公开(公告)号：US06291267B1

公开(公告)日：2001-09-18

申请号：US09418940

申请日：1999-10-15

申请人： Kevin A. Dore ,  David L. Edwards

发明人： Kevin A. Dore ,  David L. Edwards

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L24/28 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/00

摘要： A process for underfilling a chip-under-chip module. The module comprises a first larger chip, a second smaller chip attached to the underside of the first chip, a substrate having a top surface to which the first chip is mounted, a cavity into which the second chip fits when the first chip is mounted on the top surface, and an access channel connecting the cavity to the top surface. Underfill is disposed under the first chip between the first chip and the substrate, between the first and second chips, within the cavity, and within the access channel. The process for underfilling such a module comprises the steps of forming the substrate having the cavity and access channel in the substrate, connecting the first chip to the substrate, and dispensing underfill through the access channel.

摘要翻译： 一种用于在芯片下芯片模块下进行底部填充的工艺。 该模块包括第一较大的芯片，附接到第一芯片的下侧的第二较小芯片，具有安装第一芯片的顶表面的基板，当第一芯片安装在其上时第二芯片配合的空腔 顶表面，以及将空腔连接到顶表面的通道。 底部填充物设置在第一芯片与第一芯片之间的第一芯片和第二芯片之间，第一芯片和第二芯片之间，腔内，以及存取通道内。 用于底部填充这种模块的方法包括以下步骤：在衬底中形成具有空腔和通道的衬底，将第一芯片连接到衬底，以及通过接入通道分配底部填充物。

公开(公告)号：US06239484B1

公开(公告)日：2001-05-29

申请号：US09328962

申请日：1999-06-09

申请人： Kevin A. Dore ,  David L. Edwards

发明人： Kevin A. Dore ,  David L. Edwards

IPC分类号： H01L2348

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L24/28 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/00

摘要： A chip-under-chip module and a substrate for making the module. The module comprises a first larger chip, a second smaller chip attached to the underside of the first chip, a substrate having a top surface to which the first chip is mounted, a cavity into which the second chip fits when the first chip is mounted on the top surface, and an access channel connecting the cavity to the top surface. Underfill is disposed under the first chip between the first chip and the substrate, between the first and second chips, within the cavity, and within the access channel. A process for manufacture of such a module comprises the steps of forming the substrate having the cavity and access channel in the substrate, connecting the first chip to the substrate, and dispensing underfill through the access channel.

摘要翻译： 芯片芯片下模块和用于制造模块的基板。 该模块包括第一较大的芯片，附接到第一芯片的下侧的第二较小芯片，具有安装第一芯片的顶表面的基板，当第一芯片安装在其上时第二芯片配合的空腔 顶表面，以及将空腔连接到顶表面的通道。 底部填充物设置在第一芯片与第一芯片之间的第一芯片和第二芯片之间，第一芯片和第二芯片之间，腔内，以及存取通道内。 制造这种模块的方法包括以下步骤：在衬底中形成具有空腔和通道的衬底，将第一芯片连接到衬底，以及通过接入通道分配底部填充物。

公开(公告)号：US08021925B2

公开(公告)日：2011-09-20

申请号：US11955598

申请日：2007-12-13

申请人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

发明人： David L. Edwards ,  Sushumna Iruvanti ,  Hilton T. Toy ,  Wei Zou

IPC分类号： H01L23/02

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

摘要翻译： 公开了半导体模块结构和形成半导体模块结构的方法。 该结构包括安装在基板上并被盖子覆盖的模具。 热化合物设置在模具和盖子之间的热间隙内。 围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。 更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。 屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

公开(公告)号：US20110069456A1

公开(公告)日：2011-03-24

申请号：US12566591

申请日：2009-09-24

申请人： Mark A. Brandon ,  Shawn Canfield ,  David L. Edwards ,  Robert R. Genest ,  Randall G. Kemink ,  Robert K. Mullady ,  John G. Torok

发明人： Mark A. Brandon ,  Shawn Canfield ,  David L. Edwards ,  Robert R. Genest ,  Randall G. Kemink ,  Robert K. Mullady ,  John G. Torok

IPC分类号： H05K7/20 ,  H01R12/00

CPC分类号： H01R12/7029 ,  H01R12/721 ,  H05K1/0203 ,  H05K7/20418 ,  H05K7/20509 ,  H05K2201/10159

摘要： A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

摘要翻译： 改进在线存储器模块的系统可以包括由在线存储器模块承载的加固，支撑，保护和/或辅助处理在线存储器模块的边缘。 系统还可以包括由边缘承载的引导肋，以便于在安装期间定位在线存储器模块。 在一个实施例中，该系统包括散热器，以帮助冷却由在线存储器模块承载的多个热源。 该系统可以进一步包括柔性构件以调节散热器相对于多个热源的定位。

公开(公告)号：US20080261350A1

公开(公告)日：2008-10-23

申请号：US12146798

申请日：2008-06-26

申请人： Glenn G. Daves ,  David L. Edwards ,  Mukta G. Farooq ,  Frank L. Pompeo

发明人： Glenn G. Daves ,  David L. Edwards ,  Mukta G. Farooq ,  Frank L. Pompeo

IPC分类号： H05K3/36 ,  H01L21/00 ,  B23K31/02

CPC分类号： B23K3/0638 ,  B23K2101/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K3/301 ,  H05K3/303 ,  H05K3/305 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.

摘要翻译： 一种用于组装的方法，并且所得到的电子模块包括使用第一焊料互连阵列将芯片附接到衬底，并且使用第二焊料互连阵列将衬底附接到衬底，第二焊料互连阵列可以是单熔体或双 - 熔融焊料阵列。 第二焊料互连阵列完全位于限定在板和衬底之间的空间内。 在该空间内设有抗蠕变结构，用于维持限定的空间并优化第二焊料互连阵列的完整性。 抗蠕变结构可以包括底部填充材料，球，支架，框架，套环或其组合。 其中抗蠕变结构是底部填充材料，在将基板完全用底部填充材料完全封装第二互连阵列之前，或者在具有底部填充材料的不连续位置部分地封装第二焊料互连阵列之前，衬底附着到板上是至关重要的。

公开(公告)号：US20080225484A1

公开(公告)日：2008-09-18

申请号：US11687037

申请日：2007-03-16

申请人： William L. Brodsky ,  Peter J. Brofman ,  James A. Busby ,  Bruce J. Chamberlin ,  Scott A. Cummings ,  David L. Edwards ,  Thomas J. Fleischman ,  Michael J. Griffin ,  Sushumna Iruvanti ,  David C. Long ,  Jennifer V. Muncy ,  Robin A. Susko

发明人： William L. Brodsky ,  Peter J. Brofman ,  James A. Busby ,  Bruce J. Chamberlin ,  Scott A. Cummings ,  David L. Edwards ,  Thomas J. Fleischman ,  Michael J. Griffin ,  Sushumna Iruvanti ,  David C. Long ,  Jennifer V. Muncy ,  Robin A. Susko

IPC分类号： H05K7/20

CPC分类号： H01L23/42 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3511 ,  H01L2224/0401

摘要： Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap.

摘要翻译： 使用柔性热枕头增强电子部件传热的方法，装置和组件。 柔性热枕头具有密封在顶部和底部导电层之间的导热材料，底层具有位于枕头的中心部分的具有间隙的相对侧上的柔性容器。 枕头可能具有粗糙的内表面以增加枕头内的内表面积，以增强散热。 在电子组件中，枕头的中心部分位于散热器和用于其之间的热耦合的发热部件之间。 在热循环期间，枕头的柔性储存器膨胀以保持从间隙挤出的导热材料，然后收缩以迫使这种挤出的材料回到间隙中。 外部压力源可以接触枕头，以进一步迫使挤出的导热材料回到间隙中。

公开(公告)号：US06541365B2

公开(公告)日：2003-04-01

申请号：US09992360

申请日：2001-11-14

申请人： David L. Edwards ,  Norman J. Dauerer ,  Glenn G. Daves

发明人： David L. Edwards ,  Norman J. Dauerer ,  Glenn G. Daves

IPC分类号： H01L2144

CPC分类号： H01L21/6835 ,  G01R1/0408 ,  G01R1/0466 ,  G01R1/0483 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

摘要： The present invention relates generally to a new structure and a method for reducing the cost of producing known good die (KGD). More particularly, the invention encompasses a structure and a method that uses a substrate having solder wettable pads, a chip with attached solder balls, and a thin non-conductive interposer that is assembled between the chip and the substrate. The interposer reduces the cross section of the solder connections from the chip to the substrate where the solder passes through (the holes in) the interposer. This reduced cross-sectional area of the solder connection creates a weak point which allows the chip to be easily sheared off of the substrate after a burn-in and test process. The preferred chips for this invention are flip chips.

公开(公告)号：US06292369B1

公开(公告)日：2001-09-18

申请号：US09633788

申请日：2000-08-07

申请人： Glenn G. Daves ,  David L. Edwards

发明人： Glenn G. Daves ,  David L. Edwards

IPC分类号： H05K720

CPC分类号： H01L21/50 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10T29/4913

摘要： Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the amount of compliant thermally conductive material in the primary heat dissipation path. The lid structures and modules are made by processes wherein the lid understructure is customized for the chip(s) to be housed. The customization is achieved by the use of shims and a deformable lid understructure.

摘要翻译： 具有改善的散热性能的集成电路芯片封装模块和盖结构的特征在于定制的盖子下部结构，其能够减少主散热路径中的柔性导热材料的量。 盖结构和模块通过以下方法制成：其中盖子下部结构被定制成要被容纳的芯片。 定制是通过使用垫片和可变形的盖子结构来实现的。

公开(公告)号：US6090931A

公开(公告)日：2000-07-18

申请号：US855160

申请日：1997-05-13

申请人： David L. Edwards ,  Corinna Herrnstadt ,  Edward R. Wilcox ,  Siu-Yin Wong

发明人： David L. Edwards ,  Corinna Herrnstadt ,  Edward R. Wilcox ,  Siu-Yin Wong

IPC分类号： C12N15/09 ,  A01N63/00 ,  A01N63/02 ,  C07K14/00 ,  C07K14/325 ,  C07K14/41 ,  C12N1/00 ,  C12N1/21 ,  C12N15/00 ,  C12N15/32 ,  C12P21/02 ,  C12R1/07 ,  C12R1/19 ,  C12R1/38 ,  C12N15/62 ,  C12N15/70 ,  C12N15/82

CPC分类号： C12R1/075 ,  A01N63/00 ,  A01N63/02 ,  C07K14/325

摘要： The invention concerns an in vitro process for altering the insect host range (spectrum) or increasing the toxicity of lepidopteran active B.t. crystal protein toxins. The process comprises recombining in vitro the variable region(s) (non-homologous) of two or more genes encoding lepidopteran active B.t. crystal protein toxins. Specifically exemplified is the recombining of the variable regions of two genes obtained from well-known strains of Bacillus thuringiensis var. kurstaki. The resulting products are chimeric toxins which are shown to have an expanded and/or amplified lepidopteran insect host range as compared to the parent toxins.

摘要翻译： 本发明涉及用于改变昆虫宿主范围（光谱）或增加鳞翅目活性B.t.的毒性的体外方法。 晶体蛋白毒素。 该方法包括在体外重组编码鳞翅目昆虫活性B.t.的两个或多个基因的可变区（非同源的）。 晶体蛋白毒素。 具体举例说明了从已知的苏云金芽孢杆菌变种菌株获得的两个基因的可变区的重组。 kurstaki。 所得产物是与母体毒素相比显示具有扩增和/或扩增的鳞翅目昆虫宿主范围的嵌合毒素。

公开(公告)号：US6051556A

公开(公告)日：2000-04-18

申请号：US438465

申请日：1995-05-10

申请人： Edward R. Wilcox ,  David L. Edwards ,  George E. Schwab ,  Mark Thompson ,  Paul Culver

发明人： Edward R. Wilcox ,  David L. Edwards ,  George E. Schwab ,  Mark Thompson ,  Paul Culver

IPC分类号： C07K14/325 ,  C07K14/34 ,  C12N15/62 ,  A61K38/00 ,  C07K1/00

CPC分类号： C12N15/62 ,  C07K14/325 ,  C07K14/34 ,  C07K2319/00 ,  C07K2319/035 ,  C07K2319/55

摘要： The invention concerns novel hybrid pesticidal toxins. These toxins are expressed as the fusion protein of a chimeric gene. Specifically exemplified is a novel B.t. hybrid toxin. These novel toxins have increased toxicity against target pests. The invention also concerns a process for preparing a hybrid virus having an altered insect host range.

摘要翻译： 本发明涉及新型杂种杀虫毒素。 这些毒素被表达为嵌合基因的融合蛋白。 具体例子是一个小说B.t. 杂交毒素。 这些新型毒素对目标害虫的毒性增加。 本发明还涉及制备具有改变的昆虫宿主范围的杂种病毒的方法。