公开(公告)号：US20080012099A1

公开(公告)日：2008-01-17

申请号：US11484501

申请日：2006-07-11

申请人： Shing Yeh ,  Steven A. Middleton

发明人： Shing Yeh ,  Steven A. Middleton

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An electronics assembly having a reduced need for wire bonds is provided. The electronics assembly includes a substrate having upper and lower surfaces. An electronic circuit device having conducting pads is attached to the upper surface of the substrate such that the conducting pads face the upper surface of the substrate. The lower surface of the substrate includes an exposed conducting feature. An electrically conducting interconnect in the substrate electrically couples the exposed conducting feature to the conducting pads of the electronic circuit device. The exposed conducting feature of the substrate is electrically coupled to a leadframe finger of a leadframe by solder, providing a conducting path between the leadframe finger and the electronic circuit device.

摘要翻译： 提供了一种具有减少对引线键合需求的电子组件。 电子组件包括具有上表面和下表面的基底。 具有导电焊盘的电子电路装置附接到基板的上表面，使得导电焊盘面向基板的上表面。 衬底的下表面包括暴露的导电特征。 衬底中的导电互连将暴露的导电特征电耦合到电子电路器件的导电焊盘。 衬底的暴露导电特征通过焊料电耦合到引线框架的引线框架指状物，在引线框架指状物和电子电路器件之间提供导电路径。

公开(公告)号：US20080212296A1

公开(公告)日：2008-09-04

申请号：US11712718

申请日：2007-03-01

申请人： Scott D. Brandenburg ,  Thomas A. Degenkolb ,  Shing Yeh

发明人： Scott D. Brandenburg ,  Thomas A. Degenkolb ,  Shing Yeh

IPC分类号： H05K7/00

CPC分类号： H05K7/2049 ,  H01L24/05 ,  H01L24/06 ,  H01L24/72 ,  H01L25/072 ,  H01L2224/05644 ,  H01L2224/06181 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00

摘要： An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.

公开(公告)号：US5938862A

公开(公告)日：1999-08-17

申请号：US70070

申请日：1998-04-03

申请人： Shing Yeh ,  Curtis Wayne Melcher ,  Bradley Howard Carter

发明人： Shing Yeh ,  Curtis Wayne Melcher ,  Bradley Howard Carter

IPC分类号： B23K35/26 ,  C22C13/00 ,  C22C7/00

CPC分类号： B23K35/262 ,  C22C13/00

摘要： A lead-free solder alloy suitable for forming solder joints of a surface-mount integrated circuit device, such as a flip chip. The solder alloy has a sufficiently low liquidus temperature to achieve desirable reflow properties at temperatures of 240.degree. C. and less, and is therefore compatible with integrated circuit processes. The solder alloy has a sufficiently high solidus temperature to ensure that solder joints formed with the alloy exhibit suitable mechanical properties at application temperatures up to 150.degree. C. when mounting a component to a laminate substrate. The solder alloy generally contains, in weight percent, about 7 to about 11% indium, about 2.5 to about 3.5% silver, and about 0.5 to about 1.5% copper, the balance tin and incidental impurities.

摘要翻译： 适用于形成表面贴装集成电路器件如倒装芯片的焊点的无铅焊料合金。 焊料合金具有足够低的液相线温度，以在240℃以下的温度下实现期望的回流性能，因此与集成电路工艺兼容。 焊料合金具有足够高的固相线温度，以确保当将组件安装到层压基板上时，由合金形成的焊点在高达150℃的应用温度下表现出适当的机械性能。 焊料合金通常含有约7至约11％的铟，约2.5至约3.5％的银和约0.5至约1.5％的铜，余量为锡和附带的杂质。

公开(公告)号：US06281106B1

公开(公告)日：2001-08-28

申请号：US09449820

申请日：1999-11-25

申请人： William David Higdon ,  Frank Stepniak ,  Shing Yeh

发明人： William David Higdon ,  Frank Stepniak ,  Shing Yeh

IPC分类号： H01L2144

CPC分类号： H05K3/3436 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3463 ,  H05K3/3473 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/1146

摘要： A method for solder bumping a surface-mount circuit component, as well as electrically and mechanically connecting the component to a conductor on a substrate, and the components and assemblies formed thereby. The method generally entails forming a multilayer metal bump containing discrete layers, including at least one layer of a solder alloy, a first metallic layer having a sufficiently high melting point so as not to melt or deform at the reflow temperature of the solder alloy, and a second metallic layer containing at least one metal that is soluble in the solder alloy. During reflow, the first metallic layer does not collapse, while the solder layer and the second metallic layer readily flow and subsequently bond the first metallic layer to suitable structures on the component and substrate. As a result of the reflow operation, the multilayer metal bump of this invention forms a solder connection with a graded composition, namely, an intermediate region formed primarily by the first metallic layer, and at least one end region that contains a solid solution formed of the solder layer and the first and second metallic layers.

摘要翻译： 用于焊接凸起表面安装电路部件的方法，以及将部件电连接和机械地连接到基板上的导体以及由此形成的部件和组件。 该方法通常需要形成包含离散层的多层金属凸块，包括至少一层焊料合金，具有足够高熔点的第一金属层，以便在焊料合金的回流温度下不熔化或变形，以及 含有至少一种可溶于焊料合金的金属的第二金属层。 在回流期间，第一金属层不会塌陷，而焊料层和第二金属层容易流动，并且随后将第一金属层结合到组件和基板上的合适结构。 作为回流操作的结果，本发明的多层金属凸块形成了具有渐层组成的焊料连接，即主要由第一金属层形成的中间区，以及至少一个包含由 焊料层和第一和第二金属层。

公开(公告)号：US6062461A

公开(公告)日：2000-05-16

申请号：US116815

申请日：1998-06-03

申请人： Douglas Ray Sparks ,  Larry Lee Jordan ,  Ruth Ellen Beni ,  Anthony Alan Duffer ,  Shing Yeh

发明人： Douglas Ray Sparks ,  Larry Lee Jordan ,  Ruth Ellen Beni ,  Anthony Alan Duffer ,  Shing Yeh

IPC分类号： B81B7/00 ,  H01L21/50

CPC分类号： B81C1/00269

摘要： A method by which semiconductor wafers (10, 12) can be solder bonded to form a semiconductor device, such as a sensor with a micromachined structure (14). The method entails forming a solderable ring (18) on the mating surface of a device wafer (10), such that the solderable ring (18) circumscribes the micromachine (14) on the wafer (10). A solderable layer (20, 26, 28) is formed on a capping wafer (12), such that at least the mating surface (24) of the capping wafer (12) is entirely covered by the solderable layer (20, 26, 28). The solderable layer (20, 26, 28) can be formed by etching the mating surface (24) of the capping wafer (12) to form a recess (16) circumscribed by the mating surface (24), and then forming the solderable layer (26) to cover the mating surface (24) and the recess (16) of the capping wafer (12). Alternatively, the solderable layer (28) can be formed by depositing a solderable material to cover the entire lower surface of the capping wafer (12), patterning the resulting solderable layer (28) to form an etch mask on the capping wafer (12), and then to form the recess (16), such that the solderable layer (28) covers the mating surface (24) but not the surfaces of the recess (16).

摘要翻译： 可以将半导体晶片（10,12）焊接在一起以形成诸如具有微加工结构（14）的传感器的半导体器件的方法。 该方法需要在器件晶片（10）的配合表面上形成可焊接环（18），使得可焊接环（18）围绕晶片（10）上的微机械（14）。 在封盖晶片（12）上形成可焊层（20,26,28），使得封盖晶片（12）的至少配合表面（24）完全被可焊接层（20,26,28）覆盖 ）。 可焊层（20,26,28）可以通过蚀刻封盖晶片（12）的配合表面（24）形成由配合表面（24）限定的凹陷（16），然后形成可焊层 （26）以覆盖封盖晶片（12）的配合表面（24）和凹部（16）。 或者，可焊层（28）可以通过沉积可焊接材料以覆盖封盖晶片（12）的整个下表面，形成所得到的可焊接层（28）以在封盖晶片（12）上形成蚀刻掩模 ，然后形成凹部（16），使得可焊层（28）覆盖配合表面（24），而不覆盖凹部（16）的表面。

公开(公告)号：US5803340A

公开(公告)日：1998-09-08

申请号：US536592

申请日：1995-09-29

申请人： Shing Yeh ,  Bradley Howard Carter

发明人： Shing Yeh ,  Bradley Howard Carter

IPC分类号： B23K35/22 ,  B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L21/441

CPC分类号： H01L24/10 ,  B23K35/025 ,  B23K35/268 ,  H01L24/13 ,  H05K3/3484 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0272 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0769 ,  H05K3/3463

摘要： Composite solder paste compositions adapted to be deposited using a dry film photoresist mask to form solder joints for flip chip integrated circuit devices. The composite solder paste compositions are characterized by the ability to flow at a first temperature during bumping reflow while the photoresist mask is present, yet upon subsequently reheating to a higher temperature yield solder joints capable of withstanding temperatures of 200.degree. C. and higher. As such, the present invention retains the advantages associated with using a dry film photoresist as a mask during deposition of the solder, yet results in the formation of solder joints that exhibit enhanced reliability in severe thermal environments.

摘要翻译： 适用于使用干膜光致抗蚀剂掩模沉积的复合焊膏组合物以形成倒装芯片集成电路器件的焊接接头。 复合焊膏组合物的特征在于在凸起回流期间在第一温度下流动的能力，同时存在光致抗蚀剂掩模，然后在随后再加热至更高温度时产生能够承受200℃及更高温度的焊点。 因此，本发明保留了在沉积焊料期间使用干膜光致抗蚀剂作为掩模相关的优点，但是导致在严酷的热环境中表现出增强的可靠性的焊点的形成。

公开(公告)号：US07447041B2

公开(公告)日：2008-11-04

申请号：US11712718

申请日：2007-03-01

申请人： Scott D. Brandenburg ,  Thomas A. Degenkolb ,  Shing Yeh

发明人： Scott D. Brandenburg ,  Thomas A. Degenkolb ,  Shing Yeh

IPC分类号： H05K7/00

CPC分类号： H05K7/2049 ,  H01L24/05 ,  H01L24/06 ,  H01L24/72 ,  H01L25/072 ,  H01L2224/05644 ,  H01L2224/06181 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/1203 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00

摘要： An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.

摘要翻译： 提供了改进的垂直集成电路器件封装，其消除或减少了对引线接合和/或焊接连接的需要。 封装包括在相对表面上具有电极的垂直装置，以及用于在电极和对应的导电元件之间建立压缩电连接的压缩弹簧构件。

公开(公告)号：US06767411B2

公开(公告)日：2004-07-27

申请号：US10099861

申请日：2002-03-15

申请人： Shing Yeh ,  Bradley H. Carter ,  Curtis W. Melcher

发明人： Shing Yeh ,  Bradley H. Carter ,  Curtis W. Melcher

IPC分类号： B23K35363

CPC分类号： B23K35/262

摘要： A lead-free solder alloy consisting essentially of, by weight, 3.0% to 3.5% silver, greater than 1% to about 15% copper, the balance tin and incidental impurities, and having an effective melting range of about 215° C. to about 222° C. The solder alloy is noneutectic, and therefore characterized by solidus and liquidus temperatures, the former being in a range of about 215° C. to about 218° C., while the latter is about 290° C. or more. However, the melting mechanism exhibited by the alloy is such that the alloy is substantially all melted and does not exhibit a “mushy zone” above the effective melting range, enabling the alloy to behave similarly to the SnAgCu eutectic alloy.

摘要翻译： 一种无铅焊料合金，其基本上由重量比为3.0％至3.5％的银，大于1％至约15％的铜，余量为锡和附带杂质，并且具有约215℃的有效熔融范围， 约222℃。焊料合金是共晶的，因此以固相和液相线温度为特征，前者在约215℃至约218℃的范围内，而后者为约290℃或更高 。 然而，合金显示的熔融机理使得合金基本上全部熔化，并且在有效熔融范围之上不显示“糊状区域”，使合金的性能与SnAgCu共晶合金类似。

公开(公告)号：US06570260B1

公开(公告)日：2003-05-27

申请号：US10075979

申请日：2002-02-15

申请人： Shing Yeh ,  Scott D. Brandenburg ,  Bradley H. Carter

发明人： Shing Yeh ,  Scott D. Brandenburg ,  Bradley H. Carter

IPC分类号： H01L2348

CPC分类号： H01L24/10 ,  B23K35/26 ,  B23K35/262 ,  B23K35/268 ,  H01L23/488 ,  H01L24/13 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00

摘要： A solder alloy containing indium, lead, silver and copper as its alloying constituents, and a soldering process employing the solder alloy. The solder alloy consists essentially of, by weight, about 50% to about 65% indium, about 0.5% to about 3.0% silver, up to about 3.0% copper, the balance lead and incidental impurities. The alloy preferably has a solidus temperature in a range of about 173° C. to about 178° C., and a liquidus temperature in a range of about 187° C. to about 196° C. As such, the alloy can be used in a reflow process with a peak reflow temperature of about 220° C. to about 240° C., and is therefore compatible with most circuit components and can be simultaneously reflowed with 63Sn-37Pb solder.

摘要翻译： 含有铟，铅，银和铜作为其合金成分的焊料合金以及采用焊料合金的焊接工艺。 焊料合金基本上由重量计约50％至约65％的铟，约0.5％至约3.0％的银，至多约3.0％的铜，余量的铅和附带的杂质。 合金优选固相线温度在约173℃至约178℃的范围内，液相线温度在约187℃至约196℃的范围内。因此，可以使用该合金 在高回流温度为约220℃至约240℃的回流工艺中，因此与大多数电路部件兼容，并可与63Sn-37Pb焊料同时回流。

公开(公告)号：US07726972B1

公开(公告)日：2010-06-01

申请号：US12505088

申请日：2009-07-17

申请人： Scott D. Brandenburg ,  Shing Yeh ,  Mark W. Gose

发明人： Scott D. Brandenburg ,  Shing Yeh ,  Mark W. Gose

IPC分类号： H01R39/00

CPC分类号： H01R39/646 ,  B60R16/027 ,  C22C28/00 ,  H01R2201/26

摘要： A liquid metal rotary connector for a vehicle steering mechanism utilizes a conductive alloy comprising Gallium, Indium, Tin and Zinc to electrically couple stationary and rotary terminals of the connector. The alloy is a liquid at ambient temperatures, and has a melting point of −36° C., though testing has shown that it operates satisfactorily at temperatures as low as −40° C. In a preferred arrangement, the rotary connector provides a two-wire connection through which power is supplied from the steering column to the steering wheel, and electronic modules located in the steering column and the steering wheel support bi-directional data communication through voltage and current modulation of the supplied power.

摘要翻译： 用于车辆转向机构的液体金属旋转连接器利用包括镓，铟，锡和锌的导电合金来电连接连接器的固定和旋转端子。 该合金在环境温度下为液体，熔点为-36℃，尽管测试表明它在低至-40℃的温度下令人满意地工作。在优选的布置中，旋转连接器提供两个 - 通过其从转向柱向方向盘供电的电线，并且位于转向柱和方向盘中的电子模块通过对所供电的电压和电流调制来支持双向数据通信。