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26 条记录 (耗时 0.027 秒)

    Robust process for preparing high Br low COV tabular grain emulsions
    1.
    发明授权
    Robust process for preparing high Br low COV tabular grain emulsions 失效
    制备高Br低COV片状颗粒乳剂的稳健方法

    公开(公告)号：US5763151A

    公开(公告)日：1998-06-09

    申请号：US790347

    申请日：1997-01-24

    申请人： Thomas B. Brust ,  Philip J. Dale ,  Philip J. Zola ,  Terrence R. O'Toole

    发明人： Thomas B. Brust ,  Philip J. Dale ,  Philip J. Zola ,  Terrence R. O'Toole

    IPC分类号： G03C1/005 ,  G03C1/043 ,  G03C1/015 ,  G03C1/035

    CPC分类号： G03C1/0051

    摘要： A process is disclosed of preparing a photographic emulsion comprised of high bromide silver halide tabular grains accounting for greater than 90 percent of total grain projected area. The grains exhibit a low level of size dispersity by reason of forming in the presence of a dispersing medium containing a polyalkylene oxide block copolymer surfactant a population of silver halide grain nuclei containing twin planes, the halide content of the grain nuclei consisting essentially of silver bromide, and growing the silver halide grain nuclei containing twin planes to form the tabular silver halide grains. Inadvertent variation in tabular grain sizes and thicknesses from one precipitation to the next are minimized by growing the silver halide grain nuclei at a pH in the range of from 3.0 to 8.0 and in the presence of at least a 0.01M concentration of a partially dissociated acid having a pKa that is within 2.5 units of the pH and that forms a silver salt more soluble than the silver halide incorporated in the grains.

    摘要翻译： 公开了一种制备由高溴化银卤化银片状颗粒组成的照相乳剂占总颗粒投影面积的90％以上的方法。 由于在含有聚环氧烷烃嵌段共聚物表面活性剂的分散介质的存在下形成含有双面平面的卤化银颗粒核的颗粒，表现出较低的粒度分散度，晶核的卤化物含量基本上由溴化银 并且生长含有双平面的卤化银颗粒核以形成片状卤化银颗粒。 通过在3.0至8.0范围内的pH和在至少0.01M浓度的部分解离的酸的存在下生长卤化银颗粒核，使从一个沉淀到下一个沉淀的片状晶粒尺寸和厚度的无意的变化最小化 具有pH值在2.5单位内的pKa，并且形成比结合在晶粒中的卤化银更可溶的银盐。

    Electrochemical metal removal technique for planarization of surfaces
    3.
    发明授权
    Electrochemical metal removal technique for planarization of surfaces 失效
    用于平面化表面的电化学金属去除技术

    公开(公告)号：US5567300A

    公开(公告)日：1996-10-22

    申请号：US300623

    申请日：1994-09-02

    申请人： Madhav Datta ,  Terrence R. O'Toole

    发明人： Madhav Datta ,  Terrence R. O'Toole

    IPC分类号： C25F7/00 ,  B23H3/08 ,  C25F3/02 ,  C25F3/16 ,  H01L21/28 ,  C25F3/14

    CPC分类号： B23H3/08 ,  C25F3/02 ,  C25F3/16

    摘要： A high speed electrochemical metal removal technique provides for planarization of multilayer copper interconnection in thin film modules. The process uses a neutral salt solution, is compatible with the plating process and has minimum safety and waste disposal problems. The process offers tremendous cost advantages over previously employed micromilling techniques for planarization.

    摘要翻译： 高速电化学金属去除技术提供薄膜模块中多层铜互连的平面化。 该方法采用中性盐溶液，与电镀工艺兼容，具有最小的安全和废物处理问题。 该方法比以前采用的用于平坦化的微加工技术提供了巨大的成本优势。

    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
    6.
    发明授权
    Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
    多层包装中的粘合层和有机材料作为金属扩散屏障

    公开(公告)号：US5326643A

    公开(公告)日：1994-07-05

    申请号：US771929

    申请日：1991-10-07

    申请人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    发明人： Eleftherios Adamopoulos ,  Jungihl Kim ,  Kang-Wook Lee ,  Tae S. Oh ,  Terrence R. O'Toole ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Alfred Viehbeck ,  George F. Walker

    IPC分类号： B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  B32B27/00 ,  C08G73/00 ,  C08G73/10 ,  H01B3/30 ,  H01L21/52 ,  H05K1/03 ,  H05K3/46 ,  B32B9/00

    CPC分类号： C08G73/1089 ,  C08G73/1003 ,  C08G73/1007 ,  C08G73/101 ,  H01B3/306 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31721

    摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.

    摘要翻译： 本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。 还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

    Color developer concentrate for color film processing
    7.
    发明授权
    Color developer concentrate for color film processing 失效
    彩色显影剂专用于彩色胶片处理

    公开(公告)号：US06998227B2

    公开(公告)日：2006-02-14

    申请号：US10892951

    申请日：2004-07-16

    申请人： Michael P. Youngblood ,  Thomas E. Lowe ,  Terrence R. O'Toole ,  Charles M. Darmon

    发明人： Michael P. Youngblood ,  Thomas E. Lowe ,  Terrence R. O'Toole ,  Charles M. Darmon

    IPC分类号： G03C7/413

    CPC分类号： G03C7/413 ,  G03C5/266

    摘要： An aqueous, homogeneous, single-part color developing concentrate comprises a color developing agent in free base form and an organic antioxidant. The concentrate also includes a water-miscible or water-soluble organic co-solvent and a quaternary ammonium salt to enhance its stability. The concentrate can be used to make a working strength processing solution, or it can be used as a replenishing composition with proper dilution, and is particularly useful for processing color negative or color reversal photographic silver halide films.

    摘要翻译： 水性均匀的单份彩色显影浓缩物包含游离碱形式的彩色显影剂和有机抗氧化剂。 浓缩物还包括水混溶性或水溶性有机助溶剂和季铵盐以增强其稳定性。 该浓缩物可用于制备加工强度处理溶液，或者可以用作适当稀释的补充组合物，并且特别适用于处理彩色负片或彩色反转照相卤化银膜。