摘要:
The electronic circuit device of the present invention includes at least one semiconductor element, a plurality of external connection terminals, a connecting conductor for electrically connecting semiconductor element and external connection terminals, and an insulating resin for covering the semiconductor element and supporting the connecting conductor integrally, in which the semiconductor element is buried in the insulating resin, and the terminal surface of the external connection terminals is exposed from the insulating resin.
摘要:
An electronic circuit device includes at least one semiconductor element, a plurality of external connection terminals, connecting conductors electrically connecting the semiconductor element and external connection terminals, and an insulating resin covering the semiconductor element and supporting the connecting conductors integrally. The semiconductor element is buried in the insulating resin, and terminal surfaces of the external connection terminals are exposed from the insulating resin.
摘要:
A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.
摘要:
A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.
摘要:
While bumps formed on pads of a semiconductor chip and a board having a sheet-like seal-bonding resin stuck on its surface are set face to face, the bumps and the board are pressed to each other with a tool, thereby forming a semiconductor chip mounted structure in which the seal-bonding resin is filled between the semiconductor chip and the board and in which the pads of the semiconductor chip and the electrodes of the board are connected to each other via the bumps, respectively. Entire side faces at corner portions of the semiconductor chip are covered with the seal-bonding resin. Therefore, loads generated at the corner portions due to board flexures for thermal expansion and contraction differences among the individual members caused by heating and cooling during mounting as well as for mechanical loads after mounting so that internal breakdown of the semiconductor chip can be avoided.
摘要:
A semiconductor chip (1) is flip-chip mounted on a circuit board (4) with an underfill resin (6) interposed between the semiconductor chip (1) and the circuit board (4) and a container covering the semiconductor chip (1) is bonded on the circuit board (4). At this point, the semiconductor chip (1) positioned with the underfill resin (6) interposed between the circuit board (4) and the semiconductor chip (1) is pressed and heated by a pressure-bonding tool (8); meanwhile, the surface of the underfill resin (6) protruding around the semiconductor chip (1) is pressed by the pressure-bonding tool (8) through a film (13) on which a surface unevenness is formed in a periodically repeating pattern, so that a surface unevenness (16a) is formed. The inner surface of the container covering the semiconductor chip (1) is bonded to the surface unevenness (16a) on the surface of the underfill resin.
摘要:
An electronic component, in which the outer perimeter portion of a component (2) is surrounded with a first sealing resin (4), a second sealing resin (3) is filled within the periphery of the first sealing resin (4), the component (2) and a board (1) are electrically connected by a wire (5), the edge, in the vicinity of which the wire (5) passes, of the outer perimeter edge portions of the component (2) is formed to be a chamfered oblique surface (31), and the wire (5) is provided to extend to the board (1) along the oblique surface (31). By this means, the overall height of the electronic component can be kept low.
摘要:
A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.
摘要:
A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.
摘要:
The present invention provides a semiconductor device of a double-side mounting structure including a circuit board and a plurality of semiconductor chips arranged and joined together on the opposite surfaces of the circuit board, wherein in an area in which the semiconductor chip 31 mounted on the top surface of the circuit board 2 overlaps with the semiconductor chip 32 mounted on the bottom surface of the circuit board 2, a recess portion 21 (or a protruding portion 22) is formed in the surfaces of the circuit board 2.