公开(公告)号：US4950573A

公开(公告)日：1990-08-21

申请号：US121483

申请日：1987-11-17

申请人： Kimitoshi Yamaguchi ,  Kazuhiko Umemura ,  Yoshihiro Nomura

发明人： Kimitoshi Yamaguchi ,  Kazuhiko Umemura ,  Yoshihiro Nomura

IPC分类号： G03G9/08 ,  G03G9/087

CPC分类号： G03G9/0825 ,  G03G9/08751 ,  G03G9/08773

摘要： A toner for developing latent electrostatic images is disclosed, which comprises (a) thermofusible base particles A having a softening point of 80.degree. C. or less, a flow starting temperature of 110.degree. C. or less, and an average particle size of 5 to 25 .mu.m, and (b) small particles B comprising as the main component an organic polymeric material having a softening point at least 5.degree. C. higher than the softening point of the base particles A and no practical softening point, and an average particle size ranging from 0.1 .mu.m or more, but not more than 1/4 of the average particle size of the base particles A, which small particles B are embedded in the surface of the base particles A so as to cover the surface of the base particles A to a depth of less than the particle size of the small particles B.

摘要翻译： 公开了用于显影静电图像的调色剂，其包含（a）软化点为80℃或更低，流动起始温度为110℃或更低，平均粒度为5的热熔性基础颗粒A 至（b）作为主要成分的小粒子B，其含有软化点比基础粒子A的软化点高5℃以上的有机聚合物，没有实用的软化点，平均粒径 粒径为0.1μm以上且不超过基体颗粒A的平均粒径的1/4，该颗粒B被嵌入基体颗粒A的表面，以覆盖基体颗粒A的表面 基础颗粒A的深度小于小颗粒B的粒度。

公开(公告)号：US09013138B2

公开(公告)日：2015-04-21

申请号：US13528514

申请日：2012-06-20

申请人： Yoshihiro Nomura

发明人： Yoshihiro Nomura

IPC分类号： H02J7/14 ,  H02J7/04

CPC分类号： H02J7/044 ,  B60L11/1816 ,  B60L11/1838 ,  B60L11/1862 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2240/80 ,  B60L2250/14 ,  H02J7/047 ,  Y02T10/7005 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7072 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/163

摘要： A charging apparatus includes an electric power supply device and a control device. The control device that estimates a first region in which first charging power is supplied from the electric power supply device to a electric storage device; estimates a second region, in which second charging power that is smaller than the first charging power is supplied from the electric power supply device to the electric storage device, based on temperature of the electric storage device and a state-of-charge of the electric storage; estimates a first charging time that corresponds to the first region; estimates a second charging time that corresponds to the second region; estimates a total charging time by using the first charging time and the second charging time; obtains a charging completion time; and sets a charging start time based on the charging completion time and the total charging time.

摘要翻译： 充电装置包括电力供应装置和控制装置。 所述控制装置将从所述电力供给装置向所述蓄电装置供给了第一充电电力的第一区域; 估计第二区域，其中基于蓄电装置的温度和电力的充电状态，从电力供应装置向蓄电装置供给小于第一充电电力的第二充电功率 存储; 估计对应于第一区域的第一充电时间; 估计对应于第二区域的第二充电时间; 通过使用第一充电时间和第二充电时间来估计总充电时间; 获得充电完成时间; 并根据充电完成时间和总充电时间设定充电开始时间。

公开(公告)号：US20090088536A1

公开(公告)日：2009-04-02

申请号：US11573959

申请日：2004-09-28

申请人： Hiroyuki Kawakami ,  Reiko Yamaguchi ,  Yoshihiro Nomura

发明人： Hiroyuki Kawakami ,  Reiko Yamaguchi ,  Yoshihiro Nomura

IPC分类号： C08L79/08

CPC分类号： C08J3/215 ,  C08J2379/08 ,  C08L79/08 ,  C08L2205/02 ,  H01L23/293 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05571 ,  H01L2224/13021 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  C08L2666/20 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： An object of the present invention is to provide a heat-resistant resin paste that enables the formation of a precise pattern, exhibits excellent adhesiveness, heat resistance and flexibility, and enables a shortening of the production time, as well as a method for producing thereof. The present invention relates to a heat-resistant resin paste, comprising a first organic solvent (A1), a second organic solvent (A2) that comprises a lactone, a heat-resistant resin (B) that is soluble in a mixed organic solvent of (A1) and (A2), and a heat-resistant resin filler (C) that is soluble in (A1) but insoluble in (A2), wherein (C) is dispersed within a solution comprising (A1), (A2) and (B).

摘要翻译： 本发明的目的是提供一种能够形成精确图案的耐热树脂浆料，显示出优异的粘合性，耐热性和柔软性，并且能够缩短生产时间及其制备方法 。 本发明涉及一种耐热树脂膏，其包含第一有机溶剂（A1），包含内酯的第二有机溶剂（A2），可溶于混合有机溶剂的耐热树脂（B） （A1）和（A2）中的溶解性（A1）但不溶于（A2）的耐热性树脂填料（C），其中（C）分散在包含（A1），（A2）和 （B）。

公开(公告)号：US20090022893A1

公开(公告)日：2009-01-22

申请号：US12236756

申请日：2008-09-24

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B05D3/12

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US20060027312A1

公开(公告)日：2006-02-09

申请号：US11241992

申请日：2005-10-04

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

公开(公告)号：US06523446B1

公开(公告)日：2003-02-25

申请号：US09462943

申请日：2000-01-18

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B26D538

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US06462148B1

公开(公告)日：2002-10-08

申请号：US09297203

申请日：1999-10-07

申请人： Masahiro Suzuki ,  Shin Nishimura ,  Masao Suzuki ,  Akio Takahashi ,  Akira Kageyama ,  Yoshihiko Honda ,  Toshiyasu Kawai ,  Shinji Iioka ,  Yoshihiro Nomura

发明人： Masahiro Suzuki ,  Shin Nishimura ,  Masao Suzuki ,  Akio Takahashi ,  Akira Kageyama ,  Yoshihiko Honda ,  Toshiyasu Kawai ,  Shinji Iioka ,  Yoshihiro Nomura

IPC分类号： C08L7100

CPC分类号： C08G65/4037 ,  C08G65/4006 ,  C08G75/23 ,  C08L71/00

摘要： A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.

摘要翻译： 可用作粘合剂膜的树脂组合物和用于多层布线基板或电子部件的绝缘材料包括（A）包含式（1）所示的喹啉环的聚合物，其结构如6,6'-双（2- （4-氟苯基）-4-苯基喹啉）和4,4' - （1,1,1,3,3,3-六氟-2,2-亚丙基）双酚，和（B）由式 （2）如2,2-双（（4-马来酰亚胺基苯氧基）苯基）丙烷。

公开(公告)号：US06445076B1

公开(公告)日：2002-09-03

申请号：US09700491

申请日：2000-11-16

申请人： Takehiro Shimizu ,  Takafumi Dohdoh ,  Kazumi Tameshige ,  Hidekazu Matsuura ,  Yoshihiro Nomura ,  Kunihiro Tsubosaki ,  Toshihiro Shiotsuki ,  Kazunari Suzuki ,  Tomoko Higashino

发明人： Takehiro Shimizu ,  Takafumi Dohdoh ,  Kazumi Tameshige ,  Hidekazu Matsuura ,  Yoshihiro Nomura ,  Kunihiro Tsubosaki ,  Toshihiro Shiotsuki ,  Kazunari Suzuki ,  Tomoko Higashino

IPC分类号： H01L2348

CPC分类号： C09J179/08 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An insulating adhesive for electronic parts, which is to be used for bonding a semiconductor chip to a lead frame and comprises a resin and a solvent, the resin having (A) a weight average molecular weight (Mw) of 30,000 to 300,000 based on conversion into polystyrene and (B) a ratio of weight average molecular weight (Mw)/number average molecular weight (Mn) of 5 or less, and (C) the insulating adhesive for electronic parts having a viscosity of 5,000 to 100,000 mPa.s at a rotation number of 10 rpm and a viscosity ratio (&eegr;1 rpm/&eegr;10 rpm) of 1.0 to 6.0 as measured at 25° C. with an E-type viscometer.

摘要翻译： 一种用于电子部件的绝缘粘合剂，其用于将半导体芯片接合到引线框架并且包括树脂和溶剂，所述树脂具有（A）基于转化率的30,000至300,000的重均分子量（Mw） （B）重均分子量（Mw）/数均分子量（Mn）的比值为5以下，（C）粘度为5000〜100,000mPa.s的电子部件用绝缘性粘接剂， 旋转数为10rpm，粘度比（eta1rpm / eta10rpm）为1.0〜6.0，用E型粘度计测定。

公开(公告)号：US5180786A

公开(公告)日：1993-01-19

申请号：US432908

申请日：1989-11-07

申请人： Susumu Era ,  Toshio Matsumoto ,  Yoshinori Kobayashi ,  Masashi Shitara ,  Isamu Hattori ,  Yoshihiro Nomura

发明人： Susumu Era ,  Toshio Matsumoto ,  Yoshinori Kobayashi ,  Masashi Shitara ,  Isamu Hattori ,  Yoshihiro Nomura

IPC分类号： C08F279/02 ,  C08F285/00 ,  C08L101/00

CPC分类号： C08F285/00 ,  C08F279/02 ,  C08L101/00

摘要： An impact modifier obtained by emulsion polymerizing acrylic monomer(s), etc., in the presence of a conjugated diene rubber to give a graft rubber polymer, or obtained by polymerizing acrylic monomer(s) and the like ethylenically unsaturated monomers in the presence of the graft rubber polymer, is effective for improving impact resistance and weathering resistance of molded articles obtained from thermoplastic resin compositions containing such an impact modifier.

公开(公告)号：US20140236402A1

公开(公告)日：2014-08-21

申请号：US13509115

申请日：2011-11-08

申请人： Yoshihiro Nomura

发明人： Yoshihiro Nomura

IPC分类号： F02D29/02

CPC分类号： F02D29/02 ,  B60K6/445 ,  B60K6/48 ,  B60L1/003 ,  B60L1/006 ,  B60L11/14 ,  B60L11/1816 ,  B60L11/1868 ,  B60L2210/10 ,  B60L2210/30 ,  B60L2210/40 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2240/441 ,  B60L2240/443 ,  B60L2240/549 ,  B60L2240/70 ,  B60L2240/80 ,  B60L2250/16 ,  B60L2250/24 ,  B60W10/06 ,  B60W20/00 ,  B60W30/18054 ,  B60W30/192 ,  B60W2510/188 ,  B60W2520/04 ,  B60W2540/06 ,  B60W2540/16 ,  B60W2550/404 ,  F02N11/101 ,  Y02T10/6221 ,  Y02T10/6239 ,  Y02T10/6269 ,  Y02T10/642 ,  Y02T10/70 ,  Y02T10/7005 ,  Y02T10/7066 ,  Y02T10/7072 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7291 ,  Y02T90/127 ,  Y02T90/14 ,  Y02T90/16 ,  Y10S903/903

摘要： A hybrid vehicle which starts an engine safely by using a remote switch even when a charging plug is connected is provided. The hybrid vehicle can be charged from an external power source. The controller of the hybrid vehicle executes the following process, when an engine start request is received while the charging plug for supplying electric power from the external power source is connected to the vehicle. (1) Starting an engine if charging is not performed and a shift lever is at a parking position when a request for starting the engine (remote start request) is received from a remote switch outside the vehicle, and rejecting a remote start request if the shift lever is at a position other than a parking position. (2) Rejecting a request for starting the engine from a switch provided in the vehicle.

摘要翻译： 提供即使在连接充电插头时也通过使用远程开关安全地启动发动机的混合动力车辆。 混合动力车辆可以从外部电源充电。 当从外部电源供给电力的充电插头连接到车辆时，混合动力车辆的控制器执行以下处理，当接收到发动机起动请求时。 （1）在从车辆外部的远程开关接收到发动机起动请求（远程启动请求）时，如果不进行充电，起动发动机，并且变速杆处于停车位置，并且如果 变速杆位于停车位置以外的位置。 （2）拒绝从车辆中提供的开关起动发动机的请求。