公开(公告)号：US5570506A

公开(公告)日：1996-11-05

申请号：US463562

申请日：1995-06-05

申请人： Rie Tawata ,  Shunichi Numata ,  Takao Miwa ,  Koji Fujisaki ,  Takayoshi Ikeda ,  Yoshiaki Okabe ,  Hisae Shimanoki

发明人： Rie Tawata ,  Shunichi Numata ,  Takao Miwa ,  Koji Fujisaki ,  Takayoshi Ikeda ,  Yoshiaki Okabe ,  Hisae Shimanoki

IPC分类号： C08G73/10 ,  H01L23/498 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H01K3/22

CPC分类号： H05K3/4655 ,  H01L23/49894 ,  H05K1/0346 ,  H05K3/4673 ,  H05K3/4676 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2203/0759 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49163 ,  Y10T428/31721

摘要： Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film is formed as a highly adhesive film on a low-thermal-expansivity polyimide film in a half-cured state, then metallic wiring is applied thereon, followed by formation of another highly adhesive thin film in a half-cured state, and then a low-thermal-expansivity polyimide film is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film and the wiring pattern layer or the substrate.

摘要翻译： 低热膨胀性聚酰亚胺具有线性刚性骨架，使得完全固化的低热膨胀聚酰亚胺膜之间的粘附性非常低。 另一方面，具有柔性骨架的聚酰亚胺的膜即使在完全固化后也显示出高的粘合性，从而可以通过插入具有柔性骨架的聚酰亚胺来增强低热膨胀性聚酰亚胺膜之间的粘附性。 在半固化状态下在低热膨胀性聚酰亚胺膜上形成柔性聚酰亚胺薄膜作为高粘合剂膜，然后在其上施加金属布线，然后形成半固化状态的另一高粘合性薄膜 然后在其上进一步形成低热膨胀性聚酰亚胺膜。 可以提供具有改善低热膨胀性聚酰亚胺膜和布线图案层或基板之间的粘附性的多层布线结构。

公开(公告)号：US5208066A

公开(公告)日：1993-05-04

申请号：US877391

申请日：1992-04-30

申请人： Koji Fujisaki ,  Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Hisae Shimanoki

发明人： Koji Fujisaki ,  Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Hisae Shimanoki

IPC分类号： G03F7/00 ,  G11B5/31 ,  H01L21/312 ,  H01L21/3213 ,  H01L23/498 ,  H01L23/556 ,  H05K3/28 ,  H05K3/46

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G11B5/3163 ,  H01L21/312 ,  H01L21/32139 ,  H01L23/49894 ,  H01L23/556 ,  H01L2224/48463 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/28 ,  H05K3/4644 ,  Y10S438/953

摘要： A process of forming a patterned polyimide film includes the step of conversion of a polyimide precursor into polyimide. The improvement is imidizing the precursor by means of a chemical imidizing reagent. Typically a film of polyimide precursor is formed on a substrate, and mask which is negative with respect to the desired pattern is formed on the film. The film is contacted through the mask with a chemical imidizing reagent to effect imidization of unmasked portions, thereby forming polyimide. The mask and masked portions of the film are removed, leaving the desired polyimide pattern. High temperatures and harmful etchants can be avoided.

摘要翻译： 形成图案化聚酰亚胺膜的工艺包括将聚酰亚胺前体转化成聚酰亚胺的步骤。 改进之处在于通过化学酰亚胺化试剂将前体酰亚胺化。 通常，在基板上形成聚酰亚胺前体膜，在膜上形成相对于所需图案为负的掩模。 通过掩模将膜与化学酰亚胺化试剂接触以实现未掩蔽部分的酰亚胺化，由此形成聚酰亚胺。 除去膜的掩模和掩蔽部分，留下所需的聚酰亚胺图案。 可以避免高温和有害的蚀刻剂。

公开(公告)号：US5133989A

公开(公告)日：1992-07-28

申请号：US416279

申请日：1989-09-27

申请人： Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Koji Fujisaki ,  Hisae Shimanoki ,  Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Toshio Miyamoto ,  Yukio Okoshi

发明人： Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Koji Fujisaki ,  Hisae Shimanoki ,  Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Toshio Miyamoto ,  Yukio Okoshi

IPC分类号： B32B15/088 ,  B32B15/08 ,  C08G73/10 ,  H01B1/22 ,  H01B3/30 ,  H01L21/48 ,  H01L23/14 ,  H05K1/03

CPC分类号： H05K1/0346 ,  H01B1/22 ,  H01B3/306 ,  H01L21/481 ,  H01L23/145 ,  H01L2224/16225 ,  H01L2924/12044 ,  Y10T428/31681

摘要： The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

公开(公告)号：US5183838A

公开(公告)日：1993-02-02

申请号：US724777

申请日：1991-07-02

申请人： Takao Miwa ,  Takayoshi Ikeda ,  Shunichi Numata ,  Koji Fujisaki ,  Hisae Shimanoki

发明人： Takao Miwa ,  Takayoshi Ikeda ,  Shunichi Numata ,  Koji Fujisaki ,  Hisae Shimanoki

IPC分类号： C07C51/573 ,  C08G73/10 ,  C08L63/00

CPC分类号： C08G73/1003 ,  C07C51/573 ,  C08L63/00

摘要： An acid dianhydride complex which is characterized in anti-hydrolysis, good stability, and high solubility in an organic solvent, is prepared by a reaction of a basic organic compound having a donor number of at least 20 and being free from an active hydrogen atom in the molecule and a carboxylic dianhydride compound.

摘要翻译： 特征在于抗水解，稳定性好，在有机溶剂中的高溶解度的酸二酐络合物是通过具有给体数为20以上且不含活性氢原子的碱性有机化合物的反应制备的 该分子和羧酸二酐化合物。

公开(公告)号：US4759958A

公开(公告)日：1988-07-26

申请号：US76764

申请日：1987-07-23

申请人： Shunichi Numata ,  Ikeda Takayoshi ,  Koji Fujisaki ,  Takao Miwa ,  Noriyuki Kinjo

发明人： Shunichi Numata ,  Ikeda Takayoshi ,  Koji Fujisaki ,  Takao Miwa ,  Noriyuki Kinjo

IPC分类号： B32B27/34 ,  B05D7/24 ,  C08G73/10 ,  C23C14/12 ,  C23C14/24 ,  H01L21/312 ,  C23C16/00

CPC分类号： B05D1/60 ,  H01L21/312

摘要： A method for forming a polyimide film on a substrate surface by chemical vapor deposition comprises evaporating an aromatic monomer compound having one amino group and two adjacent carboxyl groups or its derivative group, such as esters of 4-amino phthalic acid, and 4-(p-anilino) phthalic acid, thus a high strength polyimide is obtained represented by the general formula having its imide groups being unidirectionally arranged in its backbone chain: ##STR1## wherein R is nil or divalent aliphatic or aromatic group and n is an integer.

摘要翻译： 通过化学气相沉积在基板表面上形成聚酰亚胺膜的方法包括蒸发具有一个氨基和两个相邻羧基或其衍生基团的芳族单体化合物，例如4-氨基邻苯二甲酸的酯和4-（p - 苯胺基）邻苯二甲酸，因此由其酰亚胺基团单向排列在其主链中的通式表示的高强度聚酰亚胺：其中R为零或二价脂族或芳族基团，n为整数。

公开(公告)号：US5633112A

公开(公告)日：1997-05-27

申请号：US319788

申请日：1994-10-07

申请人： Takao Miwa ,  Yoshiaki Okabe ,  Mina Ishida ,  Akio Takahashi ,  Shunichi Numata

发明人： Takao Miwa ,  Yoshiaki Okabe ,  Mina Ishida ,  Akio Takahashi ,  Shunichi Numata

IPC分类号： G03F7/004 ,  G03F7/021 ,  G03F7/039 ,  H01L21/027

CPC分类号： G03F7/0212 ,  G03F7/0045

摘要： A photosensitive resin composition comprising (a) a polymer having carboxyl groups (b) a photoacid generator which generates an acid when irradiated with light, and (c) an aliphatic amine is capable of development with ease by use of a wide variety of aqueous solvents.

摘要翻译： 一种感光性树脂组合物，其包含（a）具有羧基的聚合物（b）光照产生酸的光酸产生剂，（c）脂肪族胺可以通过使用多种水性溶剂容易地显影 。

公开(公告)号：US5858584A

公开(公告)日：1999-01-12

申请号：US857675

申请日：1997-05-16

申请人： Yoshiaki Okabe ,  Takao Miwa ,  Yasunari Maekawa ,  Takumi Ueno ,  Geraldine Rames-Langlade ,  Mina Ishida

发明人： Yoshiaki Okabe ,  Takao Miwa ,  Yasunari Maekawa ,  Takumi Ueno ,  Geraldine Rames-Langlade ,  Mina Ishida

IPC分类号： G03F7/022 ,  C08G73/10 ,  C08L79/08 ,  C09D179/08 ,  G03F7/023 ,  G03F7/037

CPC分类号： G03F7/0233 ,  C08G73/10

摘要： A highly reliable positive type photosensitive resin composition composed of diamine having a carboxyl group as a structural unit, which can be developed with an alkaline aqueous solution, comprising polyamic acid ester having hydrophobic group, o-quinonediazidesulfonyl amide compound, and/or o-quinonediazidesulfonyl amide sulfonic ester compound, and electronic devices using the same. A polyamide film having preferable positive type relief patterns, of which the unexposed portion is not corroded, can be obtained.

摘要翻译： 一种高度可靠的正型感光性树脂组合物，其由具有羧基作为结构单元的二胺组成，其可以用碱性水溶液显影，其包含具有疏水基团的聚酰胺酸酯，邻醌二叠氮基酰胺化合物和/或邻醌二叠氮基酰基 酰胺磺酸酯化合物和使用其的电子器件。 可以获得具有未曝光部分未被腐蚀的优选正型浮雕图案的聚酰胺膜。

公开(公告)号：US5686191A

公开(公告)日：1997-11-11

申请号：US553240

申请日：1995-11-07

申请人： Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

发明人： Takao Miwa ,  Masahiro Suzuki ,  Akio Takahashi ,  Yoshiaki Okabe ,  Yuichi Satsu ,  Shin Nishimura

IPC分类号： C08G73/10 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B27/06

CPC分类号： H05K3/4655 ,  C08G73/1039 ,  C08G73/1071 ,  C08K5/3415 ,  C08L79/08 ,  C09J179/08 ,  H05K1/0306 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K3/386 ,  H05K3/4605 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

摘要： A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.

摘要翻译： 包含（A）热固性聚酰亚胺和（B）双马来酰亚胺并且在其热固化期间显示出107至102达因/ cm 2的弹性模量的热固性树脂组合物适用于形成具有优异的薄膜布线板中使用的粘合剂膜 耐热性和高可靠性。

公开(公告)号：US06291619B1

公开(公告)日：2001-09-18

申请号：US09355506

申请日：1999-07-29

申请人： Yasunari Maekawa ,  Takao Miwa ,  Takumi Ueno ,  Yoshiaki Okabe

发明人： Yasunari Maekawa ,  Takao Miwa ,  Takumi Ueno ,  Yoshiaki Okabe

IPC分类号： C08F12600

CPC分类号： G03F7/0387 ,  G03F7/0045 ,  G03F7/0125 ,  G03F7/0233 ,  G03F7/039 ,  H01L21/312

摘要： A photosensitive composition comprising a polyimide precursor, a photosensitive material having a structure represented by the following formula wherein A1 is an atom belonging to Group VI of the periodic table, in the molecule thereof and/or a photosensitive material having a structure represented by the following formula: wherein A2 is O, S or N atom, in the molecule thereof is suitable for formation of a positive tone pattern excellent in heat resistance, and applicable to electronic devices.

摘要翻译： 包含聚酰亚胺前体的光敏组合物，具有由下列化学式A1表示的结构的感光材料是分子中属于周期表第VI族的原子和/或具有由下式表示的结构的感光材料 ：其中A2是O，S或N原子，其分子中适用于形成耐热性优异的正色调图案，并且适用于电子器件。

公开(公告)号：US07790248B2

公开(公告)日：2010-09-07

申请号：US11708462

申请日：2007-02-21

申请人： Yasushi Tomioka ,  Takao Miwa ,  Katsumi Kondo ,  Hisao Yokokura

发明人： Yasushi Tomioka ,  Takao Miwa ,  Katsumi Kondo ,  Hisao Yokokura

IPC分类号： G02F1/1337 ,  C09K19/56

CPC分类号： G02F1/134363 ,  G02F1/1337 ,  G02F1/133784 ,  G02F1/133788 ,  G02F2001/133397 ,  G02F2202/023 ,  Y10T428/10 ,  Y10T428/1005 ,  Y10T428/1018 ,  Y10T428/1023

摘要： An active matrix type liquid crystal display apparatus has a pair of substrates, at least one of the substrates being transparent; a liquid crystal layer arranged between the pair of substrates; and electrode structure for generating an electric field having a dominant component parallel to a surface of the substrate and passing through the liquid crystal layer, the electrode structure being formed on one of the pair of substrates; a pair of alignment layers formed on respective surfaces in contact with the liquid crystal layer of the pair of substrates; and a pair of polarizing plates arranged so as to sandwich the pair of substrates, wherein the glass transition temperature Tg of a boundary surface between said liquid crystal layer and the alignment layer is higher than the nematic-isotropic phase transition temperature T(N−I) of a liquid crystal composite forming the liquid crystal layer.

摘要翻译： 有源矩阵型液晶显示装置具有一对基板，至少一个基板是透明的; 布置在所述一对基板之间的液晶层; 以及电极结构，用于产生具有平行于所述基板的表面的主要分量并通过所述液晶层的电场，所述电极结构形成在所述一对基板中的一个基板上; 一对取向层，形成在与所述一对基板的液晶层接触的各表面上; 以及一对偏振片，其被布置成夹持所述一对基板，其中所述液晶层和所述取向层之间的边界面的玻璃化转变温度Tg高于向列相向相变温度T（N-1 ）形成液晶层的液晶复合体。