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公开(公告)号：US20090200680A1
公开(公告)日：2009-08-13
申请号：US12365806
申请日：2009-02-04
IPC分类号： H01L23/48
CPC分类号： G06F1/185 , G11C5/02 , G11C5/063 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.
摘要翻译： 存储卡具有布线板，堆叠在布线板的主表面上的四个存储芯片，以及安装在最上层的存储芯片的表面上的控制器芯片和插入器。 存储芯片堆叠在布线板的表面上，使得它们的长边沿着与布线板的长边方向相同的方向。 最下层的存储芯片以错位的方式在朝向存储卡前端的方向上以预定的距离安装在布线板上，以便不与布线板的焊盘重叠。 堆叠在最下层的存储芯片上的三个存储芯片被布置成使得它们在其上形成焊盘的短边位于存储卡的前端。
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公开(公告)号：US08319352B2
公开(公告)日：2012-11-27
申请号：US13158430
申请日：2011-06-12
CPC分类号： G06F1/185 , G11C5/02 , G11C5/063 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.
摘要翻译： 存储卡具有布线板，堆叠在布线板的主表面上的四个存储芯片，以及安装在最上层的存储芯片的表面上的控制器芯片和插入器。 存储芯片堆叠在布线板的表面上，使得它们的长边沿着与布线板的长边方向相同的方向。 最下层的存储芯片以错位的方式在朝向存储卡前端的方向上以预定的距离安装在布线板上，以便不与布线板的焊盘重叠。 堆叠在最下层的存储芯片上的三个存储芯片被布置成使得它们在其上形成焊盘的短边位于存储卡的前端。
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公开(公告)号：US20110233788A1
公开(公告)日：2011-09-29
申请号：US13158430
申请日：2011-06-12
IPC分类号： H01L27/12
CPC分类号： G06F1/185 , G11C5/02 , G11C5/063 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.
摘要翻译： 存储卡具有布线板，堆叠在布线板的主表面上的四个存储芯片，以及安装在最上层的存储芯片的表面上的控制器芯片和插入器。 存储芯片堆叠在布线板的表面上，使得它们的长边沿着与布线板的长边方向相同的方向。 最下层的存储芯片以错位的方式在朝向存储卡前端的方向上以预定的距离安装在布线板上，以便不与布线板的焊盘重叠。 堆叠在最下层的存储芯片上的三个存储芯片被布置成使得它们在其上形成焊盘的短边位于存储卡的前端。
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公开(公告)号：US07989960B2
公开(公告)日：2011-08-02
申请号：US12365806
申请日：2009-02-04
CPC分类号： G06F1/185 , G11C5/02 , G11C5/063 , H01L23/5388 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/49175 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/30105 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A memory card has a wiring board, four memory chips stacked on a main surface of the wiring board, and a controller chip and an interposer mounted on a surface of the memory chip of the uppermost layer. The memory chips are stacked on the surface of the wiring board so that their long sides are directed in the same direction as that of the long side of the wiring board. The memory chip of the lowermost layer is mounted on the wiring board in a dislocated manner by a predetermined distance in a direction toward a front end of the memory card so as not to overlap the pads of the wiring board. The three memory chips stacked on the memory chip of the lowermost layer are disposed so that their short sides on which pads are formed are located at the front end of the memory card.
摘要翻译： 存储卡具有布线板，堆叠在布线板的主表面上的四个存储芯片，以及安装在最上层的存储芯片的表面上的控制器芯片和插入器。 存储芯片堆叠在布线板的表面上，使得它们的长边沿着与布线板的长边方向相同的方向。 最下层的存储芯片以错位的方式在朝向存储卡前端的方向上以预定的距离安装在布线板上，以便不与布线板的焊盘重叠。 堆叠在最下层的存储芯片上的三个存储芯片被布置成使得它们在其上形成焊盘的短边位于存储卡的前端。
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公开(公告)号：US08084869B2
公开(公告)日：2011-12-27
申请号：US12478837
申请日：2009-06-05
IPC分类号： H01L23/29
CPC分类号： H01L23/49838 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/13144 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48227 , H01L2224/48229 , H01L2224/73204 , H01L2224/73253 , H01L2224/81203 , H01L2224/81801 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/112 , H05K3/4652 , H05K2201/09227 , H05K2201/099 , H05K2201/10734 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A technique permitting the reduction in size of a semiconductor device is provided. In a BGA type semiconductor device with a semiconductor chip flip-chip-bonded onto a wiring substrate, bump electrodes of the semiconductor chip are coupled to lands formed at an upper surface of the wiring substrate. The lands at the upper surface of the wiring substrate are coupled electrically to solder balls formed on a lower surface of the wiring substrate. Therefore, the lands include first type lands with lead-out lines coupled thereto and second type lands with lead-out lines not coupled thereto but with vias formed just thereunder. The lands are arrayed in six or more rows at equal pitches in an advancing direction of the rows. However, a row-to-row pitch is not made an equal pitch. In land rows which are likely to cause a short-circuit, the pitch between adjacent rows is made large, while in land rows which are difficult to cause a short-circuit, the pitch between adjacent rows is made small. By so doing, both prevention of a short-circuit and improvement of the layout density of lands are attained at a time.
摘要翻译： 提供了允许半导体器件的尺寸减小的技术。 在具有倒装芯片接合在布线基板上的半导体芯片的BGA型半导体器件中，半导体芯片的突起电极被耦合到在布线基板的上表面上形成的焊盘。 布线基板的上表面的焊盘电连接到形成在布线基板的下表面上的焊球。 因此，焊盘包括具有与其耦合的引出线的第一类型的焊盘和没有耦合到其上的导出线，但是具有刚好形成的通孔的第二类型的焊盘。 焊盘沿着行的前进方向以等间距排列成六行或更多行。 然而，行到行间距不是相等的音高。 在可能导致短路的陆地列中，相邻行之间的间距变大，而在难以引起短路的陆地行中，相邻行之间的间距变小。 通过这样做，一次可以实现防止短路的改善和布局密度的提高。
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公开(公告)号：US20110227234A1
公开(公告)日：2011-09-22
申请号：US13153384
申请日：2011-06-03
申请人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
发明人： Hirotaka Nishizawa , Akira Higuchi , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
IPC分类号： H01L23/49
CPC分类号： G06K19/077 , G06K19/07732 , H01L24/06 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/05553 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19105 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes. The security process by a security controller independent interface can also be guaranteed.
摘要翻译： 多功能卡装置具有连接到接口控制器和外部连接端子的外部连接端子，接口控制器，存储器和安全控制器。 接口控制器具有多个接口控制模式，并且根据来自外部的指令通过控制模式来控制外部接口动作和存储器接口动作。 外部连接端子具有针对每个接口控制模式个性化的单个端子，以及共用公共端子。 公共端子包括时钟输入端子，电源端子和接地端子。 数据终端和安全控制器的专用终端包括在各个终端中。 外部连接终端的部分共享和个性化可以保证接口的可靠性，并且可以通过某种接口控制模式来增加对物理量的控制。 安全控制器独立接口的安全过程也可以保证。
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公开(公告)号：US08021932B2
公开(公告)日：2011-09-20
申请号：US12430277
申请日：2009-04-27
IPC分类号： H01L21/00
CPC分类号： H01L23/49838 , H01L21/563 , H01L23/3128 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/814 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01019 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/85 , H01L2224/83 , H01L2224/81 , H01L2224/05599 , H01L2224/05099
摘要： To provide a semiconductor device with improved reliability. The semiconductor device includes a wiring board, a microcomputer chip flip-chip bonded over the wiring board via gold bumps, a first memory chip laminated over the microcomputer chip, wires for coupling the first memory chip to the wiring board, an underfill material with which a flip-chip coupling portion of the microcomputer chip is filled, and a sealing member for sealing the microcomputer chip and the first memory chip with resin. Further, the corner of a second opening portion of a solder resist film of the wiring board corresponding to the corner of the chip on the air vent side in charging the underfill material is made close to the microcomputer chip, which can improve the wettability and spread of the underfill material at the second opening portion, thus reducing the exposure of leads to the second opening portion, thereby improving the reliability of the semiconductor device.
摘要翻译： 提供具有改善的可靠性的半导体器件。 半导体器件包括布线板，通过金凸块接合在布线板上的微计算机芯片倒装芯片，叠置在微计算机芯片上的第一存储芯片，用于将第一存储器芯片耦合到布线板的导线，用于将第一存储器芯片耦合到布线板的底部填充材料， 填充微型计算机芯片的倒装芯片连接部分，以及用树脂密封微型计算机芯片和第一存储器芯片的密封构件。 此外，在对底部填充材料充电时，对应于排气侧的芯片的角部的布线板的阻焊膜的第二开口部分的角部靠近微型计算机芯片，这可以提高润湿性和扩展 的第二开口部分的底部填充材料，从而减少了引线到第二开口部分的暴露，从而提高了半导体器件的可靠性。
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公开(公告)号：USD552612S1
公开(公告)日：2007-10-09
申请号：US29242996
申请日：2005-11-18
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公开(公告)号：USD552098S1
公开(公告)日：2007-10-02
申请号：US29242995
申请日：2005-11-18
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公开(公告)号：US20070194454A1
公开(公告)日：2007-08-23
申请号：US11626286
申请日：2007-01-23
IPC分类号： H01L23/52
CPC分类号： H01L25/18 , G11C5/06 , H01L24/45 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2225/06586 , H01L2924/01014 , H01L2924/01037 , H01L2924/01079 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： This invention is to provide a nonvolatile memory device that enhances a size reduction and mass productivity while ensuring reliability and signal transmission performance. A nonvolatile memory chip having a first side formed with no pads and a second side formed with pads is mounted on a mounting substrate. A control chip for controlling the nonvolatile memory chip is mounted on the nonvolatile memory chip. The control chip has a first pad row corresponding to the pads of the nonvolatile memory chip. The first pad row is mounted adjacent to the first side of the nonvolatile memory chip. The first pad row of the control chip and a first electrode row formed on the mounting substrate are connected via a first wire group. The pads of the nonvolatile memory chip and a second electrode row formed on the mounting substrate are connected via a second wire group. The first electrode row and the second electrode row are connected through wirings formed in the mounting substrate.
摘要翻译： 本发明是提供一种在确保可靠性和信号传输性能的同时提高尺寸减小和批量生产率的非易失性存储装置。 具有形成有焊盘的第一侧和形成有焊盘的第二侧的非易失性存储器芯片安装在安装基板上。 用于控制非易失存储器芯片的控制芯片安装在非易失性存储器芯片上。 控制芯片具有对应于非易失性存储器芯片的焊盘的第一焊盘行。 第一焊盘排安装在非易失性存储芯片的第一侧附近。 控制芯片的第一焊盘排和形成在安装基板上的第一电极列经由第一焊丝组连接。 形成在安装基板上的非易失性存储芯片的焊盘和第二电极列经由第二引线组连接。 第一电极列和第二电极列通过形成在安装基板中的布线连接。
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