公开(公告)号：US20060270109A1

公开(公告)日：2006-11-30

申请号：US11140687

申请日：2005-05-31

申请人： Stephan Blaszczak ,  Martin Reiss ,  Bernd Scheibe ,  Steffen Kroehnert ,  Knut Kahlisch ,  Ingolf Rau ,  Harry Hedler ,  Soo Park

发明人： Stephan Blaszczak ,  Martin Reiss ,  Bernd Scheibe ,  Steffen Kroehnert ,  Knut Kahlisch ,  Ingolf Rau ,  Harry Hedler ,  Soo Park

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Manufacturing method for an electronic component assembly and corresponding electronic component assembly The present invention provides a manufacturing method for an electronic component assembly and to a corresponding electronic component assembly. The method comprises the steps of: providing a substrate having a first and a second side and having at least one through-hole, said second side having a first plurality of solder connection pads; attaching a semiconductor chip to said first side of said substrate; performing a mould process on said substrate and said attached semiconductor chip so as to obtain a mould package, said mould package including at least one first mould section covering said semiconductor chip on the first side and at least one second mould section extending through said throughhole and protruding over said solder connection pads on the second side; and providing a printed circuit board having a surface with a second plurality of solder connection pads corresponding to said first plurality of solder connection pads; and soldering said mould package to said printed circuit board by means of solder balls between said first and second plurality of solder connection pads such that said at least one second section forms a spacer structure supporting said mould package on said surface of said printed circuit board.

摘要翻译： 电子部件组件和相应的电子部件组件的制造方法本发明提供一种用于电子部件组件和相应的电子部件组件的制造方法。 该方法包括以下步骤：提供具有第一和第二侧面并且具有至少一个通孔的基板，所述第二侧面具有第一多个焊接连接焊盘; 将半导体芯片附接到所述基板的所述第一侧; 在所述基板和所述附接的半导体芯片上执行模制工艺以获得模具包装，所述模具包装包括至少一个覆盖所述第一侧上的半导体芯片的第一模具部分和延伸穿过所述通孔的至少一个第二模具部分， 突出在第二侧上的焊料连接焊盘上; 以及提供具有表面的印刷电路板，所述表面具有对应于所述第一多个焊料连接焊盘的第二多个焊料连接焊盘; 以及通过所述第一和第二多个焊接连接焊盘之间的焊球将所述模具封装焊接到所述印刷电路板，使得所述至少一个第二部分形成支撑所述印刷电路板的所述表面上的所述模具封装的间隔结构。

公开(公告)号：US20060237855A1

公开(公告)日：2006-10-26

申请号：US11392255

申请日：2006-03-29

申请人： Steffen Kroehnert ,  Gunnar Petzold ,  Jens Oswald ,  Martin Reiss ,  Oliver Grassme ,  Kerstin Nocke ,  Knut Kahlisch ,  Soo Park

发明人： Steffen Kroehnert ,  Gunnar Petzold ,  Jens Oswald ,  Martin Reiss ,  Oliver Grassme ,  Kerstin Nocke ,  Knut Kahlisch ,  Soo Park

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49816 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05085 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/11 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2924/0001 ,  H01L2924/00014

摘要： A substrate for producing a soldering connection to a second substrate is disclosed. Soldering pads are distributed on the substrate surface. Solder balls can be applied to these pads. A soldering pad has a top side area and side areas connected to a conductor track. A soldering mask with openings in the region of the soldering pads is applied to the substrate. A soldering pad is provided with holding mechanism for the solder balls in such a way that, within the top side area of the soldering pad, a depression is introduced in the direction of the substrate or an elevation rising above the top side area is applied.

摘要翻译： 公开了一种用于产生到第二衬底的焊接连接的衬底。 焊盘分布在基板表面上。 焊球可以应用于这些焊盘。 焊盘具有连接到导体轨道的顶侧区域和侧面区域。 在焊盘的区域中具有开口的焊接掩模被施加到基板。 焊盘设置有用于焊球的保持机构，使得在焊盘的顶侧区域内，沿着衬底的方向引入凹部，或施加在顶侧区域上方升高的高度。

公开(公告)号：US20060255504A1

公开(公告)日：2006-11-16

申请号：US11413639

申请日：2006-04-28

申请人： Steffen Kroehnert ,  Ingolf Rau ,  Knut Kahlisch ,  Theodorus Hugen ,  Michel Hendrikus Teunissen

发明人： Steffen Kroehnert ,  Ingolf Rau ,  Knut Kahlisch ,  Theodorus Hugen ,  Michel Hendrikus Teunissen

IPC分类号： B29C45/14

CPC分类号： B29C45/14655 ,  B29C33/442 ,  B29C45/4005 ,  H01L21/565 ,  H01L21/6835 ,  H01L2221/68313 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method for producing an integrated component, a carrier strip is provided with at least one arrangement of chips. A casting mold is placed over the carrier strip in such a way that the arrangement of chips is covered completely by at least one cavity of the casting mold. A protective layer is formed over the arrangement of microchips by filling the cavity with a liquefied encapsulating compound. The liquefied encapsulating compound transforms into a solid state upon cooling. The carrier strip with the protective layer can be ejected from the cavity by exerting a force onto a surface of the protective layer facing the cavity. The force is exerted onto at least one linearly extended surface region of the protective layer.

摘要翻译： 在一种用于制造集成部件的方法中，载体带设置有至少一个芯片布置。 将铸模放置在载体条上，使得芯片的布置被铸模的至少一个空腔完全覆盖。 通过用液化封装化合物填充空腔，在微芯片的布置上形成保护层。 液化封装化合物在冷却时转变成固态。 具有保护层的载体带可以通过向面向空腔的保护层的表面施加力而从空腔中排出。 力施加在保护层的至少一个线性延伸的表面区域上。

公开(公告)号：US20060180929A1

公开(公告)日：2006-08-17

申请号：US11338867

申请日：2006-01-24

申请人： Steffen Kroehnert ,  Knut Kahlisch ,  Wieland Wahrmund

发明人： Steffen Kroehnert ,  Knut Kahlisch ,  Wieland Wahrmund

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3128 ,  H01L23/3142 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： An FBGA semiconductor component has a chip side for receiving a semiconductor chip, a solder ball side for applying solder balls on ball pads, and a bonding channel embodied as an opening between the chip side and the solder ball side and serving for leading through wire bridges between the semiconductor chip and bonding islands on the solder ball side. The bonding channel has side areas extending between the chip side and the solder ball side and can be closed off with a housing part comprising potting composition. Positively locking elements for a potting composition are arranged in that region of the substrate in which the housing part is produced.

公开(公告)号：US20060180921A1

公开(公告)日：2006-08-17

申请号：US11336615

申请日：2006-01-20

申请人： Steffen Kroehnert ,  Knut Kahlisch ,  Ruediger Uhlmann ,  Carsten Bender

发明人： Steffen Kroehnert ,  Knut Kahlisch ,  Ruediger Uhlmann ,  Carsten Bender

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

摘要： A semiconductor component includes a substrate having a chip side and a solder ball side. A semiconductor chip is mounted on the chip side of a substrate. The semiconductor chip is electrically conductively connected to a conductor structure on the substrate. Ball pads are disposed over the solder ball side of the substrate. The ball pads are electrically conductively connected to the conductor structure and suitable for application of solder balls. A mask made from a soldering resist is disposed on the solder ball side. A sealing region at a surface of the solder ball side of the substrate is provided with seal elements for a sealing connection to an encapsulation mold on the surface of the solder ball side.

摘要翻译： 半导体部件包括具有芯片侧和焊球侧的基板。 半导体芯片安装在基板的芯片侧。 半导体芯片与基板上的导体结构导电连接。 球垫设置在衬底的焊球侧上。 球垫与导体结构导电连接，适用于焊球的应用。 在焊锡球侧设置由阻焊剂制成的掩模。 在基板的焊球侧的表面上的密封区域设置有用于密封连接到焊球侧表面上的封装模具的密封元件。

公开(公告)号：US07518220B2

公开(公告)日：2009-04-14

申请号：US11338867

申请日：2006-01-24

申请人： Steffen Kroehnert ,  Knut Kahlisch ,  Wieland Wahrmund

发明人： Steffen Kroehnert ,  Knut Kahlisch ,  Wieland Wahrmund

IPC分类号： H01L23/495

CPC分类号： H01L23/3128 ,  H01L23/3142 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： An FBGA semiconductor component has a chip side for receiving a semiconductor chip, a solder ball side for applying solder balls on ball pads, and a bonding channel embodied as an opening between the chip side and the solder ball side and serving for leading through wire bridges between the semiconductor chip and bonding islands on the solder ball side. The bonding channel has side areas extending between the chip side and the solder ball side and can be closed off with a housing part comprising potting composition. Positively locking elements for a potting composition are arranged in that region of the substrate in which the housing part is produced.

摘要翻译： FBGA半导体部件具有用于接收半导体芯片的芯片侧，用于在球焊盘上施加焊球的焊球侧和实现为芯片侧和焊球侧之间的开口的接合通道，并且用于引导通过线桥 在半导体芯片和焊球之间的接合岛之间。 接合通道具有在芯片侧和焊球侧之间延伸的侧面区域，并且可以由包括灌封组合物的壳体部件封闭。 用于灌封组合物的积极锁定元件布置在其中制造壳体部件的基底的区域中。

公开(公告)号：US20090189292A1

公开(公告)日：2009-07-30

申请号：US12021943

申请日：2008-01-29

申请人： Martin Reiss ,  Knut Kahlisch ,  Joerg Keller

发明人： Martin Reiss ,  Knut Kahlisch ,  Joerg Keller

IPC分类号： H01L21/58 ,  H01L23/49

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/4899 ,  H01L2224/49171 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  Y02P80/30 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： Embodiments of the invention relate to a semiconductor, a semiconductor module and to a method for manufacturing a semiconductor module. In an embodiment of the invention, an integrated circuit includes a plurality of connection pads on at least one side of the integrated circuit, which connection pads can be coupled electrically conductingly by means of a respective bond wire, wherein in at least an edge area on the side of the integrated circuit, on which the connection pads are arranged, a support frame portion is arranged which is configured such that bond wires adjacent to each other can be supported on the support frame portion at a distance from each other.

摘要翻译： 本发明的实施例涉及半导体，半导体模块和半导体模块的制造方法。 在本发明的一个实施例中，集成电路包括在集成电路的至少一侧上的多个连接焊盘，该连接焊盘可以通过相应的接合线电连接，其中在至少一个边缘区域上 布置有连接垫的集成电路的一侧，布置有支撑框架部分，其被配置成使得彼此相邻的接合线可以彼此间隔地支撑在支撑框架部分上。

公开(公告)号：US20090194890A1

公开(公告)日：2009-08-06

申请号：US12023557

申请日：2008-01-31

申请人： Knut Kahlisch ,  Martin Reiss ,  Joerg Keller

发明人： Knut Kahlisch ,  Martin Reiss ,  Joerg Keller

IPC分类号： H01L23/28

CPC分类号： H01L23/3114 ,  H01L23/3142 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05669 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/05042 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the invention relate generally to an integrated circuit and a memory module. In an embodiment of the invention, an integrated circuit is provided. The integrated circuit may include a semiconductor carrier including at least one electrically inactive region on an upper surface thereof, a passivation layer structure disposed above the upper surface of the semiconductor carrier, and at least one lithographic trench in the passivation layer structure above the at least one electrically inactive region on the upper surface of the semiconductor carrier.

摘要翻译： 本发明的实施例一般涉及集成电路和存储器模块。 在本发明的实施例中，提供集成电路。 集成电路可以包括半导体载体，该半导体载体在其上表面上包括至少一个电无活性区域，设置在半导体载体的上表面上方的钝化层结构，以及至少一个钝化层结构中的至少一个光刻沟槽 在半导体载体的上表面上的一个电无活性区域。

公开(公告)号：US20070216038A1

公开(公告)日：2007-09-20

申请号：US11724035

申请日：2007-03-14

申请人： Soo Park ,  Knut Kahlisch

发明人： Soo Park ,  Knut Kahlisch

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L21/561 ,  H01L23/3114 ,  H01L24/93 ,  H01L2224/93 ,  H01L2224/97 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： A method produces semiconductor components having a substrate, a semiconductor chip and an encapsulant. Chips situated on a wafer are singulated, arranged on a substrate and electrically conductively connected to a conductor structure on the substrate. The chips on the substrate are encapsulated with an encapsulant and the semiconductor components are singulated by sawing up the encapsulant.

摘要翻译： 一种方法产生具有衬底，半导体芯片和密封剂的半导体组件。 位于晶片上的芯片被单片化，布置在基板上并与基板上的导体结构导电连接。 衬底上的芯片用密封剂封装，并且通过锯切密封剂将半导体组件分开。

公开(公告)号：US06979887B2

公开(公告)日：2005-12-27

申请号：US09901550

申请日：2001-07-09

申请人： Knut Kahlisch ,  Henning Mieth

发明人： Knut Kahlisch ,  Henning Mieth

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/60 ,  H01L23/13 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/495

CPC分类号： H01L23/13 ,  H01L21/563 ,  H01L23/4985 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15173 ,  H01L2924/00

摘要： Support matrices for semiconductors are often encapsulated in a region of the bonding leads, the so-called bonding channel. The encapsulation is effected using a dispensable material that can flow onto the support matrix and causes contamination there. In order to prevent this flow, the support matrix for integrated semiconductors has a frame, conductor track structures and at least one bonding channel. In the bonding channel bonding leads or wires for connecting the conductor track structures to the integrated semiconductor are disposed. Disposed along the edge of the bonding channel a barrier for preventing the flow of flowable material from the bonding channel onto the frame and/or the conductor track structures. A method for producing such support matrices is likewise disclosed.

摘要翻译： 用于半导体的支撑矩阵通常封装在所谓的结合通道的接合引线的区域中。 使用可分散的材料进行封装，该材料可以流到支撑基体上并在那里引起污染。 为了防止这种流动，用于集成半导体的支撑矩阵具有框架，导体轨道结构和至少一个结合通道。 在接合通道中，设置用于将导体轨道结构连接到集成半导体的引线或导线。 沿着接合通道的边缘设置用于防止可流动材料从粘合通道流到框架和/或导体轨道结构上的屏障。 同样公开了制备这种支撑基质的方法。