IPC分类号： G01R31/26 ,  H01L21/50 ,  H01L21/58 ,  H01L21/66 ,  H01L21/98 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/544 ,  H01L25/16 ,  H01L21/00 ,  H01L21/44

CPC分类号： H01L22/20 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/50 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

摘要翻译： 公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。 半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。 作为在矩阵基板（27）的检查中被判定为有缺陷的块，在布线基板（2）上附着有缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e） 省略了具有缺陷标记（2e）的布线基板（2）的组装工作，以实现生产线的合理化。

公开(公告)号：US6131503A

公开(公告)日：2000-10-17

申请号：US220513

申请日：1998-12-24

申请人： Kazutoshi Takashima

发明人： Kazutoshi Takashima

IPC分类号： F02B17/00 ,  F02B23/10 ,  F02B61/04 ,  F02B75/02 ,  F02B75/18 ,  F02B75/22 ,  F02F3/00 ,  F02F5/00 ,  F16J9/00 ,  F16J9/20 ,  F16J9/22 ,  F16J1/00

CPC分类号： F16J9/22 ,  F02B61/045 ,  F02B75/22 ,  F16J9/20 ,  F02B2075/025 ,  F02B2075/1824 ,  F02B23/101 ,  F05C2251/042

摘要： A piston and piston ring assembly has a compression ring and a compression ring groove configured to allow proper mating between the two following thermal expansion. The groove is provided with a substantially horizontal lower face. The ring has a bottom surface that is contoured to provide a cross-sectional angle that substantially matches the anticipated deflection of the lower face caused by thermal expansion. Thus, when the piston expands due to temperature changes associated with operating the internal combustion engine, the lower face deflects away from the combustion chamber. The deflection is absorbed by the pre-contoured bottom surface of the ring. Thus, localized high points between the piston ring and the piston ring groove are reduced and the friction originating at such locations is also reduced. Accordingly, the ring and the groove experience reduced friction and reduced wear while the sealing function of the compression ring is enhanced.

摘要翻译： 活塞和活塞环组件具有压缩环和压缩环槽，所述压缩环和压缩环槽被配置成允许在两个随后的热膨胀之间适当配合。 槽设置有大致水平的下表面。 环具有底部表面，该底部表面具有轮廓，以提供基本上匹配由热膨胀引起的下表面的预期挠曲的横截面角度。 因此，当活塞由于与操作内燃机的温度变化而膨胀时，下表面偏离燃烧室。 偏转由环的预轮廓底表面吸收。 因此，活塞环和活塞环槽之间的局部高点减小，并且在这些位置产生的摩擦力也降低。 因此，当压缩环的密封功能增强时，环和凹槽经历减小的摩擦并减少磨损。

公开(公告)号：US4485957A

公开(公告)日：1984-12-04

申请号：US382105

申请日：1982-05-26

申请人： Tatsuo Sugimoto ,  Seiji Shigyo ,  Kazutoshi Takashima ,  Yuichi Komaba

发明人： Tatsuo Sugimoto ,  Seiji Shigyo ,  Kazutoshi Takashima ,  Yuichi Komaba

IPC分类号： H01L21/66 ,  B23K20/00 ,  H01L21/60 ,  H01R43/02 ,  B23K37/00

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L24/78 ,  H01R43/02 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/19043

摘要： A wire bonder is frequently used for assembling the electronic parts of a semiconductor device or the like and exhibits an effect in the electric connections of the aforementioned electronic parts with a fine metal wire. The wire bonder according to the present invention comprises a clamper for clamping a bonding wire, and bonding wire disconnection detecting means for detecting the disconnection of the bonding wire in terms of the wire clamping state of the clamper. In order to detect highly accurately and reliably the disconnection of the bonding wire, the aforementioned bonding wire disconnection detecting means is characterized by the provision of a detecting unit for detecting a quantity which corresponds to the facing gap of the clamper during the clamping operation.

摘要翻译： 通常使用引线接合器来组装半导体器件等的电子部件，并且在上述电子部件与细金属丝的电连接中具有效果。 根据本发明的引线接合器包括用于夹紧接合线的夹持器，以及用于检测在夹持器的线夹紧状态方面的接合线断开的接合线断线检测装置。 为了高精度地和可靠地检测接合线的断开，上述接合线切断检测单元的特征在于，设置检测单元，用于在夹紧操作期间检测对应于夹持器的相对间隙的量。