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    Laptop-size high-order harmonic generation apparatus using near field enhancement
    1.
    发明授权
    Laptop-size high-order harmonic generation apparatus using near field enhancement 失效
    使用近场增强的笔记本电脑大型高次谐波发生装置

    公开(公告)号：US08009350B2

    公开(公告)日：2011-08-30

    申请号：US12366634

    申请日：2009-02-05

    申请人： Seung-Woo Kim ,  Jong-Han Jin ,  Seung-Chul Kim ,  In-Yong Park

    发明人： Seung-Woo Kim ,  Jong-Han Jin ,  Seung-Chul Kim ,  In-Yong Park

    IPC分类号： G02F2/02 ,  G02F1/35 ,  H01S3/10

    CPC分类号： G02F1/353 ,  G02F2001/354 ,  G02F2203/10 ,  H01S3/0092 ,  H01S3/1625 ,  H01S3/1636

    摘要： Disclosed herein is a laptop-size high-order harmonic generation apparatus using near field enhancement. The laptop-size high-order harmonic generation apparatus using near field enhancement includes a femtosecond laser generator, light transfer means for transferring light output from the femtosecond laser generator, micro patterns formed of metallic thin films and configured to have nano-sized apertures for generating near field enhancement when the light output from the light transfer means passes through the micro patterns, a gas supply unit for supplying inert gas to the light when the light transferred through the light transfer means passes through the micro patterns, and a vacuum chamber for accommodating the micro patterns and the gas supply unit under a vacuum atmosphere.

    摘要翻译： 本文公开了一种使用近场增强的笔记本电脑大型高次谐波产生装置。 使用近场增强的膝上型计算机大型高次谐波发生装置包括飞秒激光发生器，用于传送从飞秒激光发生器输出的光的光传输装置，由金属薄膜形成的微图案，并且被配置为具有用于产生的纳米尺寸的孔 当来自光传输装置的光输出通过微图案时的近场增强;气体供应单元，用于当通过光传输装置转移的光通过微图形时，向光提供惰性气体;以及真空室，用于容纳 微图案和气体供应单元在真空气氛下。

    LAPTOP-SIZE HIGH-ORDER HARMONIC GENERATION APPARATUS USING NEAR FIELD ENHANCEMENT
    2.
    发明申请
    LAPTOP-SIZE HIGH-ORDER HARMONIC GENERATION APPARATUS USING NEAR FIELD ENHANCEMENT 失效
    使用近场增强的LAPTOP-SIZE高阶谐波发生装置

    公开(公告)号：US20100098118A1

    公开(公告)日：2010-04-22

    申请号：US12366634

    申请日：2009-02-05

    申请人： Seung-Woo Kim ,  Jong-Han Jin ,  Seung-Chul Kim ,  In-Yong Park

    发明人： Seung-Woo Kim ,  Jong-Han Jin ,  Seung-Chul Kim ,  In-Yong Park

    IPC分类号： H01S3/10 ,  H01S3/22

    CPC分类号： G02F1/353 ,  G02F2001/354 ,  G02F2203/10 ,  H01S3/0092 ,  H01S3/1625 ,  H01S3/1636

    摘要： Disclosed herein is a laptop-size high-order harmonic generation apparatus using near field enhancement. The laptop-size high-order harmonic generation apparatus using near field enhancement includes a femtosecond laser generator, light transfer means for transferring light output from the femtosecond laser generator, micro patterns formed of metallic thin films and configured to have nano-sized apertures for generating near field enhancement when the light output from the light transfer means passes through the micro patterns, a gas supply unit for supplying inert gas to the light when the light transferred through the light transfer means passes through the micro patterns, and a vacuum chamber for accommodating the micro patterns and the gas supply unit under a vacuum atmosphere.

    摘要翻译： 本文公开了一种使用近场增强的笔记本电脑大型高次谐波产生装置。 使用近场增强的膝上型计算机大型高次谐波发生装置包括飞秒激光发生器，用于传送从飞秒激光发生器输出的光的光传输装置，由金属薄膜形成的微图案，并且被配置为具有用于产生的纳米尺寸的孔 当来自光传输装置的光输出通过微图案时的近场增强;气体供应单元，用于当通过光传输装置转移的光通过微图形时，向光提供惰性气体;以及真空室，用于容纳 微图案和气体供应单元在真空气氛下。

    Method of manufacturing printed circuit board
    5.
    发明申请
    Method of manufacturing printed circuit board 审中-公开
    制造印刷电路板的方法

    公开(公告)号：US20090136656A1

    公开(公告)日：2009-05-28

    申请号：US12213700

    申请日：2008-06-23

    申请人： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

    发明人： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

    IPC分类号： H05K3/02

    CPC分类号： H05K3/427 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/421 ,  H05K2201/0175 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/1152

    摘要： A method of manufacturing a printed circuit board is disclosed. The method may include: stacking an anti-plating layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove, by removing a portion of the anti-plating layer and a portion of the copper clad laminate; stacking a seed layer over a surface of the intaglio groove; forming a plating layer, by plating an inside of the intaglio groove; and removing the anti-plating layer and the copper foil.

    摘要翻译： 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上堆叠防镀层，对于包括层叠在绝缘层的一侧上的铜箔的覆铜层压板; 通过去除所述防镀层的一部分和所述覆铜层压板的一部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽的表面上; 通过电镀凹版凹槽的内部形成镀层; 并且去除防镀层和铜箔。

    SELF-CONTROLLED FUNCTIONAL MODULE, AND CONTROL METHOD THEREFOR AND SYSTEM USING THE SAME
    7.
    发明申请
    SELF-CONTROLLED FUNCTIONAL MODULE, AND CONTROL METHOD THEREFOR AND SYSTEM USING THE SAME 审中-公开
    自控功能模块及其使用的控制方法及系统

    公开(公告)号：US20090013093A1

    公开(公告)日：2009-01-08

    申请号：US12111522

    申请日：2008-04-29

    申请人： Wonjong KIM ,  Seung-Chul Kim ,  Han-Jin Cho

    发明人： Wonjong KIM ,  Seung-Chul Kim ,  Han-Jin Cho

    IPC分类号： G06F3/00

    CPC分类号： G06F9/3867

    摘要： Provided are a self-controlled functional module, and a control method therefor and a system using the same. The functional module, includes: a data input unit for receiving data; a function process unit for performing a specific function based on input data transmitted through the data input unit; a data output unit for outputting a result processed by the function process unit; and an operation control unit for receiving state information individually from the data input unit and the data output unit and controlling operation start of the function process unit based on state information of the data input unit and the data output unit.

    摘要翻译： 提供了一种自我控制的功能模块及其控制方法和使用该功能模块的系统。 功能模块包括：用于接收数据的数据输入单元; 功能处理单元，用于基于通过数据输入单元发送的输入数据执行特定功能; 数据输出单元，用于输出由功能处理单元处理的结果; 以及操作控制单元，用于基于数据输入单元和数据输出单元的状态信息，从数据输入单元和数据输出单元接收状态信息，并且控制功能处理单元的操作开始。

    Method of manufacturing printed circuit board
    8.
    发明授权
    Method of manufacturing printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号：US08074352B2

    公开(公告)日：2011-12-13

    申请号：US12213365

    申请日：2008-06-18

    申请人： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

    发明人： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Soon-Jin Cho

    IPC分类号： H05K3/04 ,  H05K3/06 ,  H05K3/42

    CPC分类号： H05K3/107 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/045 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0577 ,  H05K2203/0723 ,  H05K2203/1152 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

    摘要： A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

    摘要翻译： 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上顺序层叠耐酸性第一覆盖层和耐碱性第二覆盖层，对于包含层叠在绝缘层一侧的铜箔的覆铜层压板， 通过去除第二覆盖层，第一覆盖层和覆铜层压板的部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽和第二覆盖层上; 通过剥离所述第二覆盖层去除层叠在所述第二覆盖层上的所述种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 剥离第一覆盖层; 以及去除通过剥离第一覆盖层而暴露的铜箔。

    Method of manufacturing printed circuit board
    9.
    发明申请
    Method of manufacturing printed circuit board 审中-公开
    制造印刷电路板的方法

    公开(公告)号：US20090134118A1

    公开(公告)日：2009-05-28

    申请号：US12213699

    申请日：2008-06-23

    申请人： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Sooh-Jin Cho

    发明人： Dong-Jin Park ,  Seung-Hyun Jung ,  Seung-Chul Kim ,  Sooh-Jin Cho

    IPC分类号： H01B13/00

    CPC分类号： H05K3/107 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/045 ,  H05K3/421 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/025 ,  H05K2203/0723 ,  H05K2203/1152

    摘要： A method of manufacturing a printed circuit board is disclosed. The method may include: stacking a cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the cover layer and the copper clad laminate; stacking a seed layer over a surface of the intaglio groove and the cover layer; removing a portion of the seed layer stacked over the cover layer, by removing a portion of the cover layer; forming a plating layer, by plating an inside of the intaglio groove; and removing the remaining cover layer and the copper foil.

    摘要翻译： 公开了一种制造印刷电路板的方法。 该方法可以包括：在铜箔上堆叠覆盖层，用于包括在绝缘层的一侧上堆叠的铜箔的覆铜层压板; 通过去除覆盖层和覆铜层压板的部分形成凹版凹槽; 将种子层堆叠在凹版凹槽和覆盖层的表面上; 通过去除覆盖层的一部分来去除层叠在覆盖层上的种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 并除去剩余的覆盖层和铜箔。