公开(公告)号：WO2014093243A1

公开(公告)日：2014-06-19

申请号：PCT/US2013/073919

申请日：2013-12-09

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： GOLDA, Dariusz ,  HIGGINSON, John A. ,  BIBL, Andreas

IPC: B81B7/00 ,  B81C3/00 ,  H01L21/677

CPC classification number: B25J15/0085 ,  B25J7/00 ,  B81C99/002 ,  H01L24/75 ,  H01L2224/7598 ,  Y10T29/53174

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array structure allows the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，微拾取阵列结构允许微拾取阵列自动地与载体衬底对准。 可以检测微拾取阵列的偏转以控制微拾取阵列的进一步移动。

公开(公告)号：WO2014008110A1

公开(公告)日：2014-01-09

申请号：PCT/US2013/048364

申请日：2013-06-27

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： GOLDA, Dariusz ,  BIBL, Andreas

IPC: H01L21/677 ,  B81C1/00

CPC classification number: B81C99/002

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

Abstract translation: 描述了一种兼容的双极微器件传输头阵列和从SOI衬底形成兼容的双极微器件传输阵列的方法。 在一个实施例中，柔性双极微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括第一和第二硅互连以及与第一和第二硅互连电连接并可偏转到基底基板和硅电极之间的一个或多个空腔中的第一和第二硅电极阵列。

公开(公告)号：WO2015175131A1

公开(公告)日：2015-11-19

申请号：PCT/US2015/025873

申请日：2015-04-15

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： BIBL, Andreas ,  GOLDA, Dariusz

IPC: G09F9/30 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H05K1/18

CPC classification number: H01L25/167 ,  G09F9/301 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1266 ,  H01L27/15 ,  H01L27/153 ,  H01L27/156 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/24101 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32227 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81424 ,  H01L2224/81438 ,  H01L2224/81444 ,  H01L2224/81466 ,  H01L2224/81486 ,  H01L2224/8149 ,  H01L2224/81805 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83424 ,  H01L2224/83438 ,  H01L2224/83444 ,  H01L2224/83466 ,  H01L2224/83486 ,  H01L2224/8349 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/18161 ,  H01L2924/18162 ,  H05K1/189 ,  H05K3/4682 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01074 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0781 ,  H01L2924/01038 ,  H01L2924/053 ,  H01L2924/06 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01071 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83

Abstract: A flexible display panel (103) and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate (101). A flexible display substrate (105) is formed on the sacrificial layer, with a plurality of release openings (111) that extend through the flexible display substrate (105) to the sacrificial layer. An array of LEDs (106) and a plurality of microchips (108) are transferred onto the flexible display substrate (105) to form a flexible display panel (103). The sacrificial layer is selectively removed such that the flexible display panel (103) attaches to the carrier substrate (101) by a plurality of support posts. The flexible display panel (103) is removed from the carrier substrate (101) and is electrically coupled with display components to form a flexible display system.

Abstract translation: 描述了柔性显示面板（103）及其形成方法。 柔性显示系统的制造方法包括在载体基板（101）上形成牺牲层。 柔性显示基板（105）形成在牺牲层上，多个释放开口（111）延伸穿过柔性显示基板（105）至牺牲层。 一组LED（106）和多个微芯片（108）被转移到柔性显示基板（105）上以形成柔性显示面板（103）。 选择性地去除牺牲层，使得柔性显示面板（103）通过多个支撑柱附接到载体基板（101）。 柔性显示面板（103）从载体基板（101）移除并与显示部件电耦合以形成柔性显示系统。

公开(公告)号：WO2014197221A1

公开(公告)日：2014-12-11

申请号：PCT/US2014/039300

申请日：2014-05-23

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： BIBL, Andreas ,  GOLDA, Dariusz

IPC: B81C99/00 ,  H01L21/67 ,  H01L23/00 ,  H01L21/683 ,  B25J15/00 ,  H01L21/768

CPC classification number: H01L21/6833 ,  B81C99/002 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76877 ,  H01L21/76898 ,  H01L24/75 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array (104) includes a compliant contact (108) for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads (114). The compliant contact is moveable relative to a base substrate (214) of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的微拾取阵列。 在一个实施例中，微拾取阵列（104）包括用于将工作电压从电压源传送到静电转印头（114）阵列的柔性接触件（108）。 柔性触点相对于微拾取阵列的基底（214）可移动。

公开(公告)号：WO2013176963A1

公开(公告)日：2013-11-28

申请号：PCT/US2013/041441

申请日：2013-05-16

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： GOLDA, Dariusz ,  BIBL, Andreas

IPC: H01L21/677 ,  B81C1/00 ,  B65G49/07

CPC classification number: B81C99/0025 ,  B81C2201/0194 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/7598

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。

公开(公告)号：WO2014130353A1

公开(公告)日：2014-08-28

申请号：PCT/US2014/016418

申请日：2014-02-14

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： GOLDA, Dariusz ,  HIGGINSON, John A. ,  BIBL, Andreas ,  PARKS, Paul Argus ,  BATHURST, Stephen Paul

IPC: H01L21/677 ,  B65G49/07 ,  B65G47/91 ,  B25J11/00 ,  B25J19/02

CPC classification number: H01L24/75 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0052 ,  B25J15/0085 ,  H01L24/95 ,  H01L2224/75252 ,  H01L2224/75282 ,  H01L2224/75725 ,  H01L2224/75823 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。

公开(公告)号：WO2014093241A1

公开(公告)日：2014-06-19

申请号：PCT/US2013/073917

申请日：2013-12-09

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： GOLDA, Dariusz ,  HIGGINSON, John A. ,  BIBL, Andreas

IPC: H01L21/677 ,  B65G49/07 ,  B65G47/90

CPC classification number: H01L24/75 ,  H01L24/97 ,  H01L25/167 ,  H01L33/00 ,  H01L2224/75725 ,  H01L2224/75843 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T279/23 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，微拾取阵列安装件包括枢轴平台，以允许微拾取阵列自动对准载体衬底。 可以检测枢轴平台的偏转以控制微拾取阵列的进一步移动。

公开(公告)号：WO2014008111A1

公开(公告)日：2014-01-09

申请号：PCT/US2013/048365

申请日：2013-06-27

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： GOLDA, Dariusz ,  BIBL, Andreas

IPC: H01L29/00 ,  H01L21/02

CPC classification number: H01L21/76898 ,  B81B2207/053 ,  B81C1/0015 ,  B81C99/002 ,  H01L24/75 ,  H01L2224/7598

Abstract: A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了一种兼容的单极微器件传输头阵列和从SOI衬底形成兼容单极微器件传输阵列的方法。 在一个实施例中，微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括在硅互连上方突出的台面结构，并且每个硅电极可偏转到基底基板和硅电极之间的空腔中。 介电层覆盖每个台面结构的顶面。

公开(公告)号：WO2013176964A1

公开(公告)日：2013-11-28

申请号：PCT/US2013/041444

申请日：2013-05-16

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： GOLDA, Dariusz ,  BIBL, Andreas

IPC: H01L21/677 ,  B65G49/07 ,  B81C1/00

CPC classification number: H01L21/6833 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L2221/68368 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/03 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09036

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.

Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面。