摘要:
A variable logic integrated circuit device formed on a semiconductor chip comprising variable logic blocks and switch matrices laid out alternately in the X and Y directions in a checkerboard pattern. Above the variable logic blocks is a block interconnection wiring arrangement formed by multiple-layer wiring techniques. The variable logic blocks and switch matrices are wired into circuits respectively by a lower wiring layer in the multiple wiring layer setup of the chip. The block interconnection wiring is formed by an upper wiring layer extending above the variable logic blocks and included in the multiple wiring layer setup. The switch matrices are used to connect the block interconnection lines to one another as well as to the variable logic blocks.
摘要:
A variable logic circuit comprises a memory cell, a transistor which turns on or off depending on data stored in the memory cell, a transistor which is connected in series to the above-mentioned transistor and is turned on or off by an input signal, a transistor which produces a voltage depending on the conduction states of the above-mentioned transistors, and transfer means which conducts or does not conduct the produced voltage to the output terminal depending on a select signal.
摘要:
Disclosed is a bipolar-CMOS LSI manufactured by a simplified process and realizing a higher density of integration as well as a higher operating speed, in which a base lead-out electrode of a bipolar transistor and respective gate electrodes of a p-channel MISFET and an n-channel MISFET of CMOS transistors are made of an identical conductor film, and the conductor film of the gate electrode of the p-channel MISFET is of p-type, while that of the gate electrode of the n-channel MISFET is of n-type.
摘要:
In a semiconductor integrated circuit device, input protective elements have current limiting resistors which are diffused resistors of a second conductivity type formed in a first semiconductor region of a first conductivity type isolated electrically by a second semiconductor region of the second conductivity type, with the first conductivity type semiconductor region being in a floating state electrically. The input protective elements create less leak current and have high electrostatic durability.
摘要:
A semiconductor integrated circuit device is provided for permitting operation of a CMOS or BiCMOS memory with ECL level input signals, in which operating speed is increased and power consumption is reduced.Input signals of ECL levels are received by an input buffer for amplifying the input signals to an output signal level within a range where differential transistors of the input buffer operate in an unsaturation region. The output signal of the input buffer is supplied to a CMOS circuit or Bi-CMOS circuit which is operated by both an operating voltage having a first-stage smaller absolute value than that of the operating voltage of the input buffer and the ground potential of the circuit. This first stage CMOS or BiCMOS circuit also includes an arrangement to further amplify the received signals to provide further level conversion.Since both the input buffer and the first-stage CMOS or Bi-CMOS circuit perform signal transmission and level conversions, high-speed operation and low power consumption can be achieved by a simple structure.
摘要:
A semiconductor integrated circuit device including a level conversion circuit in which the simplifying of the circuit and the increasing of the speed of operation have been attained is provided.A pair of complementary output signals amplified to a required signal level by a current switch circuit including differential transistors which receive an input signal and a reference voltage are inputted into a pair of emitter follower circuits. An emitter follower output transistor is driven by an output signal from one emitter follower circuit, while an N-channel MOSFET provided between the output transistor and a current source used as a load is driven by an output signal from the other emitter follower circuit, to obtain a level-amplified output signal from an emitter of the output transistor.The speed of an operation of the circuit device can be increased to a high level owing to a simple circuit in which a level, which is required to attain an output amplitude, of complementary output signals is secured by the current switch circuit, the amplified complementary signals being inputted into the emitter follower circuit to directly drive the output transistor.
摘要:
A semiconductor memory device having a plurality of memory cells each comprising two CMOS inverters cross-coupled to each other and arranged at intersections between a plurality of word lines extending in a column direction and a plurality of complementary data line pairs extending in a row direction; wherein p-channel type load MISFETs of the memory cells arranged in the column direction are formed on the main surface of an n-type well region in the direction in which the word lines extend, the source regions of the p-channel type load MISFETs of the memory cells arranged in the column direction are electrically connected to the n-type well region through conductor layers, and each of the conductor layer is formed independently of the memory cells arranged in the column direction. More specifically, the n-type well regions are fed with a first fixed potential, and the source region of each of the p-channel type load MISFETs is fed with the first fixed potential through the conductor layers which are formed independently.
摘要:
Disclosed are a semiconductor integrated circuit device and methods for production thereof. An embodiment of the invention is a semiconductor chip that comprises fuses constituting part of redundancy circuits formed therein, the fuses being made of the same ingredients as those of a CCB bump substrate metal. The fuses are patterned simultaneously during the patterning of the CCB bump substrate metal. This involves forming the fuses using at least part of the ingredients of an electrode conductor pattern in the chip. The cutting regions of the fuses are made of only one of the metal layers constituting the substrate. The principal plane of the semiconductor chip has a fuse protective film formed over at least the cutting regions of the fuses for protection of the latter. In operation, a switch MOSFET under switching control of a redundancy signal is used to select one of two transmission paths, one carrying an address signal or a decode signal, the other carrying a reference voltage. This allows a faulty circuit to be replaced with the corresponding redundancy circuit.
摘要:
In a semiconductor integrated circuit device having memory cell arrays, power source wirings are provided on the memory cell array in parallel with the long side of the memory cell array, thereby strengthening the power source wirings without increasing a chip size and planning reduction in power source impedances.
摘要:
A semiconductor memory device having a plurality of memory cells each comprising two CMOS inverters cross-coupled to each other and arranged at intersections between a plurality of word lines extending in a column direction and a plurality of complementary data line pairs extending in a row direction; wherein p-channel type load MISFETs of the memory cells arranged in the column direction are formed on the main surface of an n-type well region in the direction in which the word lines extend, the source regions of the p-channel type load MISFETs of the memory cells arranged in the column direction are electrically connected to the n-type well region through conductor layers, and each of the conductor layer is formed independently of the memory cells arranged in the column direction.More specifically, the n-type well regions are fed with a first fixed potential, and the source region of each of the p-channel type load MISFETs is fed with the first fixed potential through the conductor layers which are formed independently.