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公开(公告)号：CN105980087A
公开(公告)日：2016-09-28
申请号：CN201480074919.3
申请日：2014-02-04
申请人： 千住金属工业株式会社
CPC分类号： B23K35/0244 , B22F1/0003 , B22F1/0048 , B22F1/025 , B22F9/08 , B22F9/082 , B22F9/14 , B22F2009/0848 , B22F2301/10 , B22F2301/15 , B22F2998/10 , B22F2999/00 , B23K1/0016 , B23K1/008 , B23K3/0623 , B23K35/302 , B23K35/3033 , B23K2101/42 , C22C9/00 , C22C19/03 , C22F1/08 , C22F1/10 , H01L23/49816 , H01L23/556 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/111 , H01L2224/11334 , H01L2224/13014 , H01L2224/13016 , H01L2224/13105 , H01L2224/13109 , H01L2224/13117 , H01L2224/13118 , H01L2224/1312 , H01L2224/13123 , H01L2224/13124 , H01L2224/13138 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13149 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13163 , H01L2224/13164 , H01L2224/13166 , H01L2224/13169 , H01L2224/1317 , H01L2224/13171 , H01L2224/13172 , H01L2224/13173 , H01L2224/13176 , H01L2224/13178 , H01L2224/13179 , H01L2224/1318 , H01L2224/13181 , H01L2224/13183 , H01L2224/13184 , H01L2224/132 , H01L2224/13211 , H01L2224/13294 , H01L2224/133 , H01L2224/13305 , H01L2224/13309 , H01L2224/13317 , H01L2224/13318 , H01L2224/1332 , H01L2224/13323 , H01L2224/13324 , H01L2224/13338 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13349 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13363 , H01L2224/13364 , H01L2224/13366 , H01L2224/13369 , H01L2224/1337 , H01L2224/13371 , H01L2224/13372 , H01L2224/13373 , H01L2224/13376 , H01L2224/13378 , H01L2224/13379 , H01L2224/1338 , H01L2224/13381 , H01L2224/13383 , H01L2224/13384 , H01L2224/1339 , H01L2224/136 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2224/1369 , H01L2224/16145 , H01L2224/16225 , H01L2224/81011 , H01L2924/381 , H01L2924/3841 , H05K3/3436 , H05K3/3463 , H05K2203/041 , B22F2202/13 , H01L2924/00012 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/01049 , H01L2924/01028 , H01L2924/01027 , H01L2924/01051 , H01L2924/01032 , H01L2924/01015 , H01L2924/01026 , H01L2924/01082 , H01L2924/01079 , H01L2924/01092 , H01L2924/0109 , H01L2924/01033 , H01L2924/00014 , H01L2924/01203 , H01L2924/01204 , H01L2924/0105 , H01L2924/01083 , H01L2924/0103 , H01L2924/01048 , H01L2924/01016 , H01L2924/01013 , H01L2924/01012 , H01L2924/01022 , H01L2924/01025 , H01L2924/0106 , H01L2924/01071 , H01L2924/01069 , H01L2924/01021 , H01L2924/01068 , H01L2924/01059 , H01L2924/01067 , H01L2924/01066 , H01L2924/01065 , H01L2924/01064 , H01L2924/01061 , H01L2924/01057 , H01L2924/0102 , H01L2924/01063 , H01L2924/0107 , H01L2924/01058 , H01L2924/01038 , H01L2924/01056 , H01L2924/01052 , H01L2924/01076 , H01L2924/01072 , H01L2924/01043 , H01L2924/01004
摘要： 制造抑制了所释放的α射线量的金属球。包括如下工序：将纯金属在比作为去除对象的杂质的沸点高、比纯金属的熔点高、且比纯金属的沸点低的温度下进行加热而使纯金属熔融的工序；将熔融的纯金属造球成为球状的工序，其中，该纯金属与在纯金属所含的杂质中作为去除对象的杂质的对应于气压的沸点相比具有更高的沸点，U的含量为5ppb以下，Th的含量为5ppb以下，纯度为99.9％以上且99.995％以下，Pb或Bi中任一者的含量、或者Pb和Bi的总量为1ppm以上。
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公开(公告)号：CN1224767A
公开(公告)日：1999-08-04
申请号：CN98122942.5
申请日：1998-11-27
申请人： W·C·赫罗伊斯有限公司
IPC分类号： C22C5/02
CPC分类号： C22C5/02 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/0102 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/0106 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/20753 , H01L2924/01201 , H01L2924/01202 , H01L2924/01203 , H01L2924/01004 , H01L2924/013 , H01L2924/00013 , H01L2924/01061 , H01L2924/01062 , H01L2924/01064 , H01L2924/01065 , H01L2924/01067 , H01L2924/01069 , H01L2924/0107 , H01L2924/01071 , H01L2924/00 , H01L2924/01006
摘要： 本发明涉及一种金合金细丝,该合金含有0.5—0.9%(重量)铜和少量铂或至少一种碱土金属和稀土金属族的元素,该细丝显示出与金相近的比电阻和良好的强度/拉伸比。因而适宜作连接丝以及制造倒装晶片中的接触凸点。
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公开(公告)号：CN105980087B
公开(公告)日：2018-05-25
申请号：CN201480074919.3
申请日：2014-02-04
申请人： 千住金属工业株式会社
CPC分类号： B23K35/0244 , B22F1/0003 , B22F1/0048 , B22F1/025 , B22F9/08 , B22F9/082 , B22F9/14 , B22F2009/0848 , B22F2301/10 , B22F2301/15 , B22F2998/10 , B22F2999/00 , B23K1/0016 , B23K1/008 , B23K3/0623 , B23K35/302 , B23K35/3033 , B23K2101/42 , C22C9/00 , C22C19/03 , C22F1/08 , C22F1/10 , H01L23/49816 , H01L23/556 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/111 , H01L2224/11334 , H01L2224/13014 , H01L2224/13016 , H01L2224/13105 , H01L2224/13109 , H01L2224/13117 , H01L2224/13118 , H01L2224/1312 , H01L2224/13123 , H01L2224/13124 , H01L2224/13138 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13149 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13163 , H01L2224/13164 , H01L2224/13166 , H01L2224/13169 , H01L2224/1317 , H01L2224/13171 , H01L2224/13172 , H01L2224/13173 , H01L2224/13176 , H01L2224/13178 , H01L2224/13179 , H01L2224/1318 , H01L2224/13181 , H01L2224/13183 , H01L2224/13184 , H01L2224/132 , H01L2224/13211 , H01L2224/13294 , H01L2224/133 , H01L2224/13305 , H01L2224/13309 , H01L2224/13317 , H01L2224/13318 , H01L2224/1332 , H01L2224/13323 , H01L2224/13324 , H01L2224/13338 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13349 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13363 , H01L2224/13364 , H01L2224/13366 , H01L2224/13369 , H01L2224/1337 , H01L2224/13371 , H01L2224/13372 , H01L2224/13373 , H01L2224/13376 , H01L2224/13378 , H01L2224/13379 , H01L2224/1338 , H01L2224/13381 , H01L2224/13383 , H01L2224/13384 , H01L2224/1339 , H01L2224/136 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2224/1369 , H01L2224/16145 , H01L2224/16225 , H01L2224/81011 , H01L2924/381 , H01L2924/3841 , H05K3/3436 , H05K3/3463 , H05K2203/041 , B22F2202/13 , H01L2924/00012 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/01049 , H01L2924/01028 , H01L2924/01027 , H01L2924/01051 , H01L2924/01032 , H01L2924/01015 , H01L2924/01026 , H01L2924/01082 , H01L2924/01079 , H01L2924/01092 , H01L2924/0109 , H01L2924/01033 , H01L2924/00014 , H01L2924/01203 , H01L2924/01204 , H01L2924/0105 , H01L2924/01083 , H01L2924/0103 , H01L2924/01048 , H01L2924/01016 , H01L2924/01013 , H01L2924/01012 , H01L2924/01022 , H01L2924/01025 , H01L2924/0106 , H01L2924/01071 , H01L2924/01069 , H01L2924/01021 , H01L2924/01068 , H01L2924/01059 , H01L2924/01067 , H01L2924/01066 , H01L2924/01065 , H01L2924/01064 , H01L2924/01061 , H01L2924/01057 , H01L2924/0102 , H01L2924/01063 , H01L2924/0107 , H01L2924/01058 , H01L2924/01038 , H01L2924/01056 , H01L2924/01052 , H01L2924/01076 , H01L2924/01072 , H01L2924/01043 , H01L2924/01004
摘要： 制造抑制了所释放的α射线量的金属球。包括如下工序：将纯金属在比作为去除对象的杂质的沸点高、比纯金属的熔点高、且比纯金属的沸点低的温度下进行加热而使纯金属熔融的工序；将熔融的纯金属造球成为球状的工序，其中，该纯金属与在纯金属所含的杂质中作为去除对象的杂质的对应于气压的沸点相比具有更高的沸点，U的含量为5ppb以下，Th的含量为5ppb以下，纯度为99.9％以上且99.995％以下，Pb或Bi中任一者的含量、或者Pb和Bi的总量为1ppm以上。
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公开(公告)号：CN1168143C
公开(公告)日：2004-09-22
申请号：CN99106482.8
申请日：1999-05-13
申请人： W·C·贺利氏股份有限两合公司
CPC分类号： H01L24/45 , H01L24/43 , H01L2224/4321 , H01L2224/45015 , H01L2224/45144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01018 , H01L2924/01021 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/0106 , H01L2924/01063 , H01L2924/01068 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/01105 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/20752 , H01L2924/20753 , H01L2924/30107 , Y10T428/12431 , H01L2924/01046 , H01L2924/01201 , H01L2924/01004 , H01L2924/0102 , H01L2924/01026 , H01L2924/01013 , H01L2924/01033 , H01L2924/01061 , H01L2924/01062 , H01L2924/01064 , H01L2924/01065 , H01L2924/01066 , H01L2924/01067 , H01L2924/01069 , H01L2924/0107 , H01L2924/01071 , H01L2924/013 , H01L2924/00 , H01L2224/48 , H01L2924/00013
摘要： 本发明涉及由金及0.6-2重量%的镍制成的合金或用金及0.1-2重量%的镍、0.0001-0.1重量%的碱土金属和/或稀土金属、以及有时还加入0.1-1.0重量%的铂和/或钯制成的细导线，其特征是具有优良的导电性能及良好的强度/伸长率关系。它们适宜作连接导线，还可在倒装技术(Flip-Chips)中用于制成接触凸缘。
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公开(公告)号：CN1085739C
公开(公告)日：2002-05-29
申请号：CN98122942.5
申请日：1998-11-27
申请人： W·C·贺利氏股份有限两合公司
IPC分类号： C22C5/02
CPC分类号： C22C5/02 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43 , H01L2224/45015 , H01L2224/45144 , H01L2224/48624 , H01L2924/00011 , H01L2924/01005 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/0102 , H01L2924/01021 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/0106 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01105 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/20753 , H01L2924/01201 , H01L2924/01202 , H01L2924/01203 , H01L2924/01004 , H01L2924/013 , H01L2924/00013 , H01L2924/01061 , H01L2924/01062 , H01L2924/01064 , H01L2924/01065 , H01L2924/01067 , H01L2924/01069 , H01L2924/0107 , H01L2924/01071 , H01L2924/00 , H01L2924/01006
摘要： 本发明涉及一种金合金细丝，该合金含有0.5-0.9%(重量)铜和少量铂或至少一种碱土金属和稀土金属族的元素，该细丝显示出与金相近的比电阻和良好的强度/拉伸比。因而适宜作连接丝以及制造倒装晶片中的接触凸点。
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公开(公告)号：CN1235376A
公开(公告)日：1999-11-17
申请号：CN99106482.8
申请日：1999-05-13
申请人： W·C·贺利氏股份有限两合公司
CPC分类号： H01L24/45 , H01L24/43 , H01L2224/4321 , H01L2224/45015 , H01L2224/45144 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01018 , H01L2924/01021 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01038 , H01L2924/01039 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/0106 , H01L2924/01063 , H01L2924/01068 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/01105 , H01L2924/01202 , H01L2924/01203 , H01L2924/01204 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/20752 , H01L2924/20753 , H01L2924/30107 , Y10T428/12431 , H01L2924/01046 , H01L2924/01201 , H01L2924/01004 , H01L2924/0102 , H01L2924/01026 , H01L2924/01013 , H01L2924/01033 , H01L2924/01061 , H01L2924/01062 , H01L2924/01064 , H01L2924/01065 , H01L2924/01066 , H01L2924/01067 , H01L2924/01069 , H01L2924/0107 , H01L2924/01071 , H01L2924/013 , H01L2924/00 , H01L2224/48 , H01L2924/00013
摘要： 本发明涉及由金及0.6—2重量%的镍制成的合金或用金及0.1—2重量%的镍、0.0001—0.1重量%的碱土金属和/或稀土金属、以及有时还加入0.1—1.0重量%的铂和/或钯制成的细导线,其特征是具有优良的导电性能及良好的强度/伸长率关系。它们适宜作连接导线,还可在倒装技术(Flip-Chips)中用于制成接触凸缘。
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