公开(公告)号：US06445076B1

公开(公告)日：2002-09-03

申请号：US09700491

申请日：2000-11-16

申请人： Takehiro Shimizu ,  Takafumi Dohdoh ,  Kazumi Tameshige ,  Hidekazu Matsuura ,  Yoshihiro Nomura ,  Kunihiro Tsubosaki ,  Toshihiro Shiotsuki ,  Kazunari Suzuki ,  Tomoko Higashino

发明人： Takehiro Shimizu ,  Takafumi Dohdoh ,  Kazumi Tameshige ,  Hidekazu Matsuura ,  Yoshihiro Nomura ,  Kunihiro Tsubosaki ,  Toshihiro Shiotsuki ,  Kazunari Suzuki ,  Tomoko Higashino

IPC分类号： H01L2348

CPC分类号： C09J179/08 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An insulating adhesive for electronic parts, which is to be used for bonding a semiconductor chip to a lead frame and comprises a resin and a solvent, the resin having (A) a weight average molecular weight (Mw) of 30,000 to 300,000 based on conversion into polystyrene and (B) a ratio of weight average molecular weight (Mw)/number average molecular weight (Mn) of 5 or less, and (C) the insulating adhesive for electronic parts having a viscosity of 5,000 to 100,000 mPa.s at a rotation number of 10 rpm and a viscosity ratio (&eegr;1 rpm/&eegr;10 rpm) of 1.0 to 6.0 as measured at 25° C. with an E-type viscometer.

摘要翻译： 一种用于电子部件的绝缘粘合剂，其用于将半导体芯片接合到引线框架并且包括树脂和溶剂，所述树脂具有（A）基于转化率的30,000至300,000的重均分子量（Mw） （B）重均分子量（Mw）/数均分子量（Mn）的比值为5以下，（C）粘度为5000〜100,000mPa.s的电子部件用绝缘性粘接剂， 旋转数为10rpm，粘度比（eta1rpm / eta10rpm）为1.0〜6.0，用E型粘度计测定。

公开(公告)号：US06610561B2

公开(公告)日：2003-08-26

申请号：US09849230

申请日：2001-05-07

申请人： Kunihiro Tsubosaki ,  Masachika Masuda ,  Akihiko Iwaya ,  Atsushi Nakamura ,  Chikako Imura ,  Toshihiro Shiotsuki

发明人： Kunihiro Tsubosaki ,  Masachika Masuda ,  Akihiko Iwaya ,  Atsushi Nakamura ,  Chikako Imura ,  Toshihiro Shiotsuki

IPC分类号： H01L2144

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/50 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2224/92147 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a thin, inexpensive, high-performance semiconductor device provided with busbar leads, power leads and signal leads. A portion of the power lead connected to the busbar lead is depressed toward a major surface of a semiconductor chip to form depressed portion, and the depressed portion is bonded to the major surface of the semiconductor chip by an adhesive layer. The signal lead and the busbar lead are spaced apart from the major surface of the semiconductor chip.

摘要翻译： 本发明提供一种薄型，廉价的高性能半导体器件，其具有母线引线，电源引线和信号引线。 连接到汇流条引线的电源引线的一部分朝向半导体芯片的主表面压下以形成凹陷部分，并且凹陷部分通过粘合剂层结合到半导体芯片的主表面。 信号引线和母线引线与半导体芯片的主表面间隔开。

公开(公告)号：US06335227B1

公开(公告)日：2002-01-01

申请号：US09690451

申请日：2000-10-18

申请人： Kunihiro Tsubosaki ,  Masachika Masuda ,  Akihiko Iwaya ,  Atsushi Nakamura ,  Chikako Imura ,  Toshihiro Shiotsuki

发明人： Kunihiro Tsubosaki ,  Masachika Masuda ,  Akihiko Iwaya ,  Atsushi Nakamura ,  Chikako Imura ,  Toshihiro Shiotsuki

IPC分类号： H01L2144

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/50 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/92147 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A method is provided for forming a thin, inexpensive, high-performance semiconductor device provided with busbar leads, power leads and signal leads. A portion of the power lead connected to the busbar lead is depressed toward a major surface of a semiconductor chip to form a depressed portion, and the depressed portion is bonded to the major surface of the semiconductor chip by an adhesive layer. The signal lead and the busbar lead are spaced apart from the major surface of the semiconductor chip.

摘要翻译： 提供了一种用于形成具有母线，电源引线和信号引线的薄型，便宜的高性能半导体器件的方法。 连接到汇流条引线的电源引线的一部分朝向半导体芯片的主表面压下以形成凹陷部分，并且凹陷部分通过粘合剂层结合到半导体芯片的主表面。 信号引线和母线引线与半导体芯片的主表面间隔开。

公开(公告)号：US6137159A

公开(公告)日：2000-10-24

申请号：US258300

申请日：1999-02-26

申请人： Kunihiro Tsubosaki ,  Masachika Masuda ,  Akihiko Iwaya ,  Atsushi Nakamura ,  Chikako Imura ,  Toshihiro Shiotsuki

发明人： Kunihiro Tsubosaki ,  Masachika Masuda ,  Akihiko Iwaya ,  Atsushi Nakamura ,  Chikako Imura ,  Toshihiro Shiotsuki

IPC分类号： H01L23/495 ,  H01L23/50

CPC分类号： H01L24/06 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/50 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/92147 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181

摘要： The present invention provides a thin, inexpensive, high-performance semiconductor device provided with busbar leads, power leads and signal leads. A portion of the power lead connected to the busbar lead is depressed toward a major surface of a semiconductor chip to form a depressed portion, and the depressed portion is bonded to the major surface of the semiconductor chip by an adhesive layer. The signal lead and the busbar lead are spaced apart from the major surface of the semiconductor chip.

摘要翻译： 本发明提供一种薄型，廉价的高性能半导体器件，其具有母线引线，电源引线和信号引线。 连接到汇流条引线的电源引线的一部分朝向半导体芯片的主表面压下以形成凹陷部分，并且凹陷部分通过粘合剂层结合到半导体芯片的主表面。 信号引线和母线引线与半导体芯片的主表面间隔开。

公开(公告)号：US06803258B2

公开(公告)日：2004-10-12

申请号：US10152727

申请日：2002-05-23

申请人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

发明人： Fujio Ito ,  Hiroaki Tanaka ,  Hiromichi Suzuki ,  Tokuji Toida ,  Takafumi Konno ,  Kunihiro Tsubosaki ,  Shigeki Tanaka ,  Kazunari Suzuki ,  Akihiko Kameoka

IPC分类号： H01L2150

CPC分类号： H01L24/32 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/85399 ,  H01L2224/05599

摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w

摘要翻译： 在具有散热板的半导体器件中，连接到半导体芯片的内部引线的尖端具有引线宽度w和引线厚度t，宽度小于厚度。 内引线固定在散热板上。 将内部引线固定到散热板上，支撑后者，并且不需要悬挂引线。 引线间距p，连接到半导体芯片的内引线头的引线宽度w和引线厚度t具有w

公开(公告)号：US5714405A

公开(公告)日：1998-02-03

申请号：US721240

申请日：1996-09-26

申请人： Kunihiro Tsubosaki ,  Michio Tanimoto ,  Kunihiko Nishi ,  Masahiro Ichitani ,  Shunji Koike ,  Kazunari Suzuki ,  Ryosuke Kimoto ,  Ichiro Anjoh ,  Taisei Jin ,  Akihiko Iwaya ,  Gen Murakami ,  Masamichi Ishihara ,  Junichi Arita

发明人： Kunihiro Tsubosaki ,  Michio Tanimoto ,  Kunihiko Nishi ,  Masahiro Ichitani ,  Shunji Koike ,  Kazunari Suzuki ,  Ryosuke Kimoto ,  Ichiro Anjoh ,  Taisei Jin ,  Akihiko Iwaya ,  Gen Murakami ,  Masamichi Ishihara ,  Junichi Arita

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H01L21/60

CPC分类号： H01L24/06 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4951 ,  H01L24/05 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85424 ,  H01L2225/1029 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49121

摘要： A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.

摘要翻译： 一种半导体器件，其具有通过绝缘粘合剂膜固定到半导体芯片的主表面并与半导体芯片的各个外部端子电连接的内部引线。 可以关于芯片尺寸的半导体器件被配置为使得外引线从每个内引线连续地延伸到与半导体芯片的主表面相对的后表面，以便保持引线和外部器件 导通。

公开(公告)号：US5378656A

公开(公告)日：1995-01-03

申请号：US38684

申请日：1993-03-29

申请人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

发明人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

IPC分类号： H01L23/50 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L24/743 ,  H01L21/4842 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/82181 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T29/49121

摘要： In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

摘要翻译： 为了提高回流焊时的LSI封装的封装体抗开裂性，并且提供适用于制造根据柔性制造系统的LSI封装的引线框和使用引线框的LSI，半导体芯片2 并且通过使管芯焊盘3的外部尺寸小于要安装在其上的半导体芯片的外部尺寸来扩大树脂。 此外，通过根据半导体芯片2的外部尺寸将引线5的前端切割成合适的长度，可以将不同的外部尺寸的各种半导体芯片2安装在管芯焊盘3上。

公开(公告)号：US07247576B2

公开(公告)日：2007-07-24

申请号：US11260182

申请日：2005-10-28

申请人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L21/302

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/562 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.

摘要翻译： 通过使引线框架的管芯焊盘的外观比安装在其上的半导体芯片的外观更小，从而抑制芯片焊盘背面附近的封装裂缝的发生，并且还发生封装裂纹 通过在最终钝化膜（最终钝化膜）上形成覆盖顶层导电布线的最终钝化膜（最终钝化膜）的与构成封装体的树脂具有良好粘附性的有机材料层来抑制半导体芯片附近的主表面。 半导体芯片

公开(公告)号：US5874773A

公开(公告)日：1999-02-23

申请号：US841329

申请日：1997-04-30

申请人： Kazuhiro Terada ,  Kunihiro Tsubosaki ,  Hiroshi Watanabe ,  Kazunari Suzuki

发明人： Kazuhiro Terada ,  Kunihiro Tsubosaki ,  Hiroshi Watanabe ,  Kazunari Suzuki

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48

CPC分类号： H01L23/49503 ,  H01L24/50 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181

摘要： The resin-sealed package includes a lead frame having a supporting and heat spreading pad and inner and outer leads arranged to surround the supporting and head spreading pad. A tape automated bonding (TAB) structure is provided having a semiconductor chip having bonding pads formed on a periphery of a main surface of the semiconductor chip. A rear surface of the semiconductor chip is fixed to the supporting and head spreading pad. TAB leads are provided on the main surface of the semiconductor chip. One end of each TAB lead is connected with said bonding pads and the other end of each TAB lead is connected with one end of each inner lead of the lead frame. A resin molding is used for sealing the TAB structure and the supporting and head spreading pad and inner leads of the lead frame. An area of the supporting and head spreading pad is larger than that of the semiconductor chip of said TAB structure. The supporting and heat spreading pad includes a first slit positioned under the semiconductor chip and a second slit positioned outside of the semiconductor chip in a plane view.

摘要翻译： 树脂密封包装包括具有支撑和散热垫的引线框架，以及围绕支撑头扩散垫的内和外引线。 提供一种带状自动接合（TAB）结构，其具有半导体芯片，该半导体芯片具有形成在半导体芯片的主表面周围的接合焊盘。 半导体芯片的后表面固定在支撑头扩散垫上。 TAB引线设置在半导体芯片的主表面上。 每个TAB引线的一端与所述接合焊盘连接，并且每个TAB引线的另一端与引线框架的每个内引线的一端连接。 使用树脂模制件来密封TAB结构以及引线框架的支撑头和扩散垫和内引线。 支撑头扩散垫的面积大于所述TAB结构的半导体芯片的面积。 支撑和散热垫包括位于半导体芯片下方的第一狭缝和位于半导体芯片的平面外的第二狭缝。

公开(公告)号：US20070298545A1

公开(公告)日：2007-12-27

申请号：US11780585

申请日：2007-07-20

申请人： Yoshinori MIYAKI ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori MIYAKI ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L21/58

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/562 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.

摘要翻译： 通过使引线框架的管芯焊盘的外观比安装在其上的半导体芯片的外观更小，从而抑制芯片焊盘背面附近的封装裂缝的发生，并且还发生封装裂纹 通过在最终钝化膜（最终钝化膜）上形成覆盖顶层导电布线的最终钝化膜（最终钝化膜）的与构成封装体的树脂具有良好粘附性的有机材料层来抑制半导体芯片附近的主表面。 半导体芯片