公开(公告)号：US4998002A

公开(公告)日：1991-03-05

申请号：US149081

申请日：1988-01-26

申请人： Susumu Okikawa ,  Michio Tanimoto

发明人： Susumu Okikawa ,  Michio Tanimoto

IPC分类号： B23K20/00 ,  B23K20/24 ,  H01L21/00 ,  H01L21/48 ,  H01L21/60 ,  H01L21/607 ,  H01L23/49

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K20/24 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/30105 ,  H01L2924/3025

摘要： A semiconductor device is fabricated by placing a semiconductor chip with at least one bonding pad on the bonding stage of a wire bonder. A coated wire on a spool is passed through a bore in a bonding capillary so that one end of the wire projects from the lower tip of the capillary. An electrical arc discharge is created between the wire tip projecting from the capillary and a discharge electrode by applying a first electric potential to this wire tip through the opposite end of the wire and applying a second electric potential to the electrode. A ball is formed on the end of the wire and this ball is bonded to the pad with the lower tip of the capillary.

公开(公告)号：US5152450A

公开(公告)日：1992-10-06

申请号：US619504

申请日：1990-11-29

申请人： Susumu Okikawa ,  Michio Tanimoto

发明人： Susumu Okikawa ,  Michio Tanimoto

IPC分类号： B23K20/00 ,  B23K20/24 ,  H01L21/00 ,  H01L21/48 ,  H01L21/607 ,  H01L23/49

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K20/24 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/30105 ,  H01L2924/3025

摘要： The present invention relates to a wire bonding method and a wire bonding apparatus employing a coated wire in which the surface of the metal wire is coated with an insulator, and a semiconductor device produced by the bonding method. The present invention includes forming a metal ball on the front end of the coated wire, e.g., by arc discharge; joining the metal ball to an external terminal of a semiconductor chip; bringing the rear end of the coated wire into contact with an external lead and destroying the insulator coating where the coated wire contacts the lead; and joining the metal wire at the rear end of the coated wire to the lead. The metal wire is connected to a common ground with the bonding device, during the arc discharge, and the wire is positive relative to the discharge electrode. Moreover, the melting and shrinking insulator of the coated wire is blown away, and insulator globes can be prevented from being formed in the coated wire, so that bonding defects are avoidable.

摘要翻译： 引线接合方法和引线接合装置技术领域本发明涉及引线接合方法和使用其中金属线的表面涂覆有绝缘体的涂覆线的引线接合装置以及通过接合方法制造的半导体器件。 本发明包括例如通过电弧放电在涂覆线的前端形成金属球; 将所述金属球接合到半导体芯片的外部端子; 使涂层线的后端与外部引线接触，并破坏涂覆的电线与引线接触的绝缘体涂层; 并且将涂覆线的后端处的金属线接合到引线。 在电弧放电期间，金属线与接合装置连接到公共地，并且导线相对于放电电极是正的。 此外，被覆线的熔融和收缩的绝缘体被吹走，并且可以防止在涂覆的线中形成绝缘体球，使得可以避免接合缺陷。

公开(公告)号：US5031821A

公开(公告)日：1991-07-16

申请号：US395088

申请日：1989-08-16

申请人： Tsuyoshi Kaneda ,  Susumu Okikawa ,  Hiroshi Mikino ,  Hiroshi Watanabe ,  Toshihiro Satou ,  Atsushi Onodera ,  Michio Tanimoto

发明人： Tsuyoshi Kaneda ,  Susumu Okikawa ,  Hiroshi Mikino ,  Hiroshi Watanabe ,  Toshihiro Satou ,  Atsushi Onodera ,  Michio Tanimoto

IPC分类号： B23K20/00 ,  B23K20/10 ,  H01L21/00 ,  H01L23/49 ,  H01L23/495

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K20/10 ,  H01L23/4952 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32245 ,  H01L2224/43821 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/7865 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85098 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/92247 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/01206 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/3025

摘要： The present invention is characterized in that, in a ball wedge bonding using a fine bonding wire precoated with a thin insulating layer, ultrasonic vibration is applied to a capillary to effect the delivery of the wire smoothly during movement of the capillary to a second bonding point while delivering the wire after ball bonding at a first bonding point.

摘要翻译： 本发明的特征在于，在使用预先涂覆有薄绝缘层的细接合线的球楔接合中，将超声波振动施加到毛细管，以在毛细管移动到第二接合点期间平滑地实现线的输送 同时在第一接合点的球接合之后传送线。

公开(公告)号：US5285949A

公开(公告)日：1994-02-15

申请号：US907034

申请日：1992-07-01

申请人： Susumu Okikawa ,  Michio Tanimoto

发明人： Susumu Okikawa ,  Michio Tanimoto

IPC分类号： B23K20/00 ,  B23K20/24 ,  H01L21/00 ,  H01L21/48 ,  H01L21/607 ,  H01L23/49 ,  B23K31/02

CPC分类号： H01L24/85 ,  B23K20/007 ,  B23K20/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85099 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20753 ,  H01L2924/20756 ,  H01L2924/30105 ,  H01L2924/3025

摘要： The present invention relates to a wire bonding method and a wire bonding apparatus employing a coated wire in which the surface of a metal wire is coated with an insulator, and a semiconductor device produced by the bonding method. The present invention includes forming a mixed gas of (1) a combustible gas and (2) a temperature controlling gas for lowering the combustion temperature of the mixture; and removing the insulator coating material from the coated wire at a bonding part of the coated wire, so as to denude the surface of a metal wire, by the use of flames produced by the combustion of the combustible gas of the mixed gas. The removal of the insulator is executed by an insulator removal torch. Also, the present invention includes forming a metal ball on the front end of a coated wire; joining the metal ball to an external terminal of a semiconductor chip; bringing the rear end of the coated wire into contact with an external lead and destroying the insulator coating where the coated wire contacts the lead; and joining the metal wire at the rear end of the coated wire to the lead. According to the above-stated expedients, the combustion flames, which do not impose any damage or breakdown on the metal wire, can be turned around substantially the whole area of the bonding part of the coated wire, so that the insulator of the coated wire can be readily removed to lessen bonding defects. Moreover, the melting and shrinking insulator of the coated wire is blown away, and insulator globes can be prevented from being formed in the coated wire, so that the bonding defects are avoidable.

摘要翻译： 引线接合方法和引线接合装置技术领域本发明涉及引线接合方法和使用其中金属线的表面涂覆有绝缘体的涂覆线的引线接合装置，以及通过接合方法制造的半导体器件。 本发明包括形成（1）可燃气体的混合气体和（2）用于降低混合物的燃烧温度的温度控制气体; 并且通过使用由混合气体的可燃性气体的燃烧产生的火焰，在被覆线的接合部分处从被覆线上除去绝缘体涂层材料，从而使金属线的表面消失。 绝缘体的去除由绝缘体去除焊炬执行。 此外，本发明包括在涂覆线的前端形成金属球; 将所述金属球接合到半导体芯片的外部端子; 使涂层线的后端与外部引线接触，并破坏涂覆的电线与引线接触的绝缘体涂层; 并且将涂覆线的后端处的金属线接合到引线。 根据上述方法，不会在金属丝上施加任何损坏或击穿的燃烧火焰可以绕涂覆线的接合部分的整个区域转动，使得涂覆线的绝缘体 可以容易地除去以减少粘合缺陷。 此外，被覆线的熔融和收缩的绝缘体被吹走，并且可以防止在涂覆的线中形成绝缘体球，使得可以避免接合缺陷。

公开(公告)号：US08962881B2

公开(公告)日：2015-02-24

申请号：US13203311

申请日：2009-03-09

申请人： Michio Tanimoto ,  Nobuyuki Hakozaki

发明人： Michio Tanimoto ,  Nobuyuki Hakozaki

IPC分类号： C07C45/35 ,  C07C47/22 ,  C07C51/235 ,  C07C51/25 ,  C07C57/05 ,  C07C57/055

CPC分类号： C07C51/235

摘要： The disclosed invention is a method for manufacturing an oxidized organic compound which includes a step of forming an oxidized organic compound, in use of a fixed-bed reactor having a reaction tube packed with an oxide catalyst, by supplying at least one type of organic compound as a reaction feedstock gas and using a molecular oxygen-containing gas to carry out a catalytic gas-phase oxidation reaction; and a step of stopping the catalytic gas-phase oxidation reaction. In the manufacturing method, when stopping the catalytic gas-phase oxidation reaction, the supply of the reaction feedstock gas is stopped, after which an inert gas is supplied to the reactor, then a molecular oxygen-containing gas is supplied, subsequent to which the supply of the molecular oxygen-containing gas to the reactor is stopped.

摘要翻译： 所公开的发明是一种氧化有机化合物的制造方法，其包括形成氧化有机化合物的步骤，在使用具有填充有氧化物催化剂的反应管的固定床反应器的情况下，通过供给至少一种类型的有机化合物 作为反应原料气体并使用含分子氧的气体进行催化气相氧化反应; 以及停止催化气相氧化反应的步骤。 在制造方法中，停止催化气相氧化反应时，停止供给反应原料气体，之后向反应器供给惰性气体，然后供给含分子氧气体，接着， 停止向反应器供应含分子氧的气体。

公开(公告)号：US20090043128A1

公开(公告)日：2009-02-12

申请号：US12287082

申请日：2008-10-06

申请人： Hiromi Yunoki ,  Michio Tanimoto ,  Daisuke Nakamura

发明人： Hiromi Yunoki ,  Michio Tanimoto ,  Daisuke Nakamura

IPC分类号： C07C51/235 ,  B01J23/22 ,  B01J23/28

CPC分类号： C07C51/252 ,  B01J23/002 ,  B01J23/28 ,  B01J23/8885 ,  B01J37/0009 ,  B01J37/0223 ,  B01J37/0236 ,  B01J2523/00 ,  C07C57/04 ,  B01J2523/17 ,  B01J2523/55 ,  B01J2523/68 ,  B01J2523/69

摘要： An object of the present invention is to provide: a catalyst for production of acrylic acid which is a catalyst usable for production of acrylic acid and is excellent in the catalytic performances such as catalytic activity and in the physical properties such as physical strength of the catalyst itself; and a process for production of acrylic acid using this catalyst. As a means of achieving this object, a catalyst for production of acrylic acid according to the present invention is a catalyst obtained by drying a mixed liquid of starting materials including molybdenum and vanadium as essential components to give a dried material, molding the dried material with a liquid binder, and calcining the resultant molding, with the catalyst being characterized in that an ignition loss ratio of the dried material is from 5 to 40% by mass. A process for production of acrylic acid according to the present invention comprises the step of: subjecting acrolein to a catalytic gas phase oxidation in the presence of a molecular oxygen, with the process being characterized in that the above catalyst for production of acrylic acid according to the present invention is used.

摘要翻译： 本发明的目的在于提供：丙烯酸的制造用催化剂，其为可用于生产丙烯酸的催化剂，催化性能如催化活性以及催化剂的物理性能如催化剂的物理性能优异 本身; 以及使用该催化剂生产丙烯酸的方法。 作为实现该目的的手段，本发明的丙烯酸的制造用催化剂是通过干燥含有钼和钒的起始材料的混合液作为必要成分而得到的催化剂，得到干燥后的材料， 液体粘合剂，并煅烧所得到的模制品，催化剂的特征在于，干燥材料的灼烧损失率为5〜40质量％。 根据本发明的制备丙烯酸的方法包括以下步骤：在分子氧存在下使丙烯醛进行催化气相氧化，其特征在于上述用于生产丙烯酸的催化剂根据 使用本发明。

公开(公告)号：US07220698B2

公开(公告)日：2007-05-22

申请号：US11052897

申请日：2005-02-09

申请人： Hiromi Yunoki ,  Michio Tanimoto

发明人： Hiromi Yunoki ,  Michio Tanimoto

IPC分类号： B01J23/00 ,  C01C51/235

CPC分类号： C07C51/252 ,  B01J23/002 ,  B01J23/22 ,  B01J23/28 ,  B01J23/8876 ,  B01J23/8877 ,  B01J23/8885 ,  B01J37/0236 ,  B01J2523/00 ,  C07C57/04 ,  B01J2523/13 ,  B01J2523/17 ,  B01J2523/53 ,  B01J2523/55 ,  B01J2523/68 ,  B01J2523/69

摘要： There are provided a catalyst for catalytic gas phase oxidation of acrolein with molecular oxygen to produce acrylic acid, the catalyst including molybdenum and vanadium and further including at least one volatile catalyst poison ingredient in an amount of 10 to 100 ppb by mass as measured by ion chromatography; and a process for producing acrylic acid, including a step of carrying out catalytic gas phase oxidation of acrolein with molecular oxygen using the catalyst. The catalyst of the present invention can lower a hot spot temperature and suppress reduction in a reaction efficacy accompanied with thermal degradation, so that the acrolein conversion can stably be kept higher over a long term.

摘要翻译： 提供了一种用分子氧催化气相氧化丙烯醛产生丙烯酸的催化剂，该催化剂包括钼和钒，还包括至少一种挥发性催化剂毒成分，其用量为离子浓度为10-100ppb 色谱 以及丙烯酸的制造方法，包括使用催化剂进行丙烯醛与分子氧的催化气相氧化的工序。 本发明的催化剂可以降低热点温度并抑制伴随热降解的反应效率的降低，使得丙烯醛转化率可以长期稳定地保持较高。

公开(公告)号：US07161044B2

公开(公告)日：2007-01-09

申请号：US10958015

申请日：2004-10-04

申请人： Daisuke Nakamura ,  Michio Tanimoto

发明人： Daisuke Nakamura ,  Michio Tanimoto

IPC分类号： C07C45/27 ,  C07C51/10 ,  C07C51/14 ,  C07C51/16

CPC分类号： C07C45/35 ,  C07C45/32 ,  C07C45/37 ,  C07C51/252 ,  C07C47/22 ,  C07C57/04

摘要： An object of the present invention is to provide a catalytic gas phase oxidation reaction in which: even under reaction conditions of a higher gas pressure, a higher concentration of the raw material gas and a larger space velocity of a reaction gas, the thermal accumulation at the hot spot portion can be sufficiently suppressed with ease and at low costs, so that the reaction can be continued for a long time while a high yield is maintained. As a means of achieving this object, a catalytic gas phase oxidation reaction according to the present invention is a catalytic gas phase oxidation reaction with molecular oxygen or a molecular-oxygen-containing gas by using a fixed-bed multitubular reactor packed with catalysts; with the catalytic gas phase oxidation reaction being characterized in that: a catalyst-packed layer of each reaction tube of the reactor is divided into at least two reaction zones in a tubular axial direction; and the packing of the catalysts is such that the occupation volumes of the catalysts differ between at least two of the reaction zones and that an inert substance molding is mixed in at least one of the reaction zones.

摘要翻译： 本发明的目的是提供一种催化气相氧化反应，其中即使在较高气体压力，较高浓度的原料气体和较大的反应气体的空间速度的反应条件下，热累积在 可以容易地且低成本地充分地抑制热点部分，使得反应可以长时间持续，同时保持高产率。 作为实现该目的的手段，本发明的催化气相氧化反应是使用填充有催化剂的固定床多管反应器进行与分子氧或含分子氧气体的催化气相氧化反应， 催化气相氧化反应的特征在于：将反应器的每个反应管的催化剂填充层分成至少两个沿管轴方向的反应区; 并且催化剂的填充使得催化剂的占有体积在至少两个反应区之间不同，并且惰性物质模制品在至少一个反应区中混合。

公开(公告)号：US20060234861A1

公开(公告)日：2006-10-19

申请号：US11405588

申请日：2006-04-18

申请人： Naohiro Fukumoto ,  Michio Tanimoto

发明人： Naohiro Fukumoto ,  Michio Tanimoto

IPC分类号： B01J21/00

CPC分类号： B01J21/12 ,  B01J23/002 ,  B01J23/28 ,  B01J23/8885 ,  B01J37/0018 ,  B01J37/08 ,  B01J2523/00 ,  C07C51/252 ,  C07C57/04 ,  B01J2523/17 ,  B01J2523/53 ,  B01J2523/55 ,  B01J2523/67 ,  B01J2523/68 ,  B01J2523/69

摘要： A support for a gas-phase oxidation catalyst, the support including a solid acid, of which acid strength (H0) meets an inequality: −5.6≦H0≦1.5; a gas-phase oxidation catalyst including the above support and a complex oxide containing molybdenum and vanadium as essential components, the complex oxide being supported on the support; a process for producing acrylic acid by gas-phase catalytic oxidation of acrolein with molecular oxygen, the process including carrying out the gas-phase catalytic oxidation in a presence of the above gas-phase oxidation catalyst; and a process for producing the above support, the process including controlling an acid strength (H0) of a solid acid so as to meet an inequality: −5.6≦H0≦1.5 by adjusting a calcination temperature in a preparation of the solid acid contained in the support.

摘要翻译： 对于气相氧化催化剂的载体，其包含固体酸的载体，其酸强度（H 0 O 3）满足不等式：-5.6 <= H <0 < = 1.5; 包含上述载体的气相氧化催化剂和含有钼和钒作为必要组分的复合氧化物，复合氧化物负载在载体上; 通过气相催化氧化丙烯醛与分子氧生产丙烯酸的方法，该方法包括在上述气相氧化催化剂存在下进行气相催化氧化; 以及制备上述载体的方法，所述方法包括控制固体酸的酸强度（H 2 O 3）以满足不等式：-5.6 <= H <0 通过调节包含在载体中的固体酸的制备中的煅烧温度来确定。

公开(公告)号：US07045657B2

公开(公告)日：2006-05-16

申请号：US10387244

申请日：2003-03-12

申请人： Hiromi Yunoki ,  Michio Tanimoto

发明人： Hiromi Yunoki ,  Michio Tanimoto

IPC分类号： C07C51/235 ,  C07C51/16

CPC分类号： C07C45/37 ,  B01J23/002 ,  B01J23/8876 ,  B01J23/8877 ,  B01J23/8885 ,  B01J35/023 ,  B01J37/0009 ,  B01J37/0236 ,  C07C45/32 ,  C07C45/35 ,  C07C51/252 ,  C07C47/22 ,  C07C57/04

摘要： The object of the present invention is to provide a process in which, when the unsaturated carboxylic acid is produced, or when the unsaturated aldehyde and/or the unsaturated carboxylic acid are produced by carrying out the catalytic gas phase oxidation reaction by using the fixed-bed multitubular reactor which is packed with the molybdenum-containing catalyst, the reaction can be continued for a long time while a high yield is maintained, regardless of where the hot spot portion occurs and also even if the concentration of the raw gas is high. To solve this object, the present invention production process for an unsaturated carboxylic acid is characterized in: a particulate catalysts including, as catalytic components, an oxide and/or a complex oxide including Mo and V, or Mo, Fe and Bi as essential components, and having a hole are used; and a catalyst-packed layer of each reaction tube of the fixed-bed multitubular reactor is divided into at least two reaction zones in a tubular axial direction, wherein the packing of the catalysts is such that the diameters of the holes of the catalysts differ between at least two of the reaction zones.