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43 条记录 (耗时 0.033 秒)

    Electronic appliance using heat radiation plate
    2.
    发明申请
    Electronic appliance using heat radiation plate 审中-公开
    电子电器采用散热板

    公开(公告)号：US20060191894A1

    公开(公告)日：2006-08-31

    申请号：US11362121

    申请日：2006-02-27

    申请人： Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue ,  Noriaki Kojima ,  Hiroyuki Watanabe ,  Shinya Nakano

    发明人： Ryosuke Usui ,  Hideki Mizuhara ,  Yasunori Inoue ,  Noriaki Kojima ,  Hiroyuki Watanabe ,  Shinya Nakano

    IPC分类号： H05B3/68

    CPC分类号： G06F1/203 ,  H05K7/20445

    摘要： In a heat radiation structure for an electronic appliance in which heat generated in a heat generating member inside a flap of the electronic appliance is radiated to a space outside the flap, a heat radiation plate integrally formed with a circuit element is thermally coupled to the heat generating member and is exposed outside the flap. Heat generated in the heat generating member is conducted to the heat radiation plate via a contact portion and is radiated to a space outside the flap from an exposed surface along with heat generated in the circuit element.

    摘要翻译： 在用于电子设备的热辐射结构中，其中在电子设备的翼片内的发热元件中产生的热量辐射到翼片外部的空间，与电路元件整体形成的散热板热耦合到热 并且暴露在皮瓣外部。 在发热元件中产生的热量经由接触部分被传导到散热板，并且随着在电路元件中产生的热量从露出的表面辐射到翼片之外的空间。

    Semiconductor device including insulation film and fabrication method thereof
    6.
    发明授权
    Semiconductor device including insulation film and fabrication method thereof 失效
    包括绝缘膜的半导体器件及其制造方法

    公开(公告)号：US06288438B1

    公开(公告)日：2001-09-11

    申请号：US08923901

    申请日：1997-09-04

    申请人： Hideki Mizuhara ,  Hiroyuki Watanabe ,  Noriaki Kojima

    发明人： Hideki Mizuhara ,  Hiroyuki Watanabe ,  Noriaki Kojima

    IPC分类号： H01L2358

    CPC分类号： H01L21/76859 ,  H01L21/76801 ,  H01L21/76802 ,  H01L21/76825 ,  H01L21/76829 ,  H01L21/7685 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device that allows improvement in adhesion between insulation films having a 2-layered structure together with improvement of planarization and film characteristics, and a fabrication method thereof are obtained. In the fabrication method of the semiconductor device, an insulation film of a 2-layered structure having at least an upper layer and a lower layer is formed on a semiconductor substrate. Then, impurities are introduced into the upper insulation film under a condition where impurities arrive at least at the interface between the upper insulation film and the lower insulation film. By improving the adhesion between the upper and lower insulation films, the upper insulation film does not easily peel off.

    摘要翻译： 获得能够提高具有2层结构的绝缘膜与提高平坦化和膜特性之间的粘附性的半导体器件及其制造方法。 在半导体器件的制造方法中，在半导体衬底上形成至少具有上层和下层的2层结构的绝缘膜。 然后，杂质至少在上绝缘膜和下绝缘膜之间的界面处到达上述绝缘膜的情况下被引入。 通过改善上下绝缘膜之间的粘附性，上绝缘膜不容易剥离。

    Machine tool and machining control device thereof
    7.
    发明授权
    Machine tool and machining control device thereof 有权

    公开(公告)号：US09690281B2

    公开(公告)日：2017-06-27

    申请号：US14003822

    申请日：2012-03-23

    申请人： Takayuki Kataoka ,  Eiji Nabata ,  Noriaki Kojima

    发明人： Takayuki Kataoka ,  Eiji Nabata ,  Noriaki Kojima

    IPC分类号： G05B19/18 ,  G05B19/40 ,  G05B19/404

    CPC分类号： G05B19/18 ,  G05B19/404 ,  G05B2219/41115

    摘要： A machining control device controls spindle rotational speed. A set of stability limit curve data is stored indicating a relation between a spindle rotational speed and a limit cutting-in amount whereby chatter vibrations are inhibited. Spindle rotational speed and tool cutting-in amount in starting machining are set based on the data. Vibrations of the spindle are detected during cutting. Whether chatter vibrations have occurred is determined based on vibrations detection. Spindle rotational speed is controlled with reference to the data to inhibit chatter vibrations. Cutting-in amount in starting machining is set to be less than a maximum cutting-in amount within a stable region of the data, and spindle rotational speed in starting machining is set to be less than a rotational speed when the cutting-in amount is maximum within the stable region. Spindle rotational speed is increased by an amount of a predetermined rotational speed when chatter vibrations have occurred.

    Digital camera for recording a still image while shooting a moving image
    8.
    发明授权
    Digital camera for recording a still image while shooting a moving image 有权

    公开(公告)号：US08134612B2

    公开(公告)日：2012-03-13

    申请号：US12076716

    申请日：2008-03-21

    申请人： Shigeyuki Okada ,  Noriaki Kojima ,  Hiroshi Hanafusa

    发明人： Shigeyuki Okada ,  Noriaki Kojima ,  Hiroshi Hanafusa

    IPC分类号： H04N5/76 ,  H04N5/222

    CPC分类号： H04N1/212 ,  H04N1/2112 ,  H04N1/2137 ,  H04N5/23293 ,  H04N5/772 ,  H04N5/907 ,  H04N9/7921

    摘要： In a digital camera, when snapshot shooting is instructed during recording of a moving image, a shot still image is temporarily pushed aside in a memory area for use in pushing aside (7a) in a frame buffer (7). A currently shooting motion image and a still image are displayed in parallel on a display (9), so that a user can confirm a content of a snapshot. The moving image continues to be recorded even during a push-aside operation. After a moving image processing is completed, the still image is processed by an image correcting circuit (4). The frame buffer (7) comprises a plurality of frame recording areas, and is shared on the occasions of a moving image processing and a still image processing. In a normal moving image processing, these areas are utilized in a cyclic manner, and when the still image is shot, any of areas will be utilized. Thereafter, the rest of areas are utilized in the cyclic manner for the moving images. The recording function for the moving image and still image is improved at low cost, it becomes easy to take a snapshot, and the merchandise size is not increased.