公开(公告)号：US5926735A

公开(公告)日：1999-07-20

申请号：US802685

申请日：1997-02-19

申请人： Shunpei Yamazaki ,  Naoaki Yamaguchi ,  Yuugo Goto ,  Satoshi Teramoto ,  Katunobu Awane ,  Yoshitaka Yamamoto ,  Toshimasa Hamada

发明人： Shunpei Yamazaki ,  Naoaki Yamaguchi ,  Yuugo Goto ,  Satoshi Teramoto ,  Katunobu Awane ,  Yoshitaka Yamamoto ,  Toshimasa Hamada

IPC分类号： H01L21/28 ,  H01L21/336 ,  H01L21/768 ,  H01L21/77 ,  H01L21/84 ,  H01L21/4763

CPC分类号： H01L29/66757 ,  H01L21/28079 ,  H01L21/76802 ,  H01L27/124

摘要： There is disclosed a manufacturing method of highly integrated circuits with thin-film transistors (TFTs) for use as peripheral driver circuitry in active-matrix liquid crystal display (LCD) panel with a pixel array each having a charge transfer control TFT, capable of facilitating formation of contact holes otherwise being difficult in cases where an anode oxide film is formed on gate electrodes of TFTs and lead wires both of which are made of anodizable metal, such as aluminum. The method includes execution of anodization while causing a resist mask to be disposed on part of the lead wire and electrode made of aluminum, thereby partly eliminating formation of the anode oxide film on the lead wire and electrode. At a later step of fabrication, each contact is formed by use of such portion that has no anode oxide film formed thereon. This may allow aluminum to be employed as lead wires while enabling easy fabrication of contacts therefor.

摘要翻译： 公开了一种具有薄膜晶体管（TFT）的高度集成电路的制造方法，用作有源矩阵液晶显示器（LCD）面板中的外围驱动电路，每个像素阵列均具有电荷转移控制TFT，能够促进 在由诸如铝的阳极氧化金属制成的TFT和引线的栅电极上形成阳极氧化膜的情况下，形成接触孔是困难的。 该方法包括执行阳极氧化，同时使抗蚀剂掩模设置在由铝制成的引线和电极的一部分上，从而部分地消除在引线和电极上形成阳极氧化膜。 在后面的制造步骤中，通过使用其上没有形成阳极氧化膜的部分形成每个接触。 这可以允许使用铝作为引线，同时能够容易地制造用于其的触点。

公开(公告)号：US09069215B2

公开(公告)日：2015-06-30

申请号：US12556135

申请日：2009-09-09

申请人： Yoshiharu Hirakata ,  Yuugo Goto ,  Yuko Kobayashi ,  Shunpei Yamazaki

发明人： Yoshiharu Hirakata ,  Yuugo Goto ,  Yuko Kobayashi ,  Shunpei Yamazaki

IPC分类号： H01L27/14 ,  H01L29/04 ,  H01L29/15 ,  H01L31/036 ,  G02F1/1339 ,  H01L29/786 ,  G02F1/1333 ,  G02F1/1345

CPC分类号： G02F1/13394 ,  G02F1/13306 ,  G02F1/133345 ,  G02F1/13338 ,  G02F1/133512 ,  G02F1/1341 ,  G02F1/134309 ,  G02F1/13454 ,  G02F1/1368 ,  G02F2001/133302 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/1288 ,  H01L29/167 ,  H01L29/78621 ,  H01L29/78627 ,  H01L29/78669 ,  H01L2029/7863 ,  H01L2924/0002 ,  Y10S438/924 ,  Y10S438/98 ,  H01L2924/00

摘要： There is provided a high quality liquid crystal panel having a thickness with high accuracy, which is designed, without using a particulate spacer, within a free range in accordance with characteristics of a used liquid crystal and a driving method, and is also provided a method of fabricating the same. The shape of a spacer for keeping a substrate interval constant is made such that it is a columnar shape, a radius R of curvature is 2 μm or less, a height H is 0.5 μm to 10 μm, a diameter is 20 μm or less, and an angle α is 65° to 115°. By doing so, it is possible to prevent the lowering of an opening rate and the lowering of light leakage due to orientation disturbance.

公开(公告)号：US08634041B2

公开(公告)日：2014-01-21

申请号：US13466406

申请日：2012-05-08

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Akio Endo ,  Yasuyuki Arai

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Akio Endo ,  Yasuyuki Arai

IPC分类号： G02F1/1335

CPC分类号： G02F1/1362 ,  G02F1/133305 ,  G02F1/133603 ,  G02F2001/13613 ,  H01L27/14678 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592

摘要： To sophisticate a portable electronic appliance without hindering reduction of the weight and the size, more specifically, to sophisticate a liquid crystal display apparatus installed in a portable electronic appliance without hindering the mechanical strength, a liquid crystal display apparatus includes a first plastic substrate, a light-emitting device which is disposed over the first plastic substrate, resin which covers the light-emitting device, an insulating film which is in contact with the resin, a semiconductor device which is in contact with the insulating film, a liquid crystal cell which is electrically connected to the semiconductor device, and a second plastic substrate, wherein the semiconductor device and the liquid crystal cell are disposed between the first plastic substrate and the second plastic substrate.

摘要翻译： 为了使便携式电子设备复杂化而不妨碍重量和尺寸的减小，更具体地说，为了使安装在便携式电子设备中的液晶显示装置复杂化而不会妨碍机械强度，液晶显示装置包括第一塑料基板， 布置在第一塑料基板上的发光装置，覆盖发光装置的树脂，与树脂接触的绝缘膜，与绝缘膜接触的半导体装置，液晶单元， 电连接到半导体器件和第二塑料基板，其中半导体器件和液晶单元设置在第一塑料基板和第二塑料基板之间。

公开(公告)号：US08040456B2

公开(公告)日：2011-10-18

申请号：US10756833

申请日：2004-01-14

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Akio Endo ,  Yasuyuki Arai

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Akio Endo ,  Yasuyuki Arai

IPC分类号： G02F1/1335

CPC分类号： G02F1/1362 ,  G02F1/133305 ,  G02F1/133603 ,  G02F2001/13613 ,  H01L27/14678 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592

摘要： To sophisticate a portable electronic appliance without hindering reduction of the weight and the size, more specifically, to sophisticate a liquid crystal display apparatus installed in a portable electronic appliance without hindering the mechanical strength, a liquid crystal display apparatus includes a first plastic substrate, a light-emitting device which is disposed over the first plastic substrate, resin which covers the light-emitting device, an insulating film which is in contact with the resin, a semiconductor device which is in contact with the insulating film, a liquid crystal cell which is electrically connected to the semiconductor device, and a second plastic substrate, wherein the semiconductor device and the liquid crystal cell are disposed between the first plastic substrate and the second plastic substrate.

摘要翻译： 为了使便携式电子设备复杂化而不妨碍重量和尺寸的减小，更具体地说，为了使安装在便携式电子设备中的液晶显示装置复杂化而不会妨碍机械强度，液晶显示装置包括第一塑料基板， 布置在第一塑料基板上的发光装置，覆盖发光装置的树脂，与树脂接触的绝缘膜，与绝缘膜接触的半导体装置，液晶单元， 电连接到半导体器件和第二塑料基板，其中半导体器件和液晶单元设置在第一塑料基板和第二塑料基板之间。

公开(公告)号：US07518692B2

公开(公告)日：2009-04-14

申请号：US10739084

申请日：2003-12-19

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Mai Akiba

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Mai Akiba

IPC分类号： G02F1/1339 ,  G02F1/1345

CPC分类号： G06K19/07749 ,  G06K19/077 ,  G06K19/07703 ,  G06Q20/341 ,  G06Q20/40145 ,  G07F7/1008

摘要： It is an object of the present invention to provide a highly sophisticated functional card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. A card comprising a display device and a thin film integrated circuit; wherein driving of the display device is controlled by the thin film integrated circuit; a semiconductor element used for the thin film integrated circuit and the display device is formed by using a polycrystalline semiconductor film; the thin film integrated circuit and the display device are sealed with a resin between a first substrate and a second substrate of the card; and the first substrate and the second substrate are plastic substrates.

摘要翻译： 本发明的目的是提供一种高度复杂的功能卡，其可以通过防止诸如改变脸部照片的伪造，以及显示其他图像以及脸部照片来确保安全性。 一种包括显示装置和薄膜集成电路的卡; 其中所述显示装置的驱动由所述薄膜集成电路控制; 通过使用多晶半导体膜形成用于薄膜集成电路的半导体元件和显示装置; 薄膜集成电路和显示装置用卡在第一基板和第二基板之间的树脂密封; 并且第一基板和第二基板是塑料基板。

公开(公告)号：US20090091014A1

公开(公告)日：2009-04-09

申请号：US12249523

申请日：2008-10-10

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Yasuyuki Arai ,  Noriko Shibata

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Yasuyuki Arai ,  Noriko Shibata

IPC分类号： G09G3/36

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L27/1214 ,  H01L2221/68368 ,  H01L2224/05172 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05184

摘要： To provide a thin film device which becomes possible to be formed in the portion which has been considered impossible to be provided with such device by the conventional technique, and to provide a semiconductor device which occupies small space and which has high shock resistance and flexibility, a device formation layer with a thickness of at most 50 μm which was peeled from a substrate by a transfer technique is transferred to another substrate, hence, a thin film device can be formed over various substrates. For instance, a semiconductor device can be formed so as to occupy small space by pasting a thin film device which is transferred to a flexible substrate onto a rear surface of a substrate of a panel, by pasting directly a thin film device onto a rear surface of a substrate of a panel, or by transferring a thin film device to an FPC which is pasted onto a substrate of a panel.

摘要翻译： 为了提供可以在通过常规技术被认为不可能设置这种器件的部分中形成的薄膜器件，并且提供占据小空间并且具有高抗冲击性和柔性的半导体器件， 通过转印技术将从基板剥离的厚度最多为50μm的元件形成层转移到另一基板，因此可以在各种基板上形成薄膜器件。 例如，可以通过将薄膜器件直接粘贴到背面上来形成半导体器件，以便占据较小的空间，该薄膜器件被传送到柔性衬底到面板的衬底的背面上 或者通过将薄膜器件转移到贴在面板的基板上的FPC上。

公开(公告)号：US07436050B2

公开(公告)日：2008-10-14

申请号：US10760723

申请日：2004-01-21

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Yasuyuki Arai ,  Noriko Shibata

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Yasuyuki Arai ,  Noriko Shibata

IPC分类号： G09G3/36

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L27/1214 ,  H01L2221/68368 ,  H01L2224/05172 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05184

摘要： To provide a thin film device which becomes possible to be formed in the portion which has been considered impossible to be provided with such device by the conventional technique, and to provide a semiconductor device which occupies small space and which has high shock resistance and flexibility, a device formation layer with a thickness of at most 50 μm which was peeled from a substrate by a transfer technique is transferred to another substrate, hence, a thin film device can be formed over various substrates. For instance, a semiconductor device can be formed so as to occupy small space by pasting a thin film device which is transferred to a flexible substrate onto a rear surface of a substrate of a panel, by pasting directly a thin film device onto a rear surface of a substrate of a panel, or by transferring a thin film device to an FPC which is pasted onto a substrate of a panel.

摘要翻译： 为了提供可以在通过常规技术被认为不可能设置这种器件的部分中形成的薄膜器件，并且提供占据小空间并且具有高抗冲击性和柔性的半导体器件， 通过转印技术将从基板剥离的厚度最多为50μm的元件形成层转移到另一基板，因此可以在各种基板上形成薄膜器件。 例如，可以通过将薄膜器件直接粘贴到背面上来形成半导体器件，以便占据较小的空间，该薄膜器件被传送到柔性衬底到面板的衬底的背面上 或者通过将薄膜器件转移到贴在面板的基板上的FPC上。

公开(公告)号：US07329985B2

公开(公告)日：2008-02-12

申请号：US11479802

申请日：2006-06-30

申请人： Shunpei Yamazaki ,  Yuugo Goto ,  Yoshifumi Tanada

发明人： Shunpei Yamazaki ,  Yuugo Goto ,  Yoshifumi Tanada

IPC分类号： H05B33/12

CPC分类号： H01L51/5284 ,  H01L27/322 ,  H01L27/3244 ,  H01L2251/5315

摘要： A self-light emitting display device with top-emission usually has no film that is capable of light shielding. Therefore, it is necessary to form a light-shielding layer additionally with, which leads the number of processes to increase.In the present invention, plural films selected from a first coloring layer 161, a second coloring layer 162, and a third coloring layer 163 formed on an opposing substrate are laminated to form a light-shielding portion without using a light-shielding mask.

摘要翻译： 具有顶部发射的自发光显示装置通常不具有能够遮光的膜。 因此，需要另外形成遮光层，导致加工次数增加。 在本发明中，从形成在相对基板上的第一着色层161，第二着色层162和第三着色层163中选择的多个膜被层压以形成遮光部分而不使用遮光掩模。

公开(公告)号：US20070275506A1

公开(公告)日：2007-11-29

申请号：US11798095

申请日：2007-05-10

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yumiko Ohno ,  Yuugo Goto ,  Hideaki Kuwabara

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yumiko Ohno ,  Yuugo Goto ,  Hideaki Kuwabara

IPC分类号： H01L21/58

CPC分类号： H01L21/6835 ,  H01L23/5385 ,  H01L23/5388 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L27/0688 ,  H01L27/12 ,  H01L29/66757 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12034 ,  H01L2924/12042 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H03H3/08 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： It is an object to provide a semiconductor device integrating various elements without using a semiconductor substrate, and a method of manufacturing the same. According to the present invention, a layer to be separated including an inductor, a capacitor, a resistor element, a TFT element, an embedded wiring and the like, is formed over a substrate, separated from the substrate, and transferred onto a circuit board 100. An electrical conduction with a wiring pattern 114 provided in the circuit board 100 is made by a wire 112 or a solder 107, thereby forming a high frequency module or the like.

摘要翻译： 本发明的目的是提供一种在不使用半导体衬底的情况下集成各种元件的半导体器件及其制造方法。 根据本发明，在与衬底分离的衬底上形成包括电感器，电容器，电阻元件，TFT元件，嵌入布线等的待分离层，并转移到电路板 100。 通过线112或焊料107与设置在电路板100中的布线图案114进行导电，从而形成高频模块等。

公开(公告)号：US20070109735A1

公开(公告)日：2007-05-17

申请号：US11619035

申请日：2007-01-02

申请人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Yasuyuki Arai ,  Noriko Shibata

发明人： Shunpei Yamazaki ,  Toru Takayama ,  Junya Maruyama ,  Yuugo Goto ,  Yumiko Ohno ,  Yasuyuki Arai ,  Noriko Shibata

IPC分类号： H05K5/00

CPC分类号： H01L51/0024 ,  G02F1/13306 ,  G02F1/1339 ,  G02F1/1341 ,  G02F1/134309 ,  G02F1/13439 ,  G02F1/13452 ,  G02F1/13454 ,  G02F1/1368 ,  G02F2001/13456 ,  G02F2202/28 ,  H01L21/2007 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67236 ,  H01L21/6835 ,  H01L21/76251 ,  H01L25/0657 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/1266 ,  H01L27/1274 ,  H01L27/15 ,  H01L27/3248 ,  H01L27/3272 ,  H01L27/3276 ,  H01L29/78675 ,  H01L51/003 ,  H01L51/5012 ,  H01L51/5056 ,  H01L51/5072 ,  H01L51/5088 ,  H01L51/5092 ,  H01L51/5096 ,  H01L51/5206 ,  H01L51/5221 ,  H01L51/56 ,  H01L2221/68368 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/308 ,  H01L2251/5323 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/12044 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： The present invention intends to realize a narrow frame of a system on panel. In addition to this, a system mounted on a panel is intended to make higher and more versatile in the functionality. In the invention, on a panel on which a pixel portion (including a liquid crystal element, a light-emitting element) and a driving circuit are formed, integrated circuits that have so far constituted an external circuit are laminated and formed. Specifically, of the pixel portion and the driving circuit on the panel, on a position that overlaps with the driving circuit, any one kind or a plurality of kinds of the integrated circuits is formed by laminating according to a transcription technique.

摘要翻译： 本发明旨在实现面板上系统的窄帧。 除此之外，安装在面板上的系统旨在使功能更高更通用。 在本发明中，在形成有像素部（包括液晶元件，发光元件）和驱动电路的面板上，层叠形成了构成外部电路的集成电路。 具体地，在面板上的像素部分和驱动电路中，在与驱动电路重叠的位置上，根据转录技术层叠形成任何一种或多种集成电路。