公开(公告)号：WO00060914A1

公开(公告)日：2000-10-12

申请号：PCT/US1999/007275

申请日：1999-04-01

IPC: H01L23/04 ,  H01L23/10 ,  H01L23/42 ,  H05K7/20 ,  H05K5/06

CPC classification number: H05K7/20872 ,  H01L23/04 ,  H01L23/10 ,  H01L23/42 ,  H01L2924/0002 ,  H05K5/062 ,  H01L2924/00

Abstract: Cooling liquids such as fluorocarbons are enclosed within a module containing electronic components (12) on a printed wiring board (11). Preferably top and bottom covers (26, 16) are applied to the top and bottom of the board (11) and liquid-sealed thereto. Hot-melt adhesive (34, 34a) is used for the seal. Each edge of a cover has an outward-extending flange (19, 19a) formed with a peripheral downward turned lip. Heated adhesive (34, 34a) is applied to the board in a continuous bead around the flange (19, 19a), the thickness of the bead being greater than the height of the lip (21).

Abstract translation: 诸如碳氟化合物之类的冷却液被封装在包含印刷线路板（11）上的电子部件（12）的模块内。 优选地，顶盖和底盖（26,16）施加到板（11）的顶部和底部并液体密封到其上。 热熔胶（34,34a）用于密封。 盖的每个边缘具有形成有外围向下转动的唇缘的向外延伸的凸缘（19,19a）。 加热粘合剂（34,34a）以围绕凸缘（19,19a）的连续的胎圈施加到板上，胎圈的厚度大于唇缘（21）的高度。

公开(公告)号：WO99000844A2

公开(公告)日：1999-01-07

申请号：PCT/US1998/013692

申请日：1998-06-30

IPC: G01R1/04 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/48 ,  H01L23/538 ,  H05K3/30 ,  H05K3/32

CPC classification number: G01R1/0408 ,  B23K3/087 ,  G01R1/0416 ,  G01R1/0466 ,  G01R31/2886 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81901 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/119 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2201/09827 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00014 ,  H01L2224/72

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract translation: 从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接是通过推动电子部件，因此弹簧接触元件的端部垂直地抵靠互连基板的端子，或者通过水平推动互连基板的端子 抵抗弹簧接触元件的端部。 公开了各种终端配置。

公开(公告)号：WO9828954A3

公开(公告)日：1998-10-15

申请号：PCT/US9722446

申请日：1997-12-09

Applicant: LSI LOGIC CORP

Inventor： LIM SENGSOOI ,  RANGANATHAN RAMASWAMY ,  PATEL SUNIL A

IPC: H01L23/04 ,  H01L23/055 ,  H05K

CPC classification number: H01L23/04 ,  H01L23/055 ,  H01L2224/16 ,  H01L2924/15311

Abstract: This invention relates to a method and system for producing a secmiconductor package interconnectably mounted on a semiconductor package substrate (14) without substantial package warpage, and to a method for using a stiffener member (20) to reliably overcome such substantial package warpage. The subject method comprises providing a semiconductor package and a semiconductor package substrate having respective first and second major sides. A stiffener member (20) is attached to the semiconductor package substrate to provide the requisite support for the semiconductor package substrate during the assembly process and thereby counteract the sources of the package warpage problem. A protective outer layer can be optionally added to the subject system.

公开(公告)号：WO9734321A3

公开(公告)日：1997-10-23

申请号：PCT/IB9700157

申请日：1997-02-25

Applicant: PHILIPS ELECTRONICS NV ,  PHILIPS NORDEN AB

Inventor： MAAS HENRICUS GODEFRIDUS RAFAE ,  DEKKER RONALD ,  MICHIELSEN THEODORUS MARTINUS ,  VAN DEN EINDEN WILHELMUS THEOD

IPC: H01L27/12 ,  H01L21/02 ,  H01L21/58 ,  H01L23/04 ,  H01L23/10 ,  H01L23/16 ,  H01L23/64 ,  H01L23/28

CPC classification number: H01L24/83 ,  H01L23/04 ,  H01L23/10 ,  H01L24/26 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01013 ,  H01L2924/01058 ,  H01L2924/07802

Abstract: A semiconductor device comprises a substrate (1) with a plane surface (4) on which a layer structure (2) is formed in a number of layers (5, 7, 9, 13, 15, 17). The substrate is fastened with its side on which the layer structure was formed to a plane support body (18) by means of a glue layer (19) which encompasses spacer elements (20). These spacer elements are fastened to the surface (4) of the substrate (1) and all have the same height measured from the surface (4). In fastening the substrate (1) to the support body (18), glue is provided and the substrate (1) is pressed onto the support body (18). The pressure is evenly distributed over the spacer elements (20) during this.

公开(公告)号：WO1995020244A1

公开(公告)日：1995-07-27

申请号：PCT/JP1995000049

申请日：1995-01-19

Applicant: NIPPON CARBIDE KOGYO KABUSHIKI KAISHA ,  KAWAURA, Shigehiro

Inventor： NIPPON CARBIDE KOGYO KABUSHIKI KAISHA

IPC: H01L23/04

CPC classification number: H01G4/224 ,  H01C1/02 ,  H01L23/04 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H03H9/0509 ,  H03H9/0514 ,  H03H9/1014 ,  H01L2924/00

Abstract: A package for hermetically housing an electronic element has a lid made of metallic foil. The gap between the lid and the main body is sealed with a resin adhesive.

Abstract translation: 用于气密地容纳电子元件的封装具有由金属箔制成的盖。 盖和主体之间的间隙用树脂粘合剂密封。

公开(公告)号：WO1992020096A1

公开(公告)日：1992-11-12

申请号：PCT/NO1992000085

申请日：1992-05-05

Applicant: SENSONOR A.S ,  KVISTEROY, Terje ,  JACOBSEN, Henrik

Inventor： SENSONOR A.S

IPC: H01L23/02

CPC classification number: G01P1/023 ,  H01L21/50 ,  H01L23/04 ,  H01L23/057 ,  H01L23/22 ,  H01L23/24 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/15151 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention relates to an arrangement for the encasing of a functional device, e.g., a semiconductor element, a semiconductor-based element, a sensor element, a microactuator, or an electronic circuit consisting of one or more integrated circuits and other electronic components, and a process for preparing an arrangement of this kind. Around the functional device (47) is arranged a casing (43, 45) which forms a closed cavity (51) which completely or partly surrounds the functional device (47). The casing is made of a plastic material or another polymer material. The casing consists of two or more joined components (43, 45). Metal parts which form wire bonds (46) with said functional device (47) in the casing pass through the walls of said casing. At least one of the casing pass through the walls of said casing. At least one of the casing components has filling holes or filling ducts (52, 53) for the introduction of liquid and/or gel material (56) into said cavity, and the filling holes or filling canals are sealed (54, 55) after the volume of the cavity has been filled with said liquid or gel.

Abstract translation: 本发明涉及一种用于封装诸如半导体元件，基于半导体的元件，传感器元件，微致动器或由一个或多个集成电路和其他电子元件组成的电子电路的功能器件的布置，以及 准备这种安排的过程。 在功能装置（47）周围设置有形成完全或部分围绕功能装置（47）的闭合腔（51）的壳体（43,45）。 外壳由塑料材料或另一种聚合物材料制成。 壳体由两个或更多个连接的部件（43,45）组成。 与壳体中的功能装置（47）形成线接合（46）的金属部件穿过所述壳体的壁。 壳体中的至少一个穿过所述壳体的壁。 至少一个壳体部件具有用于将液体和/或凝胶材料（56）引入所述空腔中的填充孔或填充管道（52,53），并且填充孔或填充通道在之后密封（54,55） 空腔的体积已经用所述液体或凝胶填充。

公开(公告)号：WO2018154835A1

公开(公告)日：2018-08-30

申请号：PCT/JP2017/036302

申请日：2017-10-05

Applicant: 株式会社JVCケンウッド

Inventor： 栗原　誠

IPC: H05K1/14 ,  G02F1/1333 ,  G02F1/1345 ,  G09F9/00 ,  H01L21/56 ,  H01L23/04

CPC classification number: G02F1/1333 ,  G02F1/1345 ,  G09F9/00 ,  H01L21/56 ,  H01L23/04 ,  H01L23/29 ,  H01L23/31 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19107 ,  H05K1/14 ,  H01L2924/00014

Abstract: ボンディングワイヤ樹脂封止構造（７）は、第１の基板（１０）と第２の基板（５０）とボンディングワイヤ（４）と封止樹脂（６）と空洞部（５）とを備える。第１の基板（１０）は第１の接続端子（１３）を有する。第２の基板（５０）は第１の基板（１０）に固定され、第２の接続端子（５１）を有する。ボンディングワイヤ（４）は円弧状のループ部（４ａ）を有し、第１の接続端子（１３）と第２の接続端子（５１）とを接続する。封止樹脂（６）は第１及び第２の基板（１０及び５０）上に形成され、ボンディングワイヤ（４）を封止する。空洞部（５）は、封止樹脂（６）における、第１の接続端子（１３）と第２の接続端子（５１）との間の領域であり、かつ、ループ部（４ａ）の円弧の中心点側の領域に形成されている。

公开(公告)号：WO2017099880A1

公开(公告)日：2017-06-15

申请号：PCT/US2016/055765

申请日：2016-10-06

Applicant: INTEL CORPORATION

Inventor： FITZGERALD, Thomas ,  LAMBERT, William ,  KOTHARI, Shrenik ,  SULLHAN, Punita ,  ANTONISWAMY, Aravindha

IPC: H01L23/522 ,  H01L23/34 ,  H01L23/367 ,  H01L23/373

CPC classification number: H01L23/345 ,  G06F1/20 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5227 ,  H01L24/13 ,  H01L24/16 ,  H01L24/18 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/0657 ,  H01L28/10 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/381 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embedded air core inductors are described for integrated circuit package substrates. The substrates have a thermal conductor for the inductors. One example includes a package substrate to carry an integrated circuit die, the package substrate having a plurality of top side pads to connect to the die on a top side and a plurality of bottom side pads to connect to an external component on a bottom side. An inductor is embedded within the package substrate, a thermal conductor is embedded within the package substrate adjacent to the inductor to conduct heat away from the inductor, and a heat sink is thermally coupled to the thermal conductor to receive the heat from the conductor.

Abstract translation: 针对集成电路封装衬底描述了嵌入式空芯电感器。 衬底具有用于电感器的热导体。 一个示例包括承载集成电路管芯的封装衬底，该封装衬底具有多个顶侧焊盘以连接至顶侧上的管芯，多个底侧焊盘连接至底侧上的外部组件。 电感器嵌入在封装衬底内，热导体嵌入在封装衬底内与电感器相邻以将热量从电感器导出，并且散热器热耦合到热导体以接收来自导体的热量。 / p>

公开(公告)号：WO2017095531A1

公开(公告)日：2017-06-08

申请号：PCT/US2016/056591

申请日：2016-10-12

Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.

Inventor： CHIOU, Jen-huang Albert ,  MANFREDI, David ,  BRATEK, Daniel J.

IPC: H01L23/04 ,  H01L23/24

CPC classification number: H05K5/0056 ,  B81B2201/0264 ,  H01L23/04 ,  H01L23/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K5/0082 ,  H05K7/14 ,  H01L2224/45099 ,  H01L2924/0665

Abstract: An automotive electronic device includes a pocket, which houses electronic components, bond wires connecting the electronic components, and a protective gel to encapsulate the electronic components and bond wires. A pocket cover has fins that protrude into the gel to reduce vibration of the gel and reduce vibration fatigue failure of the bond wires. The fins may: divide the gel into a plurality of cells; reduce the width of cells perpendicular to the bond wires; protrude deeper into the gel than the bond wires; and/or have differing shapes and/or depths.

Abstract translation: 汽车电子设备包括容纳电子部件的口袋，连接电子部件的键合线和用于封装电子部件和键合线的保护凝胶。 袋盖具有突出到凝胶中的翅片以减少凝胶的振动并减少键合线的振动疲劳失效。 翅片可以：将凝胶分成多个单元; 减少垂直于键合线的单元的宽度; 比接合线更深地伸入凝胶中; 和/或具有不同的形状和/或深度。

公开(公告)号：WO2017038582A1

公开(公告)日：2017-03-09

申请号：PCT/JP2016/074664

申请日：2016-08-24

Applicant: 京セラ株式会社

Inventor： 浅野　稔弘

IPC: H01L23/02 ,  H01L23/04 ,  H01L31/02 ,  H01S5/022

CPC classification number: H01L23/02 ,  H01L23/04 ,  H01L31/02 ,  H01S5/022

Abstract: 半導体素子収納用パッケージにおいて周壁体は、第１壁体と、第２壁体と、第３壁体と、第４壁体とから成る。第１壁体は、第１嵌合部、第２嵌合部および貫通開口が設けられている。第２壁体は、該第１壁体に対向する。第３壁体は、第１壁体および第２壁体に隣接する。第３壁体は、第３端部に第１嵌合部と嵌合する第３嵌合部が設けられ、第４端部が第２壁体に一体的に連なり、第４壁体は、第５端部に第２嵌合部と嵌合する第４嵌合部が設けられ、第６端部が第２壁体に一体的に連なる。

Abstract translation: 用于容纳半导体元件的该封装的周壁由第一壁，第二壁，第三壁和第四壁组成。 第一壁设有第一装配部分，第二装配部分和通孔。 第二个墙面向第一个墙。 第三壁与第一壁和第二壁相邻。 在第三壁上，与第一装配部配合的第三装配部设置在第三端部，第四端部与第二壁一体地连接。 在第四壁上，与第二配合部配合的第四嵌合部设置在第五端部，第六端部与第二壁一体地连接。