公开(公告)号：US20120211549A1

公开(公告)日：2012-08-23

申请号：US13367509

申请日：2012-02-07

申请人： Takatoyo YAMAKAMI ,  Takashi KUBOTA ,  Kuniko ISHIKAWA ,  Masayuki KITAJIMA

发明人： Takatoyo YAMAKAMI ,  Takashi KUBOTA ,  Kuniko ISHIKAWA ,  Masayuki KITAJIMA

IPC分类号： B23K1/20 ,  B23K35/24

CPC分类号： H01L24/13 ,  B22F1/0014 ,  B22F1/025 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  C22C9/00 ,  C23C24/106 ,  H01L23/49811 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/0568 ,  H01L2224/05686 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/11502 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13599 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13709 ,  H01L2224/13711 ,  H01L2224/13713 ,  H01L2224/13809 ,  H01L2224/13811 ,  H01L2224/13813 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/13847 ,  H01L2224/13899 ,  H01L2224/13913 ,  H01L2224/13939 ,  H01L2224/13944 ,  H01L2224/13947 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16507 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81024 ,  H01L2224/81055 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/8121 ,  H01L2224/8123 ,  H01L2224/81509 ,  H01L2224/81511 ,  H01L2224/81513 ,  H01L2224/81639 ,  H01L2224/81644 ,  H01L2224/81647 ,  H01L2224/81699 ,  H01L2224/81711 ,  H01L2224/81713 ,  H01L2224/81739 ,  H01L2224/81744 ,  H01L2224/8181 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15738 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/01007 ,  H01L2924/01008 ,  H01L2924/01018 ,  H01L2924/01083 ,  H01L2924/01031 ,  H01L2924/0103 ,  H01L2924/053 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： An electro-conductive bonding material includes: metal components of a high-melting-point metal particle that have a first melting point or higher; a middle-melting-point metal particle that has a second melting point which is first temperature or higher, and second temperature or lower, the second temperature is lower than the first melting point and higher than the first temperature; and a low-melting-point metal particle that has a third melting point or lower, the third melting point is lower than the first temperature.

摘要翻译： 导电接合材料包括：具有第一熔点或更高熔点的高熔点金属颗粒的金属组分; 中间熔点金属粒子，其具有第一温度以上的第二熔点，第二温度以下，第二温度低于第一熔点且高于第一温度; 和具有第三熔点或更低熔点的低熔点金属颗粒，第三熔点低于第一温度。

公开(公告)号：US20130087605A1

公开(公告)日：2013-04-11

申请号：US13596511

申请日：2012-08-28

申请人： Takashi KUBOTA ,  Masayuki KITAJIMA ,  Takatoyo YAMAKAMI ,  Kuniko ISHIKAWA

发明人： Takashi KUBOTA ,  Masayuki KITAJIMA ,  Takatoyo YAMAKAMI ,  Kuniko ISHIKAWA

IPC分类号： B23K35/24 ,  B23K31/02

CPC分类号： B23K35/262 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/24 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/36 ,  B23K35/3613 ,  B23K2101/40 ,  C22C12/00 ,  C22C13/00 ,  C22C13/02 ,  H01B1/22 ,  H01L24/24 ,  H01L24/82 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/15788 ,  H01L2924/19105 ,  H05K1/0269 ,  H05K3/3463 ,  H05K2201/0272 ,  H01L2924/00

摘要： A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle.

摘要翻译： 一种导电接合材料，包括：第一金属颗粒; 平均粒径大于第一金属颗粒的平均粒径的第二金属颗粒; 和平均粒径大于第一金属粒子的平均粒径的第三金属粒子，比第一金属粒子的相对密度大的相对密度，高于第二金属粒子的熔点的熔点 。

公开(公告)号：US20130259421A1

公开(公告)日：2013-10-03

申请号：US13710670

申请日：2012-12-11

申请人： Takatoyo YAMAKAMI ,  Takashi KUBOTA ,  Kuniko ISHIKAWA ,  Hidehiko KIRA

发明人： Takatoyo YAMAKAMI ,  Takashi KUBOTA ,  Kuniko ISHIKAWA ,  Hidehiko KIRA

IPC分类号： B29D11/00 ,  G02B6/122

CPC分类号： B29D11/00721 ,  B29D11/00663 ,  G02B6/122 ,  G02B6/125 ,  G02B6/4214 ,  G02B2006/12104

摘要： A method of manufacturing an optical waveguide device, the method includes: inserting an inclined surface of a mold which is inclined relative to a surface of a substrate including an optical waveguide member into a through hole in which the optical waveguide member is exposed from one surface side of the substrate; locating an optical component above an opening of the through hole on the other surface side of the substrate; injecting an underfill material into between the optical component and the other surface and into the through hole; and curing the underfill material to form a mirror surface.

摘要翻译： 一种制造光波导装置的方法，该方法包括：将相对于包括光波导部件的基板的表面倾斜的模具的倾斜表面插入到光波导部件从一个表面露出的通孔中 侧面; 将光学部件定位在基板的另一表面侧上的通孔的开口上方; 将底部填充材料注入到所述光学部件和所述另一个表面之间并进入所述通孔中; 并固化底部填充材料以形成镜面。

公开(公告)号：US20110079896A1

公开(公告)日：2011-04-07

申请号：US12892029

申请日：2010-09-28

申请人： Yoshiyuki SATOH ,  Kenji KOBAE ,  Kimio NAKAMURA ,  Takayoshi MATSUMURA ,  Kuniko ISHIKAWA

发明人： Yoshiyuki SATOH ,  Kenji KOBAE ,  Kimio NAKAMURA ,  Takayoshi MATSUMURA ,  Kuniko ISHIKAWA

IPC分类号： H01L23/488 ,  H01L21/44

CPC分类号： H01L24/11 ,  H01L21/56 ,  H01L24/12 ,  H01L24/75 ,  H01L24/81 ,  H01L24/95 ,  H01L25/0655 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/0665

摘要： A semiconductor device fabrication method, comprising the steps of: forming a solder portion on an electrode of a substrate on which a semiconductor chip is to be mounted; applying a resin layer onto the substrate to a thickness such that a top region of the solder portion is exposed; curing the resin layer; providing a thermosetting underfill material over a region where the semiconductor chip is to be mounted; placing an electrode of the semiconductor chip face down on the solder portion in such a manner that the electrode faces the solder portion; and heating the underfill material and the solder portion.

摘要翻译： 一种半导体器件制造方法，包括以下步骤：在要安装半导体芯片的衬底的电极上形成焊料部分; 将树脂层施加到基板上以使得焊料部分的顶部区域暴露的厚度; 固化树脂层; 在要安装半导体芯片的区域上提供热固性底部填充材料; 将所述半导体芯片的电极朝向所述焊料部分，使得所述电极面向所述焊料部分; 并加热底部填充材料和焊料部分。