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公开(公告)号：US10141717B2
公开(公告)日：2018-11-27
申请号：US15855927
申请日：2017-12-27
Applicant: INPHI CORPORATION , Luxnet Corporation
Inventor： Radhakrishnan L. Nagarajan , Peng-Chih Li , Pi-Cheng Law
Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
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公开(公告)号：US09854674B1
公开(公告)日：2017-12-26
申请号：US15460683
申请日：2017-03-16
Applicant: LuxNet Corporation
Inventor： Ho-I Chen , Yi-Ching Chiu , Bo-Wei Liu , Hsing-Yen Lin , Hua-Hsin Su
CPC classification number: H05K1/141 , H01R4/02 , H01R4/021 , H01R12/61 , H01R12/62 , H01R12/707 , H05K1/0245 , H05K1/112 , H05K2201/041 , H05K2201/058
Abstract: A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.
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公开(公告)号：US20140239315A1
公开(公告)日：2014-08-28
申请号：US14183328
申请日：2014-02-18
Applicant: LUXNET CORPORATION
Inventor： Yun-Cheng HUANG , Chien-Wen LU , Chung Hsin FU , Chi-Min TING , Tsing-Chow WANG
IPC: H01L33/48
CPC classification number: H01L25/167 , H01L24/48 , H01L24/85 , H01L25/0753 , H01L27/14685 , H01L31/0203 , H01L31/0232 , H01L31/173 , H01L33/62 , H01L2224/48091 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/19107 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.
Abstract translation: 本发明提供一种光收发器部件的封装结构，包括：金属基座; 多个引脚，至少一个发光二极管和/或至少一个光接收二极管; 其中所述销被提供并通过所述金属基底并且通过使用绝缘材料与所述金属基底绝缘; 光发射二极管和光接收二极管分别通过子座安装在金属基座上。 当将发射二极管/光接收二极管的顶表面设置为基准电平时，光发射二极管/光接收二极管通过电线直接或穿过子座连接到与其相邻的引脚，发光的顶表面中的至少一个 二极管，光接收二极管和子座与基准电平齐平。
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公开(公告)号：US10283652B1
公开(公告)日：2019-05-07
申请号：US16012252
申请日：2018-06-19
Applicant: LuxNet Corporation
Inventor： Kuo-Hao Lee , Tsung-Chi Hsu , Ming-Chih Lai
IPC: H01L31/02 , H01L31/0203 , H01L31/0216 , H01L27/12 , H01L31/0224
Abstract: The present invention provides an electrode stack structure capable of preventing moisture from entering a photodiode, comprising: a semiconductor layer; an inner electrode layer provided on the semiconductor layer; a dielectric layer coating a sidewall of the semiconductor layer; an intermediate metal layer provided on, bonded to, and in electrical conduction with the inner electrode layer, wherein the intermediate metal layer has a bottom side extending over and covering a portion of the dielectric layer to provide airtightness; and an anti-reflection layer coating on an outer side of the semiconductor layer, an outer side of the intermediate metal layer, and an outer side of the dielectric layer, with a groove formed in the anti-reflection layer by leaving a predetermined area of a top side of the intermediate metal layer uncoated or by removing a portion of the anti-reflection layer that coats the predetermined area of the top side of the intermediate metal layer, and an outer electrode layer plated on the predetermined area of the top side of the intermediate metal layer.
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公开(公告)号：US09991674B2
公开(公告)日：2018-06-05
申请号：US15354261
申请日：2016-11-17
Applicant: LuxNet Corporation
Inventor： Pi-Cheng Law , Po-Chao Huang , Hsing-Yen Lin , Chung-Hsin Fu , Hua-Hsin Su
CPC classification number: H01S5/02469 , H01S5/0064 , H01S5/02208 , H01S5/02212 , H01S5/02276 , H01S5/02284 , H01S5/02288 , H01S5/02296 , H01S5/02438 , H01S5/02492
Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.
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Patent Agency Ranking
公开(公告)号：US09400359B1
公开(公告)日：2016-07-26
申请号：US14707743
申请日：2015-05-08
Applicant: LuxNet Corporation
Inventor： Chung Hsin Fu , Ya Chuan Lin , Shu Chun Chang , Yun Cheng Huang , Hua Hsin Su
IPC: G02B6/42
CPC classification number: G02B6/4244 , G02B6/4204 , G02B6/4208 , G02B6/428 , G02B6/4284 , G02B6/4296
Abstract: An optical transmitter package structure, comprising: a base, a circuit substrate, and a cylindrical light-coupling mechanism. The optical transmitter package structure of the present invention has following advantageous effects: once the packaging process of the optical transmitter of the present invention is completed, the resulting structure is compact and airtight. Consequently, the optical transmitter is well protected against moisture during use and has a long service life; the optical transmitter of the present invention has a sturdy overall structure which is resistant to damage by improper operation during assembly.
Abstract translation: 一种光发射器封装结构，包括：基座，电路基板和圆柱形光耦合机构。 本发明的光发射机封装结构具有以下有益效果：一旦本发明的光发射机的封装过程完成，所得结构紧凑且气密。 因此，光发射机在使用过程中受到良好的防潮保护，使用寿命长; 本发明的光发射机具有坚固的整体结构，其在组装期间不利于不正确的操作而受到损坏。
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公开(公告)号：US08721194B2
公开(公告)日：2014-05-13
申请号：US13613598
申请日：2012-09-13
Applicant: Yun-Cheng Huang , Chi-Min Ting , Tsing-Chow Wang , Chung Hsin Fu
Inventor： Yun-Cheng Huang , Chi-Min Ting , Tsing-Chow Wang , Chung Hsin Fu
CPC classification number: G02B6/4214 , G02B6/264 , G02B6/4201 , G02B6/4204 , G02B6/4246 , G02B6/4249 , G02B6/425 , G02B6/4256 , G02B6/426 , G02B6/4292 , G02B6/43
Abstract: The present invention provides an optical transceiver module, comprising: a circuit substrate; a z-axis positioning base connected to the circuit substrate that, wherein the z-axis positioning base comprises two first sides respectively provided on two lateral sides of the optical transceiver sub-module, a second side provided between and connecting the two first sides, an opening corresponding in position to a side of the optical transceiver sub-module that faces away from the second side, and a step difference provided on each of the two first sides and the second side; a fiber-optic lens element provided on the z-axis positioning base and comprises a cover and a fiber-optic lens sub-module, wherein the cover comprises a recess and step differences surrounding the recess and respectively corresponding in position to the step differences provided on the z-axis positioning base, so as for the cover to be fitted on the z-axis positioning base.
Abstract translation: 本发明提供了一种光收发器模块，包括：电路基板; 连接到所述电路基板的z轴定位基座，其中所述z轴定位基座包括分别设置在所述光收发器子模块的两个侧面上的两个第一侧，设置在所述两个第一侧之间并连接所述两个第一侧的第二侧， 位于所述光收发器子模块的背离所述第二侧的位置的开口以及设置在所述两个第一侧和所述第二侧中的每一个上的台阶差; 设置在所述z轴定位基座上并且包括盖和光纤透镜子模块的光纤透镜元件，其中所述盖包括凹部和围绕所述凹部的台阶差，并且分别对应于所提供的台阶差的位置 在z轴定位底座上，以便将盖安装在z轴定位座上。
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公开(公告)号：US20210091536A1
公开(公告)日：2021-03-25
申请号：US17115296
申请日：2020-12-08
Applicant: Inphi Corporation , Luxnet Corporation
Inventor： Radhakrishnan L. NAGARAJAN , Peng-Chih LI , Pi-Cheng LAW
Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
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公开(公告)号：US10656355B2
公开(公告)日：2020-05-19
申请号：US16413145
申请日：2019-05-15
Applicant: LuxNet Corporation
Inventor： Pi-Cheng Law , Po-Chao Huang , Hsing-Yen Lin , Ya-Hsin Deng , Hua-Hsin Su
Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.
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公开(公告)号：US09548817B1
公开(公告)日：2017-01-17
申请号：US14745316
申请日：2015-06-19
Applicant: INPHI CORPORATION , Luxnet Corporation
Inventor： Radhakrishnan L. Nagarajan , Peng-Chih Li , Pi-Cheng Law
CPC classification number: H01S5/0612 , G02B6/4204 , G02B6/4212 , G02B6/4215 , G02B6/4271 , G02B6/4287 , G02B6/4296 , H01S5/0064 , H01S5/0224 , H01S5/02248 , H01S5/02284 , H01S5/02288 , H01S5/02415 , H01S5/02438 , H01S5/068 , H01S5/125 , H04B10/501
Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
Abstract translation: 包装的发射机装置包括基座部件，该基部部件包括安装有热电冷却器的平面部分，发射器和耦合透镜组件，以及连接到平面部分的一侧的组装部件。 该装置还包括弯曲成具有第一端部区域和第二端部区域的电路板，该第二端部区域被升高到更高的电平。 布置在平面部分的顶表面上的第一端区包括分别连接到热电和发射器的多个电连接片。 第二端区域包括用于外部连接的电气端口。 另外，该装置包括设置在平面部分上的盖构件。 此外，该装置包括安装到组装部分的圆柱形构件，用于围绕沿其轴线对准耦合透镜组件的隔离器并且连接到光纤以将来自发射器的光信号耦合到光纤。
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