公开(公告)号：US5633112A

公开(公告)日：1997-05-27

申请号：US319788

申请日：1994-10-07

申请人： Takao Miwa ,  Yoshiaki Okabe ,  Mina Ishida ,  Akio Takahashi ,  Shunichi Numata

发明人： Takao Miwa ,  Yoshiaki Okabe ,  Mina Ishida ,  Akio Takahashi ,  Shunichi Numata

IPC分类号： G03F7/004 ,  G03F7/021 ,  G03F7/039 ,  H01L21/027

CPC分类号： G03F7/0212 ,  G03F7/0045

摘要： A photosensitive resin composition comprising (a) a polymer having carboxyl groups (b) a photoacid generator which generates an acid when irradiated with light, and (c) an aliphatic amine is capable of development with ease by use of a wide variety of aqueous solvents.

摘要翻译： 一种感光性树脂组合物，其包含（a）具有羧基的聚合物（b）光照产生酸的光酸产生剂，（c）脂肪族胺可以通过使用多种水性溶剂容易地显影 。

公开(公告)号：US5570506A

公开(公告)日：1996-11-05

申请号：US463562

申请日：1995-06-05

申请人： Rie Tawata ,  Shunichi Numata ,  Takao Miwa ,  Koji Fujisaki ,  Takayoshi Ikeda ,  Yoshiaki Okabe ,  Hisae Shimanoki

发明人： Rie Tawata ,  Shunichi Numata ,  Takao Miwa ,  Koji Fujisaki ,  Takayoshi Ikeda ,  Yoshiaki Okabe ,  Hisae Shimanoki

IPC分类号： C08G73/10 ,  H01L23/498 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H01K3/22

CPC分类号： H05K3/4655 ,  H01L23/49894 ,  H05K1/0346 ,  H05K3/4673 ,  H05K3/4676 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2203/0759 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49163 ,  Y10T428/31721

摘要： Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film is formed as a highly adhesive film on a low-thermal-expansivity polyimide film in a half-cured state, then metallic wiring is applied thereon, followed by formation of another highly adhesive thin film in a half-cured state, and then a low-thermal-expansivity polyimide film is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film and the wiring pattern layer or the substrate.

摘要翻译： 低热膨胀性聚酰亚胺具有线性刚性骨架，使得完全固化的低热膨胀聚酰亚胺膜之间的粘附性非常低。 另一方面，具有柔性骨架的聚酰亚胺的膜即使在完全固化后也显示出高的粘合性，从而可以通过插入具有柔性骨架的聚酰亚胺来增强低热膨胀性聚酰亚胺膜之间的粘附性。 在半固化状态下在低热膨胀性聚酰亚胺膜上形成柔性聚酰亚胺薄膜作为高粘合剂膜，然后在其上施加金属布线，然后形成半固化状态的另一高粘合性薄膜 然后在其上进一步形成低热膨胀性聚酰亚胺膜。 可以提供具有改善低热膨胀性聚酰亚胺膜和布线图案层或基板之间的粘附性的多层布线结构。

公开(公告)号：US4759958A

公开(公告)日：1988-07-26

申请号：US76764

申请日：1987-07-23

申请人： Shunichi Numata ,  Ikeda Takayoshi ,  Koji Fujisaki ,  Takao Miwa ,  Noriyuki Kinjo

发明人： Shunichi Numata ,  Ikeda Takayoshi ,  Koji Fujisaki ,  Takao Miwa ,  Noriyuki Kinjo

IPC分类号： B32B27/34 ,  B05D7/24 ,  C08G73/10 ,  C23C14/12 ,  C23C14/24 ,  H01L21/312 ,  C23C16/00

CPC分类号： B05D1/60 ,  H01L21/312

摘要： A method for forming a polyimide film on a substrate surface by chemical vapor deposition comprises evaporating an aromatic monomer compound having one amino group and two adjacent carboxyl groups or its derivative group, such as esters of 4-amino phthalic acid, and 4-(p-anilino) phthalic acid, thus a high strength polyimide is obtained represented by the general formula having its imide groups being unidirectionally arranged in its backbone chain: ##STR1## wherein R is nil or divalent aliphatic or aromatic group and n is an integer.

摘要翻译： 通过化学气相沉积在基板表面上形成聚酰亚胺膜的方法包括蒸发具有一个氨基和两个相邻羧基或其衍生基团的芳族单体化合物，例如4-氨基邻苯二甲酸的酯和4-（p - 苯胺基）邻苯二甲酸，因此由其酰亚胺基团单向排列在其主链中的通式表示的高强度聚酰亚胺：其中R为零或二价脂族或芳族基团，n为整数。

公开(公告)号：US5183838A

公开(公告)日：1993-02-02

申请号：US724777

申请日：1991-07-02

申请人： Takao Miwa ,  Takayoshi Ikeda ,  Shunichi Numata ,  Koji Fujisaki ,  Hisae Shimanoki

发明人： Takao Miwa ,  Takayoshi Ikeda ,  Shunichi Numata ,  Koji Fujisaki ,  Hisae Shimanoki

IPC分类号： C07C51/573 ,  C08G73/10 ,  C08L63/00

CPC分类号： C08G73/1003 ,  C07C51/573 ,  C08L63/00

摘要： An acid dianhydride complex which is characterized in anti-hydrolysis, good stability, and high solubility in an organic solvent, is prepared by a reaction of a basic organic compound having a donor number of at least 20 and being free from an active hydrogen atom in the molecule and a carboxylic dianhydride compound.

摘要翻译： 特征在于抗水解，稳定性好，在有机溶剂中的高溶解度的酸二酐络合物是通过具有给体数为20以上且不含活性氢原子的碱性有机化合物的反应制备的 该分子和羧酸二酐化合物。

公开(公告)号：US5208066A

公开(公告)日：1993-05-04

申请号：US877391

申请日：1992-04-30

申请人： Koji Fujisaki ,  Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Hisae Shimanoki

发明人： Koji Fujisaki ,  Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Hisae Shimanoki

IPC分类号： G03F7/00 ,  G11B5/31 ,  H01L21/312 ,  H01L21/3213 ,  H01L23/498 ,  H01L23/556 ,  H05K3/28 ,  H05K3/46

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G11B5/3163 ,  H01L21/312 ,  H01L21/32139 ,  H01L23/49894 ,  H01L23/556 ,  H01L2224/48463 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/28 ,  H05K3/4644 ,  Y10S438/953

摘要： A process of forming a patterned polyimide film includes the step of conversion of a polyimide precursor into polyimide. The improvement is imidizing the precursor by means of a chemical imidizing reagent. Typically a film of polyimide precursor is formed on a substrate, and mask which is negative with respect to the desired pattern is formed on the film. The film is contacted through the mask with a chemical imidizing reagent to effect imidization of unmasked portions, thereby forming polyimide. The mask and masked portions of the film are removed, leaving the desired polyimide pattern. High temperatures and harmful etchants can be avoided.

摘要翻译： 形成图案化聚酰亚胺膜的工艺包括将聚酰亚胺前体转化成聚酰亚胺的步骤。 改进之处在于通过化学酰亚胺化试剂将前体酰亚胺化。 通常，在基板上形成聚酰亚胺前体膜，在膜上形成相对于所需图案为负的掩模。 通过掩模将膜与化学酰亚胺化试剂接触以实现未掩蔽部分的酰亚胺化，由此形成聚酰亚胺。 除去膜的掩模和掩蔽部分，留下所需的聚酰亚胺图案。 可以避免高温和有害的蚀刻剂。

公开(公告)号：US5133989A

公开(公告)日：1992-07-28

申请号：US416279

申请日：1989-09-27

申请人： Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Koji Fujisaki ,  Hisae Shimanoki ,  Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Toshio Miyamoto ,  Yukio Okoshi

发明人： Shunichi Numata ,  Takao Miwa ,  Takayoshi Ikeda ,  Koji Fujisaki ,  Hisae Shimanoki ,  Kunio Miyazaki ,  Osamu Miura ,  Ryuji Watanabe ,  Toshio Miyamoto ,  Yukio Okoshi

IPC分类号： B32B15/088 ,  B32B15/08 ,  C08G73/10 ,  H01B1/22 ,  H01B3/30 ,  H01L21/48 ,  H01L23/14 ,  H05K1/03

CPC分类号： H05K1/0346 ,  H01B1/22 ,  H01B3/306 ,  H01L21/481 ,  H01L23/145 ,  H01L2224/16225 ,  H01L2924/12044 ,  Y10T428/31681

摘要： The present invention provides a process for producing a metal-polyimide composite material such as a wiring board. In production thereof, deterioration of polyamide film due to oxidation during imidization of a polyimide precursor in contact with metal such as copper or silver can be prevented. The present invention is characterized by using a polyimide precursor having an acidic functional group which is masked. Examples of the polyamide precursor are polyamic acid epoxy adducts, amido polyamic acids, silylated polyamic acids, etc.

公开(公告)号：US5350886A

公开(公告)日：1994-09-27

申请号：US659672

申请日：1991-02-25

申请人： Kunio Miyazaki ,  Yutaka Sugita ,  Akio Mukoh ,  Tadahiko Miyoshi ,  Osamu Miura ,  Akio Takahashi ,  Shunichi Numata ,  Satoru Ogihara ,  Kazuji Yamada ,  Hirokazu Inoue ,  Fumiyuki Kobayashi

发明人： Kunio Miyazaki ,  Yutaka Sugita ,  Akio Mukoh ,  Tadahiko Miyoshi ,  Osamu Miura ,  Akio Takahashi ,  Shunichi Numata ,  Satoru Ogihara ,  Kazuji Yamada ,  Hirokazu Inoue ,  Fumiyuki Kobayashi

IPC分类号： H01L23/538 ,  H05K1/03 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L23/5385 ,  H05K3/462 ,  H05K3/4629 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0379 ,  H05K2203/061

摘要： An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.

摘要翻译： 一种具有多层薄膜布线部分的LSI安装基板，薄膜布线部分被分成多个布线层的布线单元，各单元之间的布线通过与 该单元的表面导电层的那个。

公开(公告)号：US5219706A

公开(公告)日：1993-06-15

申请号：US825783

申请日：1992-01-21

申请人： Seiji Tai ,  Shigeru Hayashida ,  Nobuyuki Hayashi ,  Yasushi Iwakabe ,  Shunichi Numata ,  Noriyuki Kinjo ,  Susumu Era ,  Setsuo Kobayashi ,  Akio Mukoh ,  Yoshio Sato

发明人： Seiji Tai ,  Shigeru Hayashida ,  Nobuyuki Hayashi ,  Yasushi Iwakabe ,  Shunichi Numata ,  Noriyuki Kinjo ,  Susumu Era ,  Setsuo Kobayashi ,  Akio Mukoh ,  Yoshio Sato

IPC分类号： C07D487/22 ,  C09B47/067 ,  G11B7/248

CPC分类号： C07D487/22 ,  C09B47/0678 ,  G11B7/248 ,  Y10S430/165

摘要： There are disclosed a novel naphthalocyanine derivative represented by the general formula [I] or [II] shown below, a process for preparing said derivative, an optical information recording medium using said derivative, and a process for preparing thereof: ##STR1## wherein M is a metal, metal oxide, metal hydroxide and the like, R.sup.1 is an alkyl group of 1-22 carbon atoms, n is an integer of 1 to 4, and Y.sub.1 and Y.sub.2 aryloxy group and the like.

摘要翻译： 公开了由下述通式[I]或[II]表示的新型萘酞菁衍生物，所述衍生物的制备方法，使用该衍生物的光学信息记录介质及其制备方法： ）或者其中M为金属，金属氧化物，金属氢氧化物等的化合物（II），R1为1-22个碳原子的烷基，n为1〜4的整数，Y1和Y2的芳氧基 等等。

公开(公告)号：US5194579A

公开(公告)日：1993-03-16

申请号：US609103

申请日：1990-11-05

申请人： Shunichi Numata ,  Kooji Fujisaki ,  Noriyuki Kinjo

发明人： Shunichi Numata ,  Kooji Fujisaki ,  Noriyuki Kinjo

IPC分类号： C08G73/10

CPC分类号： C08G73/1067

摘要： Polyimides represented by general formula (I), (wherein Ar.sub.1 and Ar.sub.2 each represents an aromatic ring-containing group, Cf represents a fluorinated alkyl group directly bonded to Ar.sub.1, and m.gtoreq.1), and polyamide acids as their percursors. The polyimides have excellent humidity resistance and heat resistance, thus being useful as coating materials for semiconductor chips and insulating films for multi-layered wiring. ##STR1##

摘要翻译： 由通式（I）表示的聚酰亚胺（其中Ar1和Ar2各自表示含芳环的基团，Cf表示与Ar1直接键合的氟化烷基，m≥0），聚酰胺酸作为其前体。 聚酰亚胺具有优异的耐湿性和耐热性，因此可用作半导体芯片用涂料和多层布线用绝缘膜。 （一）

公开(公告)号：USRE34885E

公开(公告)日：1995-03-28

申请号：US905407

申请日：1992-06-29

申请人： Hisao Yokokura ,  Tadao Nakata ,  Susumu Era ,  Yasuo Hanawa ,  Kishiro Iwasaki ,  Teruo Kitamura ,  Akio Mukoh ,  Toshikazu Narahara ,  Yasuhiko Kando ,  Shunichi Numata ,  Kooji Fujisaki

发明人： Hisao Yokokura ,  Tadao Nakata ,  Susumu Era ,  Yasuo Hanawa ,  Kishiro Iwasaki ,  Teruo Kitamura ,  Akio Mukoh ,  Toshikazu Narahara ,  Yasuhiko Kando ,  Shunichi Numata ,  Kooji Fujisaki

IPC分类号： G02F1/133 ,  C08G73/10 ,  G02F1/1337 ,  G02F1/139 ,  G02F1/13 ,  C09K19/52

CPC分类号： C08G73/1039 ,  C08G73/105 ,  G02F1/133723 ,  G02F1/1397 ,  Y10T428/1014 ,  Y10T428/1023

摘要： A liquid crystal display element comprising a pair of substrates, a pair of electrodes provided on the respective substrates, at least one of which is transparent and a liquid crystal layer disposed between said substrates, the liquid crystal layer comprising a nematic liquid crystal, which exhibits a positive dielectric constant anisotropy and contains an optically active substance, the liquid crystal moleccule orientation direction in the liquid crystal layer is twisted in the range of 200.degree. to 250.degree. from the one substrate surface toward the other substrate surface so as to form a helical structure therein. A polyimide orientation film is provided between the electrodes and the liquid crystal layer. The polyimide orientation film is one made of a polyimide prepared by reacting a diamine compound having a long-chain hydrocarbon group or a diamine compound having a trifluoromethyl group with a tetracarboxylic dianhydride and causes a pretilt angle of at least 3.degree. relative to the nematic liquid crystal molecules. The liquid crystal display element of the present invention is free from a scattering domain.