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公开(公告)号:US07910406B2
公开(公告)日:2011-03-22
申请号:US12066534
申请日:2006-10-19
IPC分类号: H01L21/00
CPC分类号: H01L24/50 , H01L21/565 , H01L21/568 , H01L23/3107 , H01L23/49524 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0652 , H01L25/16 , H01L2224/32145 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/8385 , H01L2224/85001 , H01L2224/85201 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the semiconductor element and supporting the connecting conductors integrally. The semiconductor element is buried in the insulating resin, and terminal surfaces of the external connection terminals are exposed from the insulating resin.
摘要翻译: 电子电路装置包括至少一个半导体元件,多个外部连接端子,电连接半导体元件和外部连接端子的连接导体,以及覆盖半导体元件并将连接导体一体地支撑的绝缘树脂。 半导体元件被埋在绝缘树脂中,外部连接端子的端子表面从绝缘树脂露出。
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公开(公告)号:US20090267214A1
公开(公告)日:2009-10-29
申请号:US12066534
申请日:2006-10-19
IPC分类号: H01L25/065 , H01L23/52 , H01L21/56 , H01L23/12 , H01L25/07
CPC分类号: H01L24/50 , H01L21/565 , H01L21/568 , H01L23/3107 , H01L23/49524 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0652 , H01L25/16 , H01L2224/32145 , H01L2224/37147 , H01L2224/37599 , H01L2224/40137 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/8385 , H01L2224/85001 , H01L2224/85201 , H01L2924/01013 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: The electronic circuit device of the present invention includes at least one semiconductor element, a plurality of external connection terminals, a connecting conductor for electrically connecting semiconductor element and external connection terminals, and an insulating resin for covering the semiconductor element and supporting the connecting conductor integrally, in which the semiconductor element is buried in the insulating resin, and the terminal surface of the external connection terminals is exposed from the insulating resin.
摘要翻译: 本发明的电子电路装置包括至少一个半导体元件,多个外部连接端子,用于电连接半导体元件和外部连接端子的连接导体,以及用于覆盖半导体元件并将连接导体一体地支撑的绝缘树脂 其中半导体元件埋在绝缘树脂中,并且外部连接端子的端子表面从绝缘树脂露出。
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公开(公告)号:US20080150133A1
公开(公告)日:2008-06-26
申请号:US11722925
申请日:2005-12-28
IPC分类号: H01L23/488 , H01L21/60
CPC分类号: H01L24/13 , H01L24/17 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/10135 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/17517 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81139 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2225/06517 , H01L2225/06527 , H01L2225/06593 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.
摘要翻译: 实现了半导体芯片与电路基板之间的连接可靠性更高的半导体芯片双面组件。 这通过包括设置在基板上表面(1a)上的多个上侧焊盘(2a)的组件实现; 多个下侧焊盘(2b)分别设置在跨过衬底(1)的与上侧焊盘(2a)相对应的衬底下表面(1b)上; 第一半导体芯片(4)分别具有接合到所述上侧焊盘(2a)的第一凸起(8a); 以及第二半导体芯片(5),其具有分别与下侧焊盘(2b)接合的第二凸起(8b)。
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公开(公告)号:US08035225B2
公开(公告)日:2011-10-11
申请号:US11722925
申请日:2005-12-28
IPC分类号: H01L23/52
CPC分类号: H01L24/13 , H01L24/17 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/10135 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/16225 , H01L2224/17517 , H01L2224/32225 , H01L2224/73204 , H01L2224/81136 , H01L2224/81139 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2225/06517 , H01L2225/06527 , H01L2225/06593 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.
摘要翻译: 实现了半导体芯片与电路基板之间的连接可靠性更高的半导体芯片双面组件。 这通过包括设置在基板上表面(1a)上的多个上侧焊盘(2a)的组件实现; 多个下侧焊盘(2b)分别设置在跨越衬底(1)的与上侧衬垫(2a)相对应的衬底下表面(1b)上; 第一半导体芯片(4),其具有分别与上侧焊盘(2a)接合的第一凸起(8a) 以及第二半导体芯片(5),其具有分别与下侧焊盘(2b)接合的第二凸起(8b)。
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公开(公告)号:US20100084762A1
公开(公告)日:2010-04-08
申请号:US12279915
申请日:2007-04-18
申请人: Hidenobu Nishikawa , Daido Komyoji , Atsunobu Iwamoto , Hiroyuki Yamada , Shuichi Takeda , Shigeru Kondou
发明人: Hidenobu Nishikawa , Daido Komyoji , Atsunobu Iwamoto , Hiroyuki Yamada , Shuichi Takeda , Shigeru Kondou
IPC分类号: H01L23/52 , G06K19/077
CPC分类号: H05K1/0271 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/19105 , H05K3/284 , H05K2201/09036 , H05K2201/09063 , H05K2201/10674 , H01L2924/00014 , H01L2924/00
摘要: Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).
摘要翻译: 存储卡(1)至少包括半导体芯片(3),具有安装在主表面(21)上的半导体芯片(3)的电路板(2),至少具有形成在主表面(21)中的刚性减小部分(23)或 在与所述主表面相对的表面(22)的直线区域中,以及用于覆盖电路板(2)的主表面(21)上的半导体芯片(3)的盖部分(71),其中电路板(2)具有多个 由刚性减小部分(23)向主表面(21)弯曲成凸形的凸区域(201)。
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公开(公告)号:US08599571B2
公开(公告)日:2013-12-03
申请号:US12279915
申请日:2007-04-18
申请人: Hidenobu Nishikawa , Daido Komyoji , Atsunobu Iwamoto , Hiroyuki Yamada , Shuichi Takeda , Shigeru Kondou
发明人: Hidenobu Nishikawa , Daido Komyoji , Atsunobu Iwamoto , Hiroyuki Yamada , Shuichi Takeda , Shigeru Kondou
CPC分类号: H05K1/0271 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/19105 , H05K3/284 , H05K2201/09036 , H05K2201/09063 , H05K2201/10674 , H01L2924/00014 , H01L2924/00
摘要: Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).
摘要翻译: 存储卡(1)至少包括半导体芯片(3),具有安装在主表面(21)上的半导体芯片(3)的电路板(2),至少具有形成在主表面(21)中的刚性减小部分(23)或 在与所述主表面相对的表面(22)的直线区域中,以及用于覆盖电路板(2)的主表面(21)上的半导体芯片(3)的盖部分(71),其中电路板(2)具有多个 由刚性减小部分(23)向主表面(21)弯曲成凸形的凸区域(201)。
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公开(公告)号:US08125786B2
公开(公告)日:2012-02-28
申请号:US12160301
申请日:2007-01-26
申请人: Hidenobu Nishikawa , Daido Komyoji , Hiroyuki Yamada , Yutaka Nakamura , Shuichi Takeda , Yasuharu Kikuchi
发明人: Hidenobu Nishikawa , Daido Komyoji , Hiroyuki Yamada , Yutaka Nakamura , Shuichi Takeda , Yasuharu Kikuchi
IPC分类号: H05K1/14
CPC分类号: G06K19/077 , G06K19/07732 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/19105 , H05K1/0275 , H05K3/284 , H05K2201/10151 , H05K2201/10159 , H01L2924/00
摘要: Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.
摘要翻译: 存储卡包括电路板,安装在电路板的主面上的部件,至少覆盖电路板的主面和部件的壳体,以及保持在设置在壳体上的粗糙区域中的苦味剂或暴露部分 电路板。
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公开(公告)号:US20090173795A1
公开(公告)日:2009-07-09
申请号:US12160541
申请日:2007-02-26
申请人: Shozo Ochi , Osamu Uchida , Shigeaki Sakatani , Daisuke Sakurai , Masato Mori , Hiroshi Sakurai , Hidenobu Nishikawa
发明人: Shozo Ochi , Osamu Uchida , Shigeaki Sakatani , Daisuke Sakurai , Masato Mori , Hiroshi Sakurai , Hidenobu Nishikawa
IPC分类号: G06K19/077 , H01Q1/38 , H01Q7/00 , H05K3/00
CPC分类号: H01Q1/22 , G06K19/07732 , G06K19/07749 , H01Q7/06 , H05K1/0218 , H05K1/144 , H05K1/148 , H05K1/16 , H05K2201/043 , H05K2201/086 , Y10T29/4913
摘要: Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.
摘要翻译: 卡类型信息装置包括具有安装在布线板的第一面上的电子部件和天线连接电极的布线图案的布线板,天线板天线阵列与天线端子电极形成在天线板的第一面上,磁性材料放置 在布线板和天线板之间,用于将天线连接电极耦合到天线端子电极的柔性布线板和用于容纳布线板,天线板,磁性材料和柔性布线板的壳体。 接线板和天线板由同一个绝缘母板制成。
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公开(公告)号:US20090009976A1
公开(公告)日:2009-01-08
申请号:US12160301
申请日:2007-01-26
申请人: Hidenobu Nishikawa , Daido Komyoji , Hiroyuki Yamada , Yutaka Nakamura , Shuichi Takeda , Yasuharu Kikuchi
发明人: Hidenobu Nishikawa , Daido Komyoji , Hiroyuki Yamada , Yutaka Nakamura , Shuichi Takeda , Yasuharu Kikuchi
IPC分类号: H05K1/14
CPC分类号: G06K19/077 , G06K19/07732 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/19105 , H05K1/0275 , H05K3/284 , H05K2201/10151 , H05K2201/10159 , H01L2924/00
摘要: Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.
摘要翻译: 存储卡包括电路板,安装在电路板的主面上的部件,至少覆盖电路板的主面和部件的壳体,以及保持在设置在壳体上的粗糙区域中的苦味剂或暴露部分 电路板。
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公开(公告)号:US08007627B2
公开(公告)日:2011-08-30
申请号:US11064122
申请日:2005-02-23
CPC分类号: H01L24/31 , H01L21/563 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/2949 , H01L2224/29499 , H01L2224/32225 , H01L2224/45144 , H01L2224/48624 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/78301 , H01L2224/81048 , H01L2224/81191 , H01L2224/81801 , H01L2224/81903 , H01L2224/83048 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83856 , H01L2224/9211 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H05K3/323 , Y10T29/4913 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip is corrected and the board is connected, the bumps are compressed, and the insulating resin is hardened.
摘要翻译: 芯片通过在位置凸块与板电极之间对准而在电路板上粘合,在芯片和电路板之间插入各向异性导电层。 各向异性导电层是绝缘树脂,导电颗粒和无机填料的混合物。 利用工具,以每个凸起不超过20gf的压力将该芯片压靠在板上,同时校正芯片的翘曲并且板被连接,凸块被压缩,并且绝缘树脂硬化。
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