公开(公告)号：US20060183349A1

公开(公告)日：2006-08-17

申请号：US11390321

申请日：2006-03-27

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/31 ,  H01L23/28 ,  H01L23/34

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

摘要翻译： 半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。 该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。 一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。 此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。 在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

公开(公告)号：US20050269700A1

公开(公告)日：2005-12-08

申请号：US11204264

申请日：2005-08-15

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/768 ,  H01L21/78 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

摘要翻译： 半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。 该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。 一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。 此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。 在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

公开(公告)号：US20050227415A1

公开(公告)日：2005-10-13

申请号：US11146397

申请日：2005-06-07

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/768 ,  H01L21/78 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

公开(公告)号：US20060118953A1

公开(公告)日：2006-06-08

申请号：US11339177

申请日：2006-01-20

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

摘要翻译： 半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。 该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。 一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。 此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。 在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

公开(公告)号：US20050200028A1

公开(公告)日：2005-09-15

申请号：US11052279

申请日：2005-02-07

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/768 ,  H01L21/78 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

摘要翻译： 半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。 该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。 一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。 此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。 在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

公开(公告)号：US20050181540A1

公开(公告)日：2005-08-18

申请号：US11052378

申请日：2005-02-07

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/768 ,  H01L21/78 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

公开(公告)号：US20050148160A1

公开(公告)日：2005-07-07

申请号：US10646897

申请日：2003-08-22

申请人： Warren Farnworth ,  Alan Wood ,  Trung Doan

发明人： Warren Farnworth ,  Alan Wood ,  Trung Doan

IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/44 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L21/768 ,  H01L21/78 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/48 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76802 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/94 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05599 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/12105 ,  H01L2224/13009 ,  H01L2224/13022 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/27

摘要： A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the component includes the steps of providing a substrate containing multiple dice, forming trenches on the substrate proximate to peripheral edges of the dice, and depositing a polymer material into the trenches. In addition, the method includes the steps of planarizing the back side of the substrate to contact the polymer filled trenches, and cutting through the polymer trenches to singulate the components from the substrate. Prior to the singulating step the components can be tested and burned-in while they remain on the substrate.

摘要翻译： 半导体部件包括在六个表面上具有保护性聚合物层的变薄的半导体管芯。 该组件还包括嵌入在电路侧聚合物层中的裸片上的接触凸块，并且密集区域阵列中接触凸块上的端子接触。 一种用于制造该部件的方法包括以下步骤：提供包含多个骰子的基底，在基底上邻近骰子的周边边缘形成沟槽，以及将聚合物材料沉积到沟槽中。 此外，该方法包括以下步骤：平坦化衬底的背面以接触聚合物填充的沟槽，并切割穿过聚合物沟槽以从衬底中分离组分。 在分离步骤之前，组分可以在它们保留在基材上时被测试和燃烧。

公开(公告)号：US20050242422A1

公开(公告)日：2005-11-03

申请号：US11167031

申请日：2005-06-27

申请人： Dean Klein ,  Alan Wood ,  Trung Doan

发明人： Dean Klein ,  Alan Wood ,  Trung Doan

IPC分类号： H01L23/498 ,  H01L25/065 ,  H01L23/02

CPC分类号： H01L23/48 ,  B33Y80/00 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/49833 ,  H01L24/10 ,  H01L24/13 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor package component includes a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configured as an internal signal transmission system, and a physical structure for supporting a terminal contact system of the package component. The package component also includes an encapsulant on the base die encapsulating the interconnect contacts, an underfill layer between the dice, and terminal contacts configured for flip chip mounting the package component to a supporting substrate. A method for fabricating the package component includes the steps of providing a base wafer containing a plurality of base dice, and flip chip mounting the secondary dice to the base dice on the base wafer. In addition the method includes the steps of forming and planarizing the interconnect contacts on the base dice, and forming the terminal contacts on the planarized interconnect contacts.

摘要翻译： 半导体封装部件包括安装在基模上的基模和次晶片倒装芯片。 基座芯片包括用于将二次管芯倒装芯片安装到基底管芯的一组叠置触点，以及一组配置为内部信号传输系统的互连触头，以及用于支撑封装部件的端子接触系统的物理结构。 封装部件还包括在封装了互连触头的基底管芯上的密封剂，芯片之间的底部填充层和被配置用于将封装部件倒装芯片安装到支撑衬底的端子触头。 制造封装部件的方法包括以下步骤：提供包含多个基底晶片的基底晶片，以及将二次晶片安装到基底晶片上的基底晶片的倒装芯片。 此外，该方法包括以下步骤：在基底裸片上形成和平坦化互连触点，以及在平坦化的互连触点上形成端子触点。

公开(公告)号：US20060237833A1

公开(公告)日：2006-10-26

申请号：US11473731

申请日：2006-06-23

申请人： Dean Klein ,  Alan Wood ,  Trung Doan

发明人： Dean Klein ,  Alan Wood ,  Trung Doan

IPC分类号： H01L23/02

CPC分类号： H01L23/48 ,  B33Y80/00 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/49833 ,  H01L24/10 ,  H01L24/13 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599

摘要： A system includes a semiconductor component having a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configured as an internal signal transmission system, and a physical structure for supporting a terminal contact system of the package component. The component also includes an encapsulant on the base die encapsulating the interconnect contacts, an underfill layer between the dice, and terminal contacts configured for flip chip mounting the package component to a supporting substrate.

摘要翻译： 一种系统包括具有安装在基模上的基模和二次晶片倒装芯片的半导体部件。 基座芯片包括用于将二次管芯倒装芯片安装到基底管芯的一组叠置触点，以及一组配置为内部信号传输系统的互连触头，以及用于支撑封装部件的端子接触系统的物理结构。 该组件还包括在基底模具上封装了互连触头的密封剂，芯片之间的底部填充层和被配置用于将封装部件倒装芯片安装到支撑衬底的端子触头。

公开(公告)号：US20060006520A1

公开(公告)日：2006-01-12

申请号：US11208304

申请日：2005-08-19

申请人： Alan Wood ,  Trung Doan

发明人： Alan Wood ,  Trung Doan

IPC分类号： H01L23/04

CPC分类号： H01L23/3114 ,  H01L21/76831 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05172 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  Y10S438/977 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05184

摘要： A semiconductor component includes back side pin contacts fabricated using a circuit side fabrication method. The component also includes a thinned semiconductor die having a pattern of die contacts, and conductive members formed by filled openings in the die contacts and the die. In addition, the pin contacts are formed by terminal portions of the conductive members. The fabrication method includes the steps of forming the openings and the conductive members, and then thinning and etching the die to form the pin contacts. An alternate embodiment female component includes female conductive members configured to physically and electrically engage pin contacts on a mating component of a stacked assembly.

摘要翻译： 半导体部件包括使用电路侧制造方法制造的后侧引脚触点。 该部件还包括具有模接触图案的薄化半导体管芯，以及由管芯接触件和管芯中的填充开口形成的导电部件。 此外，引脚触点由导电构件的端子部分形成。 制造方法包括形成开口和导电构件的步骤，然后使模具变薄和蚀刻以形成引脚触点。 替代实施例的阴部件包括阴导电部件，其被配置为物理地和电接合堆叠组件的配合部件上的销触点。