公开(公告)号：US09972598B2

公开(公告)日：2018-05-15

申请号：US15640493

申请日：2017-07-01

申请人： Renesas Electronics Corporation

发明人： Yuki Yagyu

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45687 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/7815 ,  H01L2224/78756 ,  H01L2224/8502 ,  H01L2224/85051 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85355 ,  H01L2224/85359 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/85898 ,  H01L2224/85948 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/0541 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01106 ,  H01L2924/01107 ,  H01L2224/45664 ,  H01L2924/00015

摘要： Reliability of a semiconductor device is improved.A wire bonding step includes a step of exposing a wire and a pad electrode to a reducing gas atmosphere, forming a first hydroxyl layer on a surface of a ball portion, and forming a second hydroxyl layer on a surface of the pad electrode, a first bonding step of temporarily joining the ball portion to the pad electrode through the first hydroxyl layer and the second hydroxyl layer, and after the first bonding step, a step of actually joining the ball portion to the pad electrode by performing a heat treatment on a semiconductor chip and a base material.

公开(公告)号：US20170062381A1

公开(公告)日：2017-03-02

申请号：US15308544

申请日：2015-05-08

申请人： ROHM CO., LTD.

发明人： Kazuya IKOMA

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L24/85 ,  B23K20/10 ,  B23K20/1205 ,  B23K20/129 ,  H01L21/4825 ,  H01L21/4882 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/0603 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48456 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/78315 ,  H01L2224/78343 ,  H01L2224/7855 ,  H01L2224/78705 ,  H01L2224/78756 ,  H01L2224/83801 ,  H01L2224/85047 ,  H01L2224/85136 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85423 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/014

摘要： A manufacturing method for a wire bonding structure of the present invention includes a step of preparing a wire made of Cu and a step of joining the wire to a first joining target formed on an electronic device. Before the joining step, the wire has an outer circumferential surface and a withdrawn surface. The withdrawn surface is withdrawn toward a central axis of the wire from the outer circumferential surface. In the joining step, ultrasonic vibration is applied to the wire in a state in which the withdrawn surface is pressed against the first joining target.

摘要翻译： 本发明的引线接合结构体的制造方法包括：制备由Cu制成的线的步骤和将导线接合到形成在电子器件上的第一接合目标的步骤。 在接合步骤之前，电线具有外圆周表面和退出表面。 退出的表面从外周面朝着线的中心轴线退出。 在接合步骤中，在退避表面被压靠在第一接合对象上的状态下，将超声波振动施加于线。

公开(公告)号：US20190237427A1

公开(公告)日：2019-08-01

申请号：US16262761

申请日：2019-01-30

申请人： Kulicke and Soffa Industries, Inc.

发明人： Peter Klaerner ,  Jose de Jesus Lozano de Alva ,  Jason Fu ,  Masih Mahmoodi

IPC分类号： H01L23/00 ,  B08B1/00 ,  B08B1/02 ,  B08B1/04 ,  B08B7/00 ,  B23K37/00

CPC分类号： H01L24/78 ,  B08B1/002 ,  B08B1/02 ,  B08B1/04 ,  B08B7/0042 ,  B23K37/00 ,  H01L2224/7801 ,  H01L2224/78343 ,  H01L2224/78756

摘要： A wire bonding machine is provided. The wire bonding machine includes: (a) a wire bonding tool; (b) a wire guide for guiding a wire to a position beneath a bonding surface of the wire bonding tool, the wire guide being configured for movement between (i) an engagement position with respect to the wire bonding tool and (ii) a non-engagement position with respect to the wire bonding tool; and a cleaning station for cleaning at least a portion of a tip of the wire bonding tool when the wire guide is in the non-engagement position.

公开(公告)号：US20180082977A1

公开(公告)日：2018-03-22

申请号：US15640493

申请日：2017-07-01

申请人： Renesas Electronics Corporation

发明人： Yuki YAGYU

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L24/85 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45687 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/7815 ,  H01L2224/78756 ,  H01L2224/8502 ,  H01L2224/85051 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85355 ,  H01L2224/85359 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/85898 ,  H01L2224/85948 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/0541 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01106 ,  H01L2924/01107 ,  H01L2224/45664 ,  H01L2924/00015

摘要： Reliability of a semiconductor device is improved.A wire bonding step includes a step of exposing a wire and a pad electrode to a reducing gas atmosphere, forming a first hydroxyl layer on a surface of a ball portion, and forming a second hydroxyl layer on a surface of the pad electrode, a first bonding step of temporarily joining the ball portion to the pad electrode through the first hydroxyl layer and the second hydroxyl layer, and after the first bonding step, a step of actually joining the ball portion to the pad electrode by performing a heat treatment on a semiconductor chip and a base material.

公开(公告)号：US20140326778A1

公开(公告)日：2014-11-06

申请号：US13888189

申请日：2013-05-06

申请人： Shang-Che Lee

发明人： Shang-Che Lee

IPC分类号： H01L23/00 ,  B23K20/10

CPC分类号： H01L24/78 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/4911 ,  H01L2224/78315 ,  H01L2224/78316 ,  H01L2224/78756 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2224/45099

摘要： An ultrasonic wire bonding wedge with multiple bonding wire slots is provided. The wire bonding wedge includes a pillar fixing part for providing fixed connection to the bonding device. One end of the fixing part includes a wire bonding wedge nozzle, with feature that the tip of the nozzle including at least two bonding wire slots. The tip of nozzle of the wire bonding wedge includes at least two bonding wire slots, and is able to realize bonding operations between two or more bonding wires and the chips to improve bonding operation efficiency. When bonding operation is performed on a smaller bonding area, or two or more parallel bonding wires, the wire bonding wedge is able to perform a single bonding operation in a smaller bonding operation so as to reduce defective rate of the chips and ensure sufficient bonding strength of the bonding operation.

摘要翻译： 提供具有多个接合线槽的超声波引线接合楔。 引线键合楔包括用于提供与接合装置的固定连接的柱固定部。 固定部分的一端包括引线键合楔形喷嘴，其特征在于喷嘴的尖端包括至少两个接合线槽。 引线接合楔的喷嘴的尖端包括至少两个接合线槽，并且能够实现两个或更多个接合线和芯片之间的接合操作，以提高接合操作效率。 当在较小的接合面积或两根或多根平行的接合线上进行接合操作时，引线接合楔可以在较小的接合操作中进行单次接合操作，以便减少切屑的缺陷率并确保足够的接合强度 的接合操作。