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    Wear-Resistant Nanocrystalline Hard Noble Metal Coating
    5.
    发明申请
    Wear-Resistant Nanocrystalline Hard Noble Metal Coating 审中-公开
    耐磨纳米晶硬质金属涂层

    公开(公告)号：US20140319432A1

    公开(公告)日：2014-10-30

    申请号：US14242746

    申请日：2014-04-01

    申请人： Sandia Corporation

    发明人： Ronald S. Goeke ,  Nicolas Argibay ,  Somuri V. Prasad

    IPC分类号： H01B1/02 ,  H01B13/00

    CPC分类号： H01B1/02 ,  C22C5/00 ,  C22C5/02 ,  C23C14/0688

    摘要： A new class of electrically conductive, wear resistant, and high thermal stability nanocrystalline noble metal coatings achieved by codeposition of an insoluble, unreactive, and thermally stable, grain boundary segregated ceramic species that strengthens the base metal by inhibiting grain boundary mobility and recrystallization during deposition. These coatings exhibit high hardness and wear resistance while maintaining electrical conductivity effectively equivalent to that of the pure, fine-grained base metal. The coatings exhibit relatively low friction coefficients in nominally unlubricated sliding, and high thermal stability. The friction, wear, and electrical contact characteristics of these coatings are comparable or superior to electroplated hard gold films used extensively in electrical contact applications. The use of physical vapor deposition techniques such as electron beam evaporation provides an environmentally friendly alternative to electroplating for the synthesis of high performance hard gold films.

    摘要翻译： 通过共沉积不溶性，非反应性和热稳定的晶界分离的陶瓷物质实现的一类新型的导电，耐磨和高热稳定性的纳米晶体贵金属涂层，其通过抑制沉积期间的晶界迁移率和重结晶来增强贱金属 。 这些涂层表现出高的硬度和耐磨性，同时保持与纯的细粒贱金属的导电性相当的导电性。 涂层在名义上未润滑的滑动中具有相对低的摩擦系数，并且具有高的热稳定性。 这些涂层的摩擦，磨损和电接触特性与电接触应用中广泛使用的电镀硬金膜相当或优于其他。 使用诸如电子束蒸发的物理气相沉积技术为用于合成高性能硬金膜的电镀提供了环保的替代方案。

    CONNECTOR WITH GOLD-PALLADIUM PLATED CONTACTS
    6.
    发明申请
    CONNECTOR WITH GOLD-PALLADIUM PLATED CONTACTS 有权
    连接器，带镀金接头

    公开(公告)号：US20140045352A1

    公开(公告)日：2014-02-13

    申请号：US13772755

    申请日：2013-02-21

    申请人： APPLE INC.

    发明人： Douglas J. Weber ,  Naoto Matsuyuki ,  Eric S. Jol

    IPC分类号： H01R13/03 ,  H01R43/20 ,  H01R24/20

    CPC分类号： H01R13/03 ,  B32B15/018 ,  C22C5/00 ,  C22C5/02 ,  C23C18/1653 ,  C25D3/62 ,  C25D5/12 ,  C25D7/00 ,  H01R24/20 ,  H01R43/16 ,  H01R43/205 ,  Y10T29/49208

    摘要： An improved outer layer of plating comprising a binary metal alloy of gold and palladium is employed on connector contacts. The binary metal alloy is plated on at least the contact surface of the contacts. Intermediate plating layers can be applied between the outer layer of gold and palladium and the conductive base of the contacts. The binary metal alloy of gold and palladium may be configured to have a mostly gold or a mostly silver appearance, depending upon the relative concentration of gold and palladium in the binary metal alloy.

    摘要翻译： 在连接器触点上使用包括金和钯的二元金属合金的改进的镀层外层。 二元金属合金电镀在至少触点的接触表面上。 可以在金和钯的外层和触点的导电基底之间施加中间镀层。 根据二元金属合金中金和钯的相对浓度，金和钯的二元金属合金可以被配置为具有大多数金或大部分银外观。

    Solder paste
    8.
    发明授权
    Solder paste 有权
    焊膏

    公开(公告)号：US08388724B2

    公开(公告)日：2013-03-05

    申请号：US12226653

    申请日：2007-04-23

    申请人： Rikiya Kato ,  Sakie Yamagata

    发明人： Rikiya Kato ,  Sakie Yamagata

    IPC分类号： B32B15/01 ,  B32B15/02 ,  B32B15/20 ,  B23K1/00

    CPC分类号： H05K3/3484 ,  B22F1/0003 ,  B22F1/0059 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  C22C5/00 ,  C22C9/02 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2982

    摘要： High-temperature solders having a higher melting point than solder alloys used for soldering of printed circuit boards are used for internal bonding of electronic parts, but high-temperature solders which are free from Pb have not been developed. There exist high-temperature solders which comprises Sn balls and Cu balls and which perform bonding through the formation of an intermetallic compound without melting to form a single-phase structure, but they have poor wettability to the lands of a printed circuit board or electrodes of electronic parts and have not been used.A solder paste according to the present invention is provided by mixing flux with a powder mixture of Sn powder or an Sn based lead-free solder powder with Cu or Ag powder which has Ni plating formed on its surface. Although the solder paste performs bonding by means of an intermetallic compound without melting to form a single phase structure, the Ni plating acts as a barrier which retards the formation of the intermetallic compound so as to leave enough time to permit wetting of the lands of a printed circuit board or electrodes of an electronic part.

    摘要翻译： 具有比用于焊接印刷电路板的焊料合金更高的熔点的高温焊料用于电子部件的内部粘合，但是没有开发出没有Pb的高温焊料。 存在包含Sn球和Cu球的高温焊料，并且通过形成金属间化合物而不熔化形成单相结构，但是它们对印刷电路板的焊盘或电极的电极的润湿性差 电子部件并未使用。 通过将助熔剂与Sn粉末或Sn类无铅焊料粉末的混合物与其表面上形成有Ni镀层的Cu或Ag粉末混合来提供根据本发明的焊膏。 虽然焊膏通过金属间化合物进行结合而不熔化形成单相结构，但是Ni镀层作为阻碍金属间化合物形成的屏障，以便留下足够的时间来润湿 印刷电路板或电子部件的电极。

    PRECIOUS METAL JEWELRY AND PROCESS FOR PRODUCING THE SAME
    9.
    发明申请
    PRECIOUS METAL JEWELRY AND PROCESS FOR PRODUCING THE SAME 审中-公开
    精美的金属珠宝及其生产工艺

    公开(公告)号：US20090081425A1

    公开(公告)日：2009-03-26

    申请号：US11914034

    申请日：2006-03-01

    申请人： Kazuki Nakajima

    发明人： Kazuki Nakajima

    IPC分类号： B05D3/12 ,  B32B3/00 ,  C23C16/00 ,  C23C14/00

    CPC分类号： A44C27/006 ,  A44C15/004 ,  B24B9/16 ,  B32B15/018 ,  B44C3/005 ,  B44F1/02 ,  C22C5/00 ,  C23C18/1603 ,  C23C18/1651 ,  C23C18/1689 ,  C23C18/31 ,  Y10T428/24917

    摘要： This Invention concerns a ring (11) or other accessory and jewelry goods provided with a pattern resulting from processing a metal underlayer (111) of a noble metal and/or a metal plating layer (112) formed on the metal underlayer (111). The noble metal jewelry goods has the metal plating layer (112) formed in a uniform thickness on the whole upper surface of the metal underlayer (111) and has the metal underlayer (111) and/or the metal plating layer (112) enabled by the rod-shaped grinding tool (12) to form glossy regions (111-1) and (111-2) exposing the metal underlayer (111). The noble metal jewelry goods of this invention is enabled to form the metal plating layer region (112) that has not been ground by the rod-shaped grinding tool (12) at all and expose the metal plating layer. The method for the production of the noble metal jewelry goods causes the metal underlayer (111) and/or the metal plating layer (112) of the noble metal jewelry goods to be linearly ground as controlled in fine variation in length, depth and pitch in the direction of the line width and consequently allows formation of different light reflection regions (113) showing no clear periphery of the pattern as compared with the pattern manufactured by using a mask. Thus, the produced noble metal jewelry goods deserves a high price.

    摘要翻译： 本发明涉及一种具有由金属底层（111）上形成的贵金属和/或金属镀层（112）的金属底层（111）所形成的图案的环（11）或其他附件和饰品。 贵金属首饰品具有在金属底层（111）的整个上表面上均匀厚度形成的金属镀层（112），并且金属镀层（111）和/或金属镀层（112）能够由 所述棒状研磨工具（12）形成暴露所述金属底层（111）的光泽区域（111-1）和（111-2）。 本发明的贵金属饰品可以形成没有被棒状研磨工具（12）研磨的金属镀层区域（112），并露出金属镀层。 贵金属首饰品的制造方法使贵金属饰品的金属底层（111）和/或金属镀层（112）线性地被研磨，可以在长度，深度和间距的微小变化中被控制 与通过使用掩模制造的图案相比，线宽度的方向并因此允许形成不显示图案的清晰周边的不同光反射区域（113）。 因此，生产的贵金属首饰品价格高昂。