公开(公告)号：EP1172882A2

公开(公告)日：2002-01-16

申请号：EP01116871.3

申请日：2001-07-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahashi, Yoshinori, Murata Manufact. Co., Ltd.

IPC: H01P7/08

CPC classification number: H01P7/082 ,  H05K1/0253 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10075

Abstract: There is provided a resonator which can suppress degradation of the Q factor, adjust the frequency, and reduce the size and profile thereof. A voltage controlled oscillator (10) using a resonator includes a multilayer substrate (12). The multilayer substrate (12) includes a first grounding conductor layer (14), a first dielectric layer (16), a strip line layer (18), a second dielectric layer (22), a second grounding conductor layer (24), and a third dielectric layer (26). A strip line (20) is formed on the strip line layer (18), and a microstrip line (28) is formed on the third dielectric layer (26). The strip line (20) is connected to the microstrip line (28) via a through hole (30) to form the resonator. A portion (32), facing the microstrip line (28), of the second grounding conductor layer (24) is removed.

Abstract translation: 提供了一种能够抑制Q因子劣化，调整频率并减小其尺寸和轮廓的谐振器。 使用谐振器的压控振荡器（10）包括多层基板（12）。 多层基板12包括第一接地导体层14，第一电介质层16，带状线层18，第二电介质层22，第二接地导体层24， 第三电介质层（26）。 带状线（20）形成在带状线层（18）上，微带线（28）形成在第三介电层（26）上。 带状线（20）经由通孔（30）连接到微带线（28）以形成谐振器。 第二接地导体层（24）的面向微带线（28）的部分（32）被去除。

公开(公告)号：EP1114439A2

公开(公告)日：2001-07-11

申请号：EP99937726.0

申请日：1999-07-30

Applicant: Kulicke & Soffa Holdings, Inc.

Inventor： STRANDBERG, Jan, I. ,  CHAZAN, David, J. ,  SKINNER, Michael, P.

IPC: H01L21/00

CPC classification number: H01L23/5385 ,  H01L21/4857 ,  H01L23/5383 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/3011 ,  H05K1/0271 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2203/0353 ,  H05K2203/0585 ,  H05K2203/0759 ,  H05K2203/1476 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2224/05647

Abstract: A method for forming low-impedance high density deposited-on-laminate (D/L) structures (10) having reduced stress features reducing metallization present on the laminate printed circuit board (12). In this manner, reduced is the force per unit area exerted on the dielectric material (30) disposed adjacent to the laminate material (16) which is typically present during thermal cycling of the structure.

公开(公告)号：EP1109224A2

公开(公告)日：2001-06-20

申请号：EP00127536.1

申请日：2000-12-15

Applicant: SEL SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Yamazaki, Shunpei ,  Fukunaga, Takeshi

IPC: H01L27/15

CPC classification number: H01L51/524 ,  G01N33/497 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/3227 ,  H01L27/3262 ,  H01L27/3276 ,  H01L27/3279 ,  H01L27/3288 ,  H01L27/329 ,  H01L31/153 ,  H01L33/62 ,  H01L51/0097 ,  H01L51/5203 ,  H01L51/56 ,  H01L2227/323 ,  H01L2251/5315 ,  H01L2251/5338 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/093 ,  H05K2201/10128 ,  H05K2201/1031 ,  Y02P70/611 ,  H01L2924/00

Abstract: A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.

Abstract translation: 提供了具有高均匀性的图像质量的发光装置。 印刷线路板（第二基板）（107）面向其上形成有发光元件（102）的基板（第一基板）（101）设置。 印刷线路板107上的PWB侧布线（第二组布线）（110）通过各向异性导电膜（105a，105b）与元件侧布线（第一组布线）（103,104）电连接。 此时，由于使用低电阻铜箔形成PWB侧布线（110），所以能够降低元件侧布线（103,104）的电压降和信号的延迟。 因此，图像质量的均匀性得到改善，并且驱动电路部分的操作速度得到增强。

公开(公告)号：EP1061784A1

公开(公告)日：2000-12-20

申请号：EP98958417.2

申请日：1998-07-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： ROG, Andrei Leonidovich ,  KORULIN, Vitaly Nikolaevich ,  OSIPOV, Oleg Dmitrievich ,  SOLDATENKOV, Anatoly Nikolaevich ,  USTINOV, Igor Vladimirovich ,  MALASHIN, Viktor Ivanovich

IPC: H05K1/14 ,  H01L27/02

CPC classification number: H05K1/0218 ,  H05K1/0237 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/09663 ,  H05K2201/09972

Abstract: The invention relates to electronics and can be used in constructions of electronic units performing the reception and processing of signals of the satellite radio navigation systems (SRNS). The essence of the invention consists in that in a electronic unit comprising a multilayer printed-circuit card, the conductors intended for screening the corresponding linking signal conductor are disposed at both its and are connected with the ground planes by means of metallized holes of interface connections made at least at the beginning and end of each screening wire to form a closed electric circuit.

Abstract translation: 本发明涉及电子装置，可用于执行卫星无线电导航系统（SRNS）的信号的接收和处理的电子装置的构造。 本发明的实质在于，在包括多层印刷电路卡的电子单元中，用于筛选相应的链接信号导体的导体被布置在其两者并且通过接口连接的金属化孔与接地层相连接 至少在每个筛网的开始和结尾处形成闭合的电路。

公开(公告)号：EP0817548A4

公开(公告)日：1999-12-01

申请号：EP96942586

申请日：1996-12-19

Applicant: IBIDEN CO LTD

Inventor： MORI YOJI ,  KAWAMURA YOICHIRO

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: A printed wiring board (1) such that openings (8L) formed around a pad (12L) which is a photo-via land do not overlap a pad (12L) and the area of each of the openings (8L) around the pad (12L) is equal to that of each of the other openings (8), the amount of resin (13) with which each of the openings (8, 8L) is filled is equal to that with which each of the openings (8L) is filled over the whole wiring board (1), and the amounts of resin (13) overflowing from the openings (8, 8L) are equal to each other. The circuit pattern provided on the upper surface of an interlayer insulating layer formed on the printed wiring board can be connected to a conductor pad area without causing any defective connection, providing a highly-reliable printed wiring board.

Abstract translation: 印刷电路板，其中存在于作为光电二极管的焊盘周围的开口布置成使其不与焊盘重叠，存在于焊盘周围的开口的面积和另一个开口的面积相等，树脂的量 填充在每个开口中或在整个印刷线路板上均匀化，并且设置从每个开口溢出的树脂量或当树脂在每个开口中填充或均匀时。 根据这样的印刷电路板，当通过布置开口来连接设置在形成在印刷线路板上的层间绝缘板上的电路图案和导体焊盘时，可以实现其中安全连接不会导致断开的可靠的印刷线路板 存在于导体焊盘周围，使得其不与导体焊盘重叠，并且基本上均匀地填充在导体焊盘周围的开口中的树脂的量和填充在另一个开口中的树脂的量。

公开(公告)号：EP0767600B1

公开(公告)日：1998-10-28

申请号：EP96402079.6

申请日：1996-09-30

Applicant: MATRA NORTEL COMMUNICATIONS

Inventor： Chapon, Thierry

IPC: H05K3/34

CPC classification number: H05K1/113 ,  H05K1/0201 ,  H05K1/0243 ,  H05K3/0094 ,  H05K3/3442 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/1006 ,  H05K2201/10969

公开(公告)号：EP0682852B1

公开(公告)日：1998-10-28

申请号：EP94909504.6

申请日：1994-02-01

Applicant: AST RESEARCH, Inc.

Inventor： SUSKI, Edward, D.

IPC: H05K1/18 ,  H05K9/00 ,  H01B11/06

CPC classification number: H01P3/085 ,  H01P3/081 ,  H01P3/088 ,  H05K1/0224 ,  H05K1/0237 ,  H05K1/0253 ,  H05K1/0393 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09681

公开(公告)号：EP0756447B1

公开(公告)日：1998-10-21

申请号：EP96117380.4

申请日：1994-08-03

Applicant: Hella KG Hueck & Co.

Inventor： Klassen, Eugen ,  Raulf, Manfred ,  Rehberg, Helmut

IPC: H05K9/00

CPC classification number: H05K9/0039 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0231 ,  H05K1/0239 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

公开(公告)号：EP0525810B1

公开(公告)日：1998-01-07

申请号：EP92113131.4

申请日：1992-07-31

Applicant: Hughes Aircraft Company

Inventor： Hanz, Curtis L. ,  Gulick, Jon J. ,  Virga, Kathleen L. ,  Podell, Allen

IPC: H01L23/66 ,  H01L23/64

CPC classification number: H05K1/0253 ,  H01L23/64 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01P5/028 ,  H05K1/0237 ,  H05K1/025 ,  H05K1/0298 ,  H05K2201/0191 ,  H05K2201/093 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10689

公开(公告)号：EP0647389B1

公开(公告)日：1996-10-23

申请号：EP94913381.3

申请日：1994-04-07

Applicant: ZYCON CORPORATION

Inventor： HOWARD, James, R. ,  LUCAS, Gregory, L. ,  BRYAN, Scott, K. ,  CHOE, Jin, S. ,  BIUNNO, Nicholas

IPC: H05K1/16

CPC classification number: H05K1/167 ,  H05K1/0298 ,  H05K1/116 ,  H05K1/162 ,  H05K1/165 ,  H05K3/429 ,  H05K2201/086 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09809 ,  H05K2203/0545

Abstract: A circuit component assembly and a method for forming the assembly as an annular body in a laminate, preferably between a through-hole or via (50, 52) and a surrounding conductive layer (24) in a PCB are disclosed, the circuit component assembly including one or more resistors/conductors (36A), inductors and dielectrics/capacitors or combinations thereof, outer and inner peripheries of the circuit component preferably having substantially constant radii permitting simple determination of operative electrical characteristics for the circuit component from (a) the inner and outer radii, (b) an effective thickness for the circuit component and (c) its electrical characteristics determined by the material formed in the annular recess, the circuit component body preferably being formed from a liquid precursor forming conductive interconnections for the circuit component assembly at its outer and inner perimeters.