-
公开(公告)号：US09699905B2
公开(公告)日：2017-07-04
申请号：US14236038
申请日：2013-07-12
发明人： Tomohiro Nishida , Makoto Wakazono , Seiji Mori
CPC分类号： H05K1/181 , H01L23/498 , H01L23/49822 , H01L2924/0002 , H05K1/113 , H05K3/28 , H05K3/3436 , H05K3/4007 , H05K3/4602 , H05K2201/09672 , H05K2201/098 , H05K2201/2072 , H05K2203/0597 , H01L2924/00
摘要： To provide a wiring board ensuring adhesion strength of a connecting terminal to reduce the connecting terminal from being fallen over or peeled off under fabrication process. The wiring board according to the present invention includes a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body and a filling member filled up between the plurality of connecting terminals. The filling member is filled up to a position lower than a height of the plurality of connecting terminals. The connecting terminals has a cross section with a trapezoidal shape where a width of a first principal surface on a side contacting the laminated body is wider than a width of a second principal surface facing the first principal surface.
-
公开(公告)号：US20150027750A1
公开(公告)日：2015-01-29
申请号：US14376744
申请日：2013-04-10
发明人： Tomohiro Nishida , Seiji Mori , Makoto Wakazono
IPC分类号： H05K1/02
CPC分类号： H05K1/0213 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K1/111 , H05K3/244 , H05K3/28 , H05K3/3452 , H05K2201/09881 , H05K2201/099 , H05K2203/0571 , H05K2203/0588 , H01L2924/00012 , H01L2924/00
摘要： To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member.
摘要翻译： 为了提供能够防止连接端子之间短路的布线基板，实现了连接端子间的间距的减小。 本发明的布线基板包括具有一个或多个绝缘层和一个或多个导体层的层状结构，并且布线基板的特征在于，在层叠结构上形成多个连接端子以与其分离 另一个; 填充构件填充在连接端子之间; 并且每个连接端子具有由与填充构件接触的接触表面组成的侧表面和与填充构件不接触并且位于接触表面上方并且位于顶表面下方的间隔表面 的填充构件。
-
公开(公告)号：US09538650B2
公开(公告)日：2017-01-03
申请号：US14416116
申请日：2013-08-23
发明人： Tomohiro Nishida , Seiji Mori , Makoto Wakazono
IPC分类号： H05K1/11 , H01L21/56 , H01L23/14 , H01L23/498 , H01L23/12 , H01L23/13 , H01L23/00 , H05K3/34
CPC分类号： H05K1/11 , H01L21/563 , H01L23/12 , H01L23/13 , H01L23/145 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/1161 , H01L2224/131 , H01L2224/13113 , H01L2224/16238 , H01L2224/2919 , H01L2224/32237 , H01L2224/73204 , H01L2224/81193 , H01L2224/81385 , H01L2224/81447 , H01L2224/81815 , H01L2224/83102 , H01L2224/83385 , H01L2224/8385 , H01L2924/3512 , H01L2924/3841 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K2201/09018 , H05K2201/10977 , H05K2203/0594 , H05K2203/0597 , Y02P70/611 , H01L2924/00014 , H01L2924/014
摘要： In a wiring substrate, formation of voids due to underfill filling failure is suppressed. A wiring substrate includes an insulating base layer, an insulating layer laminated on the base layer, and an electrically conductive connection terminal projecting from the insulating layer inside an opening. The insulating layer has a first surface with an opening, and a second surface located within the opening and being concave toward the base layer in relation to the first surface. The second surface extends from the first surface to the connection terminal inside the opening. On a cut surface which is a flat surface extending along a lamination direction in which the insulating layer is laminated on the base layer, an angle which is larger than 0° but smaller than 90° is formed between a normal line extending from an arbitrary point on the second surface toward the outside of the insulating layer and a parallel line extending from the arbitrary point toward the connection terminal in parallel to the first surface.
摘要翻译： 在布线基板中，由于底部填充不充分而形成空隙被抑制。 布线基板包括绝缘基底层，层叠在基底层上的绝缘层和从开口内的绝缘层突出的导电连接端子。 绝缘层具有带有开口的第一表面和位于开口内的第二表面，并且相对于第一表面朝向基底层凹陷。 第二表面从开口内的第一表面延伸到连接端。 在沿绝缘层层叠在基层上的层叠方向延伸的平坦面的切割面上，在从任意点延伸的法线之间形成大于0°但小于90°的角度 在所述第二表面上朝向所述绝缘层的外侧，以及从所述任意点朝向所述连接端子平行于所述第一表面延伸的平行线。
-
公开(公告)号：US09420703B2
公开(公告)日：2016-08-16
申请号：US14237065
申请日：2013-05-27
发明人： Takahiro Hayashi , Makoto Nagai , Tatsuya Ito , Seiji Mori , Makoto Wakazono , Tomohiro Nishida
IPC分类号： H05K1/00 , H05K3/40 , H01L23/498 , H01L21/48 , H01L23/00 , H05K3/34 , H05K1/02 , H05K1/03 , H05K3/46 , H05K3/28
CPC分类号： H05K3/4007 , H01L21/4846 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/81 , H01L2224/10175 , H01L2224/1134 , H01L2224/1146 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/8114 , H01L2224/81411 , H01L2224/81444 , H01L2224/81455 , H01L2224/81464 , H01L2224/81815 , H01L2924/12042 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K1/0298 , H05K1/0366 , H05K3/28 , H05K3/3452 , H05K3/4661 , H05K3/4688 , H05K2201/09845 , H05K2201/09881 , H05K2201/10674 , H01L2924/00015 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.
摘要翻译： 为了提供布线基板，其中布线导体被形成在层压体的最外层上的精确且刚性的坝部可靠地保护，并且与半导体芯片的连接可靠性优异。 构成该布线基板的层叠体具有作为最外层的导体层的多个连接端子部和布线导体。 布线导体布置在预定位置，通过多个连接端子部分之间用于倒装芯片安装半导体芯片。 层叠体的最外层的树脂绝缘层具有阻挡部和加强部。 大坝部分覆盖布线导体。 加强部分形成在布线导体和与布线导体相邻的连接端子部分之间，比坝部的高度低。 加强部分与坝部分的侧表面连接。
-
公开(公告)号：US20150223332A1
公开(公告)日：2015-08-06
申请号：US14416116
申请日：2013-08-23
发明人： Tomohiro Nishida , Seiji Mori , Makoto Wakazono
IPC分类号： H05K1/11
CPC分类号： H05K1/11 , H01L21/563 , H01L23/12 , H01L23/13 , H01L23/145 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/1161 , H01L2224/131 , H01L2224/13113 , H01L2224/16238 , H01L2224/2919 , H01L2224/32237 , H01L2224/73204 , H01L2224/81193 , H01L2224/81385 , H01L2224/81447 , H01L2224/81815 , H01L2224/83102 , H01L2224/83385 , H01L2224/8385 , H01L2924/3512 , H01L2924/3841 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K2201/09018 , H05K2201/10977 , H05K2203/0594 , H05K2203/0597 , Y02P70/611 , H01L2924/00014 , H01L2924/014
摘要： In a wiring substrate, formation of voids due to underfill filling failure is suppressed. A wiring substrate includes an insulating base layer, an insulating layer laminated on the base layer, and an electrically conductive connection terminal projecting from the insulating layer inside an opening. The insulating layer has a first surface with an opening, and a second surface located within the opening and being concave toward the base layer in relation to the first surface. The second surface extends from the first surface to the connection terminal inside the opening. On a cut surface which is a flat surface extending along a lamination direction in which the insulating layer is laminated on the base layer, an angle which is larger than 0° but smaller than 90° is formed between a normal line extending from an arbitrary point on the second surface toward the outside of the insulating layer and a parallel line extending from the arbitrary point toward the connection terminal in parallel to the first surface.
摘要翻译： 在布线基板中，由于底部填充不充分而形成空隙被抑制。 布线基板包括绝缘基底层，层叠在基底层上的绝缘层和从开口内的绝缘层突出的导电连接端子。 绝缘层具有带有开口的第一表面和位于开口内的第二表面，并且相对于第一表面朝向基底层凹陷。 第二表面从开口内的第一表面延伸到连接端。 在沿绝缘层层叠在基层上的层叠方向延伸的平坦面的切割面上，在从任意点延伸的法线之间形成大于0°但小于90°的角度 在所述第二表面上朝向所述绝缘层的外侧，以及从所述任意点朝向所述连接端子平行于所述第一表面延伸的平行线。
-
公开(公告)号：US09560739B2
公开(公告)日：2017-01-31
申请号：US14376744
申请日：2013-04-10
发明人： Tomohiro Nishida , Seiji Mori , Makoto Wakazono
CPC分类号： H05K1/0213 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K1/111 , H05K3/244 , H05K3/28 , H05K3/3452 , H05K2201/09881 , H05K2201/099 , H05K2203/0571 , H05K2203/0588 , H01L2924/00012 , H01L2924/00
摘要： To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member.
摘要翻译： 为了提供能够防止连接端子之间短路的布线基板，实现了连接端子间的间距的减小。 本发明的布线基板包括具有一个或多个绝缘层和一个或多个导体层的层状结构，并且布线基板的特征在于，在层叠结构上形成多个连接端子以与其分离 另一个; 填充构件填充在连接端子之间; 并且每个连接端子具有由与填充构件接触的接触表面构成的侧表面和与填充构件不接触并且位于接触表面上方并在顶表面下方的间隔表面 的填充构件。
-
公开(公告)号：US09179552B2
公开(公告)日：2015-11-03
申请号：US14235729
申请日：2013-04-10
发明人： Tomohiro Nishida , Seiji Mori , Makoto Wakazono
CPC分类号： H05K3/28 , H01L21/563 , H05K1/11 , H05K3/3436 , H05K3/3452 , H05K2201/09881 , H05K2201/10977 , H05K2203/025 , H05K2203/0783
摘要： To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body, a filling member filled up between the plurality of connecting terminals, and a solder resist layer laminated on the laminated body. The filling member is in contact with at least a part of each side surface of the plurality of connecting terminals. The solder resist layer includes an opening that exposes the plurality of connecting terminals. The filling member has a surface roughness rougher than a surface roughness of a top surface of the solder resist layer.
摘要翻译： 为了获得能够改善底部填充物的流动性的布线板，填充电子部件与布线基板的间隙。 本发明是层叠有绝缘层和导体层的一层以上的层叠体的布线基板。 布线板包括在层叠体上彼此分开形成的多个连接端子，填充在多个连接端子之间的填充部件和层叠在层叠体上的阻焊层。 填充构件与多个连接端子的每个侧表面的至少一部分接触。 阻焊层包括露出多个连接端子的开口。 填充构件具有比阻焊层的顶表面的表面粗糙度更粗糙的表面粗糙度。
-
公开(公告)号：US20150208501A1
公开(公告)日：2015-07-23
申请号：US14417751
申请日：2013-05-17
发明人： Takahiro Hayashi , Makoto Nagai , Seiji Mori , Tomohiro Nishida , Makoto Wakazono , Tatsuya Ito
CPC分类号： H05K1/111 , G03F7/038 , G03F7/20 , G03F7/2024 , G03F7/30 , H01L23/49822 , H01L2224/16237 , H05K1/0298 , H05K3/3436 , H05K3/3452 , H05K3/4644 , H05K2201/09409 , H05K2201/09427 , H05K2201/09709 , H05K2201/09845 , H05K2201/099 , H05K2201/10674 , H05K2203/058 , H05K2203/0594 , H05K2203/1476
摘要： To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction. The solder resist layer 25 includes, within the opening portion 43, a side-surface covering portion 55 that covers the side surface of the connecting terminal portion 41 and a projecting wall portion 56 that is integrally formed with the side-surface covering portion 55 and disposed to project so as to intersect with the connection region 51.
摘要翻译： 提供与半导体芯片的连接可靠性优异的布线板。 在有机布线板10的基板主表面11侧形成有树脂绝缘层21,22和导体层24层叠的第一堆积层31.第一堆积层31中的最外层的导体层24包括 多个用于倒装芯片安装半导体芯片的连接端子部分41。 多个连接端子部分41通过阻焊层25的开口部分43露出。每个连接端子部分41包括用于半导体芯片的连接区域51和从连接区域51延伸的布线区域52 平面方向。 阻焊层25在开口部43内具有覆盖连接端子部41的侧面的侧面覆盖部55和与侧面覆盖部55一体形成的突出壁部56， 被设置为突出以与连接区域51相交。
-
公开(公告)号：US20140284081A1
公开(公告)日：2014-09-25
申请号：US14352299
申请日：2013-08-05
发明人： Tomohiro Nishida , Seiji Mori , Makoto Wakazono
IPC分类号： H05K1/02
CPC分类号： H05K3/3452 , H01L2224/814 , H01L2924/15156 , H05K3/28 , H05K2201/10977 , H05K2203/0594 , H01L2924/014
摘要： A wiring board includes a substrate layer, an insulating layer laminated on the substrate layer and a connection terminal exposed from the insulating layer. The insulating layer has a first surface formed with an opening, a second surface located inside the opening and recessed toward the substrate layer and a wall surface located inside the opening and extending between the first and second surfaces in a lamination direction of the insulating layer. The second surface extends between the wall surface and the connection terminal and has a curved shape being convex toward the substrate layer and including a deepest part closest to the substrate layer so as to satisfy relationship of L1>L2 where L1 is a length between the wall surface and the deepest part in a layer in-plane direction; and L2 is a length between the deepest part and the connection terminal in the layer in-plane direction.
摘要翻译： 布线基板包括基板层，层叠在基板层上的绝缘层和从绝缘层露出的连接端子。 绝缘层具有形成有开口的第一表面，位于开口内部并朝向基底层凹陷的第二表面和位于开口内部并在绝缘层的层叠方向上在第一和第二表面之间延伸的壁表面。 第二表面在壁表面和连接端子之间延伸，并且具有向衬底层凸起的弯曲形状，并且包括最靠近衬底层的最深部分，以便满足L1> L2的关系，其中L1是壁之间的长度 表面和层内面最方向的最深部分; L2是层内面的最深部和连接端子之间的长度。
-
公开(公告)号：US20140196939A1
公开(公告)日：2014-07-17
申请号：US14235729
申请日：2013-04-10
发明人： Tomohiro Nishida , Seiji Mori , Makoto Wakazono
CPC分类号： H05K3/28 , H01L21/563 , H05K1/11 , H05K3/3436 , H05K3/3452 , H05K2201/09881 , H05K2201/10977 , H05K2203/025 , H05K2203/0783
摘要： To obtain a wiring board that allows improving flowability of an underfill to be filled up a clearance between an electronic component and the wiring board. The present invention is a wiring board with a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body, a filling member filled up between the plurality of connecting terminals, and a solder resist layer laminated on the laminated body. The filling member is in contact with at least a part of each side surface of the plurality of connecting terminals. The solder resist layer includes an opening that exposes the plurality of connecting terminals. The filling member has a surface roughness rougher than a surface roughness of a top surface of the solder resist layer.
摘要翻译： 为了获得能够改善底部填充物的流动性的布线板，填充电子部件与布线基板的间隙。 本发明是层叠有绝缘层和导体层的一层以上的层叠体的布线基板。 布线板包括在层叠体上彼此分开形成的多个连接端子，填充在多个连接端子之间的填充部件和层叠在层叠体上的阻焊层。 填充构件与多个连接端子的每个侧表面的至少一部分接触。 阻焊层包括露出多个连接端子的开口。 填充构件具有比阻焊层的顶表面的表面粗糙度更粗糙的表面粗糙度。
-
-
-
-
-
-
-
-
-
搜索结果
13 条记录 (耗时 0.015 秒)
