公开(公告)号：US07360308B2

公开(公告)日：2008-04-22

申请号：US11458727

申请日：2006-07-20

申请人： Stefano S. Oggioni ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

发明人： Stefano S. Oggioni ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

IPC分类号： H01K3/10 ,  H05K3/36

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/047 ,  H01P3/06 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

摘要翻译： 同轴通孔结构适于通过电子设备载体的导电层传输高速信号或高强度电流。 同轴通孔结构包括中心导电轨道和由电介质材料隔开的外部导电轨道，并且位于电子设备载体的芯部或电子设备的整个厚度中。 同轴通孔结构可以与堆叠的通孔结构组合，以便当制造过程限制整个电子设备载体上完整的同轴通孔结构的创建时，允许跨越电子设备载体的高速信号的有效传输。

公开(公告)号：US07091424B2

公开(公告)日：2006-08-15

申请号：US10613553

申请日：2003-07-02

申请人： Stefano S. Oggioni ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

发明人： Stefano S. Oggioni ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/047 ,  H01P3/06 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

摘要翻译： 同轴通孔结构适于通过电子设备载体的导电层传输高速信号或高强度电流。 同轴通孔结构包括中心导电轨道和由电介质材料隔开的外部导电轨道，并且位于电子设备载体的芯部或电子设备的整个厚度中。 同轴通孔结构可以与堆叠的通孔结构组合，以便当制造过程限制整个电子设备载体上完整的同轴通孔结构的创建时，允许跨越电子设备载体的高速信号的有效传输。

公开(公告)号：US20050156319A1

公开(公告)日：2005-07-21

申请号：US10515511

申请日：2003-04-18

申请人： Stefano Oggioni ,  Michele Castriotta ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

发明人： Stefano Oggioni ,  Michele Castriotta ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

IPC分类号： H05K3/46 ,  H01L23/498 ,  H01L23/538 ,  H01L23/66 ,  H05K1/02 ,  H05K1/11 ,  H01L23/48

CPC分类号： H05K1/0251 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/15173 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/09381 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/0979 ,  H01L2924/00

摘要： A stacked via structure (200) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks (205a, 205b, 205c) belonging to three adjacent conductive layers (110a, 110b, 110c) separated by dielectric layers (120), aligned according to z axis. Connections between these conductive tracks are done with at least two vias (210, 215) between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis. In a preferred embodiment, the shape of these aligned conductive tracks looks like a disk or an annular ring and four vias are used to connect two adjacent conductive layers. These four vias are symmetrically disposed on each of said conductive track. The position of the vias between a first and a second adjacent conductive layers and between a second and a third adjacent conductive layers forms an angle of 45° according to z axis.

摘要翻译： 公开了一种适于通过电子设备载体的导电层传输高频信号或高强度电流的堆叠通孔结构（200）。 叠置的通孔结构包括属于由电介质层（120）分开的根据z轴对准的三个相邻导电层（110a，110b，110c）的至少三个导电轨道（205a，205b，205c）。 这些导电轨道之间的连接通过在每个导电层之间的至少两个通孔（210,215）进行。 连接到导电轨道的一侧的通孔布置成使得它们不与根据z轴连接到另一侧的那些对准。 在优选实施例中，这些对准的导电轨迹的形状看起来像盘或环形环，并且四个通孔用于连接两个相邻的导电层。 这四个通孔对称地设置在每个导电轨道上。 在第一和第二相邻导电层之间以及第二和第三相邻导电层之间的通孔的位置根据z轴形成45°的角度。

公开(公告)号：US20060288574A1

公开(公告)日：2006-12-28

申请号：US11458727

申请日：2006-07-20

申请人： Stefano Oggioni ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

发明人： Stefano Oggioni ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

IPC分类号： H01K3/10

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/047 ,  H01P3/06 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/115 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09618 ,  H05K2201/09627 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00

摘要： A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

摘要翻译： 同轴通孔结构适于通过电子设备载体的导电层传输高速信号或高强度电流。 同轴通孔结构包括中心导电轨道和由电介质材料隔开的外部导电轨道，并且位于电子设备载体的芯部或电子设备的整个厚度中。 同轴通孔结构可以与堆叠的通孔结构组合，以便当制造过程限制整个电子设备载体上完整的同轴通孔结构的创建时，允许跨越电子设备载体的高速信号的有效传输。

公开(公告)号：US07319197B2

公开(公告)日：2008-01-15

申请号：US10515511

申请日：2003-04-18

申请人： Stefano Oggioni ,  Michele Castriotta ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

发明人： Stefano Oggioni ,  Michele Castriotta ,  Gianluca Rogiani ,  Mauro Spreafico ,  Giorgio Viero

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K1/0251 ,  H01L23/49827 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2924/0002 ,  H01L2924/15173 ,  H01L2924/3011 ,  H05K1/112 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/09381 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/0979 ,  H01L2924/00

摘要： A stacked via structure (200) adapted to transmit high frequency signals or high intensity current through conductive layers of an electronic device carrier is disclosed. The stacked via structure comprises at least three conductive tracks (205a, 205b, 205c) belonging to three adjacent conductive layers (110a, 110b, 110c) separated by dielectric layers (120), aligned according to z axis. Connections between these conductive tracks are done with at least two vias (210, 215) between each conductive layer. Vias connected to one side of a conductive track are disposed such that they are not aligned with the ones connected to the other side according to z axis.

摘要翻译： 公开了一种适于通过电子设备载体的导电层传输高频信号或高强度电流的堆叠通孔结构（200）。 叠置的通孔结构包括属于由电介质层（120）分开的根据z轴对准的三个相邻导电层（110a，110b，110c）的至少三个导电轨道（205a，205b，205c）。 这些导电轨道之间的连接通过在每个导电层之间的至少两个通孔（210,215）进行。 连接到导电轨道的一侧的通孔布置成使得它们不与根据z轴连接到另一侧的那些对准。

公开(公告)号：US07505284B2

公开(公告)日：2009-03-17

申请号：US11416757

申请日：2006-05-03

申请人： Bert J. Offrein ,  Stefano S. Oggioni ,  Mauro Spreafico

发明人： Bert J. Offrein ,  Stefano S. Oggioni ,  Mauro Spreafico

IPC分类号： H05K1/11

CPC分类号： H01L23/66 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/522 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/167 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81143 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/222 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/10121 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.

摘要翻译： 一种电子系统，包括：用于附接所述电子系统的部件的电子系统支撑基板，所述电子系统支撑基板包括用于在所述系统部件之间传播电信号的电信号传播路径; 至少第一和第二电子部件，其中至少所述第一电子部件是与所述电子系统支撑基板机械和电连接的模块的一部分，所述模块包括模块基板，所述第一电子部件至少机械连接到所述模块基板 以及第一和第二电子部件之间的电耦合，用于电耦合，允许第一和第二电子部件交换电信号。 电耦合包括在第一和第二电子部件之间特别由柔性电互连部件形成的直接电连接，电连接独立于电子系统支撑基板。

公开(公告)号：US07650693B2

公开(公告)日：2010-01-26

申请号：US12137164

申请日：2008-06-11

申请人： Bert J. Offrein ,  Stefano S. Oggioni ,  Mauro Spreafico

发明人： Bert J. Offrein ,  Stefano S. Oggioni ,  Mauro Spreafico

IPC分类号： H05K3/34

CPC分类号： H01L23/66 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/522 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/167 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81143 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/222 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/10121 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection, particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.

摘要翻译： 一种电子系统，包括：用于附接所述电子系统的部件的电子系统支撑基板，所述电子系统支撑基板包括用于在所述系统部件之间传播电信号的电信号传播路径; 至少第一和第二电子部件，其中至少所述第一电子部件是与所述电子系统支撑基板机械和电连接的模块的一部分，所述模块包括模块基板，所述第一电子部件至少机械地 连接在第一和第二电子部件之间的电耦合，用于电耦合，允许第一和第二电子部件交换电信号。 电耦合包括在第一和第二电子部件之间的特别由柔性电互连部件形成的直接电连接，电连接独立于电子系统支撑基板。

公开(公告)号：US20080274587A1

公开(公告)日：2008-11-06

申请号：US12137164

申请日：2008-06-11

申请人： Bert J. Offrein ,  Stefano S. Oggioni ,  Mauro Spreafico

发明人： Bert J. Offrein ,  Stefano S. Oggioni ,  Mauro Spreafico

IPC分类号： H01L21/58

CPC分类号： H01L23/66 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/522 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/167 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81143 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/222 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/10121 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection, particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.

摘要翻译： 一种电子系统，包括：用于附接所述电子系统的部件的电子系统支撑基板，所述电子系统支撑基板包括用于在所述系统部件之间传播电信号的电信号传播路径; 至少第一和第二电子部件，其中至少所述第一电子部件是与所述电子系统支撑基板机械和电连接的模块的一部分，所述模块包括模块基板，所述第一电子部件至少机械地 连接在第一和第二电子部件之间的电耦合，用于电耦合，允许第一和第二电子部件交换电信号。 电耦合包括在第一和第二电子部件之间的特别由柔性电互连部件形成的直接电连接，电连接独立于电子系统支撑基板。

公开(公告)号：US20070230150A1

公开(公告)日：2007-10-04

申请号：US11613376

申请日：2006-12-20

申请人： Michele Castriotta ,  Stefano Oggioni ,  Mauro Spreafico ,  Giorgio Viero

发明人： Michele Castriotta ,  Stefano Oggioni ,  Mauro Spreafico ,  Giorgio Viero

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K1/0222 ,  H01L23/49827 ,  H01L23/50 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2924/0002 ,  H05K1/112 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09809 ,  H01L2924/00

摘要： A power supply structure for high power circuit package is disclosed. According to the invention, the electrical connections between power planes are done through a plurality of coaxial structures that can be totally or partially implemented in the circuit shadow area of the electronic device carrier, for example under the engine area of the circuit. According to this principle, a same hole is used to transfer two different current levels, one on its periphery and the other one on its centre, doubling the electrical transfer capacity.

摘要翻译： 公开了一种用于大功率电路封装的电源结构。 根据本发明，电力平面之间的电连接通过多个同轴结构完成，该多个同轴结构可以完全或部分地实现在电子设备载体的电路阴影区域中，例如在电路的发动机区域下方。 根据该原理，使用相同的孔来传递两个不同的电流电平，一个在其外围，另一个在其中心，使电传递能力增加一倍。

公开(公告)号：US20060267176A1

公开(公告)日：2006-11-30

申请号：US11416757

申请日：2006-05-03

申请人： Bert Offrein ,  Stefano Oggioni ,  Mauro Spreafico

发明人： Bert Offrein ,  Stefano Oggioni ,  Mauro Spreafico

IPC分类号： H01L23/52

CPC分类号： H01L23/66 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/522 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/167 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/81143 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/222 ,  H05K3/3436 ,  H05K2201/045 ,  H05K2201/10121 ,  H05K2201/1053 ,  H05K2201/10674 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.

摘要翻译： 一种电子系统，包括：用于附接所述电子系统的部件的电子系统支撑基板，所述电子系统支撑基板包括用于在所述系统部件之间传播电信号的电信号传播路径; 至少第一和第二电子部件，其中至少所述第一电子部件是与所述电子系统支撑基板机械和电连接的模块的一部分，所述模块包括模块基板，所述第一电子部件至少机械连接到所述模块基板 以及第一和第二电子部件之间的电耦合，用于电耦合，允许第一和第二电子部件交换电信号。 电耦合包括在第一和第二电子部件之间特别由柔性电互连部件形成的直接电连接，电连接独立于电子系统支撑基板。