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公开(公告)号：US09637598B2
公开(公告)日：2017-05-02
申请号：US14766433
申请日：2014-02-03
Inventor： Hiroaki Fujiwara , Yuki Kitai , Hirosuke Saito
IPC: C08L61/04 , C08G73/22 , C08J5/24 , H01L23/29 , H01L23/14 , C08G73/02 , C08K5/378 , C08L79/04 , H05K1/03 , B32B15/14 , C08L63/00 , C08G14/06 , C08L61/34 , B32B15/08 , B32B15/092 , B32B27/04
CPC classification number: C08K5/378 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2305/076 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/3065 , B32B2457/00 , B32B2457/08 , B32B2581/00 , C08G14/06 , C08G59/686 , C08G59/687 , C08G73/0233 , C08G73/22 , C08J5/24 , C08J2379/02 , C08J2379/04 , C08K5/3445 , C08L61/04 , C08L61/34 , C08L63/00 , C08L79/02 , C08L79/04 , C08L2203/20 , H01L23/145 , H01L23/295 , H01L2924/0002 , H05K1/0326 , H05K1/0346 , H05K1/0366 , H05K1/0373 , H05K2201/012 , H05K2201/0129 , H01L2924/00
Abstract: A method of curing a thermosetting resin composition according to the present invention includes mixing a thermosetting resin containing a benzoxazine compound and a curing accelerator containing a triazine thiol compound to prepare a thermosetting resin composition, and heating this thermosetting resin composition to be cured.
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公开(公告)号：US12098257B2
公开(公告)日：2024-09-24
申请号：US17626881
申请日：2020-07-16
Inventor： Hirosuke Saito , Yiqun Wang , Hiroharu Inoue
IPC: C08J5/24 , B32B5/02 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/28 , B32B27/34 , B32B27/36 , B32B27/38 , C08L63/08 , H05K1/03 , H05K3/02
CPC classification number: C08J5/249 , B32B5/02 , B32B15/092 , B32B15/14 , B32B15/20 , B32B27/08 , B32B27/281 , B32B27/286 , B32B27/288 , B32B27/34 , B32B27/36 , B32B27/365 , B32B27/38 , C08J5/24 , C08L63/08 , H05K1/0353 , H05K1/036 , H05K3/022 , B32B2260/046 , B32B2307/206 , B32B2457/04 , B32B2457/08 , C08J2363/08 , C08J2453/00 , C08J2471/12 , C08L2205/03
Abstract: An aspect of the present invention is a resin composition containing a polybutadiene compound having an epoxy group in a molecule, a polyphenylene ether compound having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in a molecule, a styrene-based block copolymer, and a curing agent.
In Formula (1), p represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
In Formula (2), R4 represents a hydrogen atom or an alkyl group.-
公开(公告)号：US11905409B2
公开(公告)日：2024-02-20
申请号：US18112837
申请日：2023-02-22
Inventor： Kosuke Tsuda , Hirosuke Saito , Yiqun Wang , Hiroharu Inoue
CPC classification number: C08L71/126 , C08J5/18 , C08J5/249 , C08K3/36 , H05K1/0373 , C08J2371/12 , C08J2425/16 , C08J2453/02 , C08L2203/16
Abstract: An aspect of the present invention relates to a resin composition containing a polyphenylene ether compound having at least one of the groups represented by Formulas (1) and (2); and an allyl compound having a group represented by Formula (3).
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Patent Agency Ranking
4.发明授权公开(公告)号：US10590223B2
公开(公告)日：2020-03-17
申请号：US14898857
申请日：2014-06-13
Inventor： Yuki Kitai , Hiroaki Fujiwara , Hirosuke Saito
IPC: C08F290/06 , C08J5/24 , B32B15/14 , C08F279/02 , C08G65/48 , C08K5/01 , C08L9/00 , C08L71/12 , H05K1/03 , B32B5/02 , C08K5/03 , C08L51/08
Abstract: A polyphenylene ether resin composition includes (A) a modified polyphenylene ether that is end-modified with a substituent having a carbon-carbon unsaturated double bond, and (B) a crosslinking agent having a carbon-carbon unsaturated double bond. The crosslinking agent serving as component (B) includes from 50 to 100 mass % of (B-1) divinylbenzene and (B-2) polybutadiene. Components (A) and (B) are included in a ratio therebetween, expressed as the mass ratio (A):(B), of from 65:35 to 95:5. Components (B-1) and (B-2) are included in a ratio therebetween, expressed as the mass ratio (B-1):(B-2), of from 1:100 to 1.5:1.
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5.发明授权Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board 有权树脂组合物，树脂清漆，预浸料，覆金属层压板和印刷线路板公开(公告)号：US09567481B2
公开(公告)日：2017-02-14
申请号：US14765678
申请日：2014-01-16
Inventor： Hirosuke Saito , Hiroaki Fujiwara , Yuki Kitai
IPC: C09D163/00 , C08J5/24 , C08G59/18 , C08K5/098 , C08L63/00 , C08L71/12 , H05K1/03 , C08K5/315 , H05K3/02 , C08K3/36 , C08K5/03
CPC classification number: C09D163/00 , C08G59/18 , C08J5/24 , C08J2363/00 , C08J2463/00 , C08K3/36 , C08K5/03 , C08K5/098 , C08K5/315 , C08L63/00 , C08L71/12 , H05K1/0326 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K3/022 , H05K2201/0355 , H05K2203/121
Abstract: The invention relates to a resin composition which is characterized by including: a reaction product that includes (A) a polyphenylene ether having an average of 1.5 to 2 hydroxyl groups per molecule and (B) an epoxy compound having an average of 2 to 2.3 epoxy groups per molecule, wherein the reaction product is obtained by pre-reacting at least a part of hydroxyl groups on the polyphenylene ether (A) with epoxy groups on the epoxy compound (B) so that the concentration of terminal hydroxyl groups on the polyphenylene ether (A) becomes 700 μmol/g or less; (C) a cyanate ester compound; and (D) an organometallic salt.
Abstract translation: 本发明涉及一种树脂组合物，其特征在于包括：反应产物，其包含（A）每分子平均具有1.5至2个羟基的聚苯醚和（B）平均具有2至2.3环氧基的环氧化合物 其中通过使聚苯醚（A）上的至少一部分羟基与环氧化合物（B）上的环氧基反应，使得聚苯醚上的末端羟基的浓度得到，得到反应产物 （A）为700μmol/ g以下; （C）氰酸酯化合物; 和（D）有机金属盐。
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公开(公告)号：US10047213B2
公开(公告)日：2018-08-14
申请号：US15468977
申请日：2017-03-24
Inventor： Hiroaki Fujiwara , Yuki Kitai , Hirosuke Saito
Abstract: A thermosetting resin composition includes a thermosetting resin containing a benzoxazine compound, and a curing accelerator containing a triazine thiol compound. The thermosetting resin contains 0.4 or less equivalents of an epoxy resin relative to one equivalent of the benzoxazine compound.
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7.发明授权公开(公告)号：US09708468B2
公开(公告)日：2017-07-18
申请号：US14775691
申请日：2014-10-23
Inventor： Yuki Kitai , Hiroaki Fujiwara , Hirosuke Saito
IPC: C08K5/521 , C08J5/24 , C08K3/34 , C08L63/00 , C08L101/00 , C08K5/49 , H05K1/03 , B32B15/14 , C08K3/36 , C08K5/5399 , C08G59/40
CPC classification number: C08K5/521 , B32B15/14 , B32B2260/021 , B32B2260/046 , B32B2307/306 , B32B2307/3065 , B32B2457/08 , C08G59/4014 , C08J5/24 , C08J2300/24 , C08J2371/12 , C08K3/34 , C08K3/36 , C08K5/49 , C08K5/5399 , C08K2201/014 , C08L63/00 , C08L71/126 , C08L79/04 , C08L101/00 , H05K1/036 , H05K1/0373 , H05K2201/012 , H05K2201/0209
Abstract: A thermosetting resin composition contains a thermosetting resin, a hardener capable of reacting with the thermosetting resin, and a flame retardant. The flame retardant contains a first phosphor compound compatible with a mixture of the thermosetting resin and the hardener, and a second phosphor compound incompatible with the mixture.
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公开(公告)号：US11477883B2
公开(公告)日：2022-10-18
申请号：US16629811
申请日：2018-06-22
Inventor： Kosuke Tsuda , Hirosuke Saito , Hiroaki Fujiwara
Abstract: A metal-clad laminate includes: an insulating layer; and a metal foil being in contact with at least one surface of the insulating layer. The insulating layer contains a cured product of a resin composition containing a polyphenylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g measured in methylene chloride at 25° C. and having an average of 1.5 to 3 specific groups per molecule at its molecular terminal, a thermosetting curing agent having two or more carbon-carbon unsaturated double bonds at its molecular terminal, and a thermoplastic elastomer. The metal foil includes a metal substrate, and a cobalt-containing barrier layer provided on at least a contact surface of the metal substrate, the contact surface being in contact with the insulating layer. The contact surface has a ten-point average roughness Rz of 2 μm or less as a surface roughness.
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