公开(公告)号：EP1104226A1

公开(公告)日：2001-05-30

申请号：EP99933149.9

申请日：1999-07-29

Applicant: Sony Chemicals Corporation

Inventor： HISHINUMA, Hiroyuki, Sony Chemicals Corp. ,  KURITA, Hideyuki, Sony Chemicals Corp. ,  ITO, Ryo, Sony Chemicals Corp. ,  NAKAMURA, Masayuki, Sony Chemicals Corp.

IPC: H05K3/34 ,  H05K3/28

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0759 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can be formed with good precision because laser beam is not used to form openings in a polyimide film. After metal bumps 16 have been formed, the mask film is removed and a liquid resin material is applied and dried to form a coating, which is then cured into a resin film. The coating can be etched at surface portions during coating stage to expose the tops of metal bumps 16.

Abstract translation: 根据本发明的制造柔性布线板的方法包括使用通过光刻图案化的掩模膜生长金属凸块16。 可以精确地形成精细的开口，因此，由于激光束不用于在聚酰亚胺膜中形成开口，因此可以以高精度形成细小的金属凸块16。 在形成金属凸块16之后，去除掩模膜并施加液体树脂材料并干燥以形成涂层，然后将其固化成树脂膜。 涂层可以在涂覆阶段的表面部分进行蚀刻，以露出金属凸块16的顶部

公开(公告)号：EP0983616A1

公开(公告)日：2000-03-08

申请号：EP98925729.0

申请日：1998-05-15

Applicant: THOMSON-CSF

Inventor： CACHIER, Gérard,Thomson-CSF P.I., Prot. & Conseil ,  DADEN, Jean-Yves,Thomson-CSF P.I.,Prot. & Conseil ,  GRANCHER, Alain,Thomson-CSF P.I.,Prot. & Conseil

IPC: H01P1/04

CPC classification number: H01P1/047 ,  H01L2224/45144 ,  H01L2224/49175 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/142 ,  H05K2201/0715 ,  H05K2201/09481 ,  H05K2201/09781 ,  H05K2201/1028 ,  H05K2201/10681 ,  H01L2924/00014

Abstract: The invention concerns a method and a device for connecting two millimetric elements. The method consists in producing in predetermined sites of each of the millimetric elements (13, 16) connecting zones (8) linked to a ground plane potential; then in carrying out the connection by predetermined links (17) between the connection zones (8) and between the conducting lines (6, 15) of the two millimetric elements (13, 16). The device consists in a coplanar line (17). The invention is particularly applicable to millimetric circuits using micro-strip conducting lines.

公开(公告)号：EP0982798A2

公开(公告)日：2000-03-01

申请号：EP99115696.9

申请日：1999-08-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kurita, Junichi ,  Yuasa, Atsuyuki ,  Kawahata, Kazunari

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/24

CPC classification number: H01Q9/0421 ,  H01Q1/243 ,  H01Q1/38 ,  H05K1/0243 ,  H05K1/115 ,  H05K2201/0715 ,  H05K2201/09481 ,  H05K2201/0979 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: An antenna (12) includes: a base (2) having opposing first and second surfaces (2a, 2b) and opposing end surfaces; a radiation electrode (4) covering at least a portion of the first major surface (2b) of the base (2); a power terminal (5) disposed on the base (2) and operable to conduct signal power which is at least one of received and transmitted by the antenna; a mounting substrate (8) having spaced apart first and second major surfaces (8a, 8b); a first ground electrode (3) covering at least a portion of the second major surface (2a) of the base (2), wherein the base (2) is disposed on the mounting substrate (8) such that the second major surface (2a) of the base (2) is coupled to the first major surface (8b) of the mounting substrate (8) and a distance D is defined from the first major surface (2b) of the base (2) to the second major surface (8a) of the mounting substrate (8), and the radiation electrode (4) is electrically coupled to the first ground electrode (3) such that a gain of the antenna (12) is a function of the distance D.

Abstract translation: 天线（12）包括：具有相对的第一和第二表面（2a，2b）和相对的端表面的基部（2） 覆盖所述基座（2）的所述第一主表面（2b）的至少一部分的辐射电极（4）; 设置在所述基座（2）上并且可操作以传导信号功率的电源端子（5），所述信号功率是由所述天线接收和发送的中的至少一个; 具有间隔开的第一和第二主表面（8a，8b）的安装衬底（8）; （2）的至少一部分第二主表面（2a）的第一接地电极（3），其中所述基座（2）设置在所述安装基板（8）上，使得所述第二主表面（2a） ）连接到安装基板（8）的第一主表面（8b），并且从基座（2）的第一主表面（2b）到第二主表面（第二主表面）限定距离D 所述辐射电极（4）与所述第一接地电极（3）电耦合，使得所述天线（12）的增益是所述距离D的函数。

公开(公告)号：EP0533198A3

公开(公告)日：1995-11-02

申请号：EP92116025.5

申请日：1992-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Hino, Atsushi, c/o Nitto Denko Corporation ,  Mochizuki, Amane, c/o Nitto Denko Corporation ,  Ouchi, Kazuo, c/o Nitto Denko Corporation ,  Morita, Shoji, c/o Nitto Denko Corporation ,  Naito, Toshiki, c/o Nitto Denko Corporation ,  Higashi, Kazumi, c/o Nitto Denko Corporation ,  Maeda, Masako, c/o Nitto Denko Corporation ,  Kaneto, Masayuki, c/o Nitto Denko Corporation ,  Tanaka, Munekazu, c/o Nitto Denko Corporation ,  Sugimoto, Masakazu, c/o Nitto Denko Corporation

IPC: H05K1/03 ,  H05K3/40 ,  H05K3/28 ,  H05K3/46 ,  H05K3/20

CPC classification number: H05K3/4635 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/0035 ,  H05K3/205 ,  H05K3/28 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4617 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer (2) and a thermoplastic polyimide resin layer (3), and a metal layer (1) or a wiring circuit formed on the low-linear expansion polyimide resin layer (2) of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer (2) and the thermoplastic polyimide resin layer (3). A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed.

Abstract translation: 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成有金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层的绝缘树脂层和形成在绝缘树脂层的低线膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：EP0574206A2

公开(公告)日：1993-12-15

申请号：EP93304381.2

申请日：1993-06-04

Applicant: Nippon CMK Corp.

Inventor： Matsumoto, Masuo ,  Birukawa, Fusao ,  Takahashi, Takazo ,  Shirai, Junzaburo ,  Kojima, Mikiya

IPC: H05K3/46 ,  H05K1/18 ,  H05K1/16 ,  H05K1/00

CPC classification number: H05K1/162 ,  H05K1/095 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/096

Abstract: [Object] To provide a printed circuit board having electronic component functions buried in a substrate laminate.
[Constitution] Holes of an inner substrate 2 are filled with a dielectric paste 6 and a resistor paste 7. These pastes are sealed with a plating layer 13. Thus, the functions of a capacitor and a resistor are buried in the inner substrate 2. Outer substrates 2, 3 are laminated to the inner substrate 2, and holes of the outer substrates 2, 3 are filled with a dielectric paste 6a and a resistor paste 7a, followed by sealing of these pastes with a plating layer 17. Thus, the functions of a capacitor and a resistor are buried in the outer substrates 2, 3. Therefore, the multilayer printed circuit board of the present invention has electronic component functions buried therein.

Abstract translation: 内部基板1的孔填充有电介质浆料6和电阻浆料7.这些糊料用镀层13密封。因此，电容器和电阻器的功能被埋在内部基板1中。外部基板2 ，3层压到内部基板1上，并且外部基板2,3的孔填充有电介质浆料6a和电阻浆料7a，然后用镀层17密封这些浆料。因此， 电容器和电阻器被埋在外部基板2,3中。因此，本发明的多层印刷电路板具有埋入其中的电子部件功能。

公开(公告)号：EP0191434A2

公开(公告)日：1986-08-20

申请号：EP86101606.1

申请日：1986-02-07

Applicant: International Business Machines Corporation

Inventor： Blakeslee, Marybelle C. ,  Chance, Dudley Augustus ,  Eastman, Dean Eric ,  Gniewek, John J. ,  Ho, Chung Wen ,  Levine, Ernest N. ,  Ordonez, Jose E. ,  Reiley, Timothy Clark ,  Skarvinko, Eugene R.

IPC: H01L21/60

CPC classification number: H01L24/16 ,  H01L23/49822 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4053 ,  H05K2201/09472 ,  H05K2201/09481 ,  Y02P70/613 ,  H01L2924/00

Abstract: Microelectric chips are electrically connected to underlying substrates by means of elongated solder columns made possible by solder dams at the surface of the substrate, the dams being positioned about at least a portion of the connection pads on the surface. Substantial increases in the size of the matrix of such columns are achieved without exceeding applicable shear strain limits, due to the increased deformation of the connectors made possible by their increased length.

Abstract translation: 微电路芯片（10）借助于由衬底表面上的焊料坝可能形成的细长焊料柱（26）电连接到下面的衬底（14），所述阻挡层围绕至少一部分连接焊盘 表面。 由于连接件的变形增加，由于它们的长度增加，可以实现这种柱的基体尺寸的大幅度增加，而不会超过适用的剪切应变极限。

公开(公告)号：EP3100283A1

公开(公告)日：2016-12-07

申请号：EP15740141.5

申请日：2015-01-27

Applicant: Angiometrix Corporation

Inventor： PATIL, Nitin

IPC: H01B7/08 ,  H01B7/02 ,  H01B7/00

CPC classification number: H05K1/0268 ,  A61B5/6851 ,  A61B2562/12 ,  A61M25/09 ,  A61M2025/09108 ,  H05K1/0296 ,  H05K1/118 ,  H05K3/10 ,  H05K3/4644 ,  H05K2201/09481 ,  H05K2201/09709

Abstract: Assembly methods and apparatus for electrically stable connectors are described herein where a conductive wire assembly generally comprises an insulative substrate having a length, one or more conductive elements formed along a first direction upon the substrate, an insulative coverlay formed upon the one or more conductive elements, and at least one opening or window defined through the insulative coverlay exposing a portion of the one or more conductive elements. A conductive coating is formed upon the insulative coverlay such that the conductive coating is in contact with the portion of the one or more conductive elements through the at least one opening or window and the conductive coating may have at least one region removed along a second direction in proximity to the at least one opening or window such that one or more conductive pads are formed and are electrically isolated from a remainder of the conductive coating.

公开(公告)号：EP2946643A1

公开(公告)日：2015-11-25

申请号：EP13871379.7

申请日：2013-11-19

Applicant: Nokia Technology Oy

Inventor： MÄÄTTÄ, Esa-Sakari

IPC: H05K7/10 ,  H04M1/02

CPC classification number: H05K1/118 ,  G02F1/13452 ,  G02F1/13458 ,  G02F2001/133388 ,  H01L23/3121 ,  H01L23/3128 ,  H01L27/3276 ,  H01L27/3288 ,  H01L51/50 ,  H01L2924/0002 ,  H05B33/02 ,  H05K1/028 ,  H05K1/117 ,  H05K1/147 ,  H05K3/32 ,  H05K2201/055 ,  H05K2201/09481 ,  H05K2201/10128 ,  Y10T29/49128 ,  H01L2924/00

Abstract: In accordance with an example embodiment of the present invention, an apparatus includes a substrate (202) having a plurality of conductive traces (212) terminating at a peripheral edge (203) of the substrate (202). An active display portion (204) is disposed on an upper surface of the substrate (202) and electrically coupled to the conductive traces (212) of the substrate (202). The peripheral edge (203) of the substrate (202) includes a protruding region (202') that extends beyond a peripheral edge (205) of the active display portion (204). A plurality of conductive bonding pads (208) are affixed at the protruding region (202') and coupled to the plurality of the conductive traces (212). A flexible circuit (206) includes a plurality of conductors electrically coupled to the plurality of bonding pads (208) at locations on or below a lower surface of the substrate (202).

公开(公告)号：EP2715226B1

公开(公告)日：2015-04-08

申请号：EP12714368.3

申请日：2012-02-15

Applicant: Marulaled (Pty) Ltd

Inventor： DE VAAL, Gerardus Geertruud

IPC: F21V29/00

CPC classification number: H01L33/64 ,  F21K9/00 ,  F21V29/508 ,  F21V29/67 ,  F21V29/83 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L25/167 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/09481 ,  H05K2201/10106 ,  H05K2201/10242 ,  H01L2924/00

Abstract: A semiconductor device such as an LED illumination device includes a substrate sheet (2) and a plurality of LEDs (4) that are supported on the front of the substrate sheet. A plurality of apertures (9) extend through the substrate sheet (2) and thermally conductive elements in the form of conduits or tubes (1) extend through the apertures, while thermally conductive elements in the form of pads (10) extend between the LEDs and the tubes (1). Each tube (1) defines an open passage that extends through the apertures (9) between the front and the back of the substrate sheet (2), without obstruction. Heat generated in the LEDs is conducted to the tubes (1), from where it is dissipated through convection.

公开(公告)号：EP2715226A1

公开(公告)日：2014-04-09

申请号：EP12714368.3

申请日：2012-02-15

Applicant: Marulaled (Pty) Ltd

Inventor： DE VAAL, Gerardus Geertruud

IPC: F21V29/00

CPC classification number: H01L33/64 ,  F21K9/00 ,  F21V29/508 ,  F21V29/67 ,  F21V29/83 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L25/167 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/09481 ,  H05K2201/10106 ,  H05K2201/10242 ,  H01L2924/00

Abstract: A semiconductor device such as an LED illumination device includes a substrate sheet (2) and a plurality of LEDs (4) that are supported on the front of the substrate sheet. A plurality of apertures (9) extend through the substrate sheet (2) and thermally conductive elements in the form of conduits or tubes (1) extend through the apertures, while thermally conductive elements in the form of pads (10) extend between the LEDs and the tubes (1). Each tube (1) defines an open passage that extends through the apertures (9) between the front and the back of the substrate sheet (2), without obstruction. Heat generated in the LEDs is conducted to the tubes (1), from where it is dissipated through convection.

Abstract translation: 诸如LED照明装置的半导体装置包括基板（2）和被支撑在基板的前面的多个LED（4）。 多个孔（9）延伸穿过基片（2），导管或管（1）形式的导热元件延伸穿过孔，而垫（10）形式的导热元件在LED 和管（1）。 每个管（1）限定开放通道，其延伸穿过基片（2）的前后之间的孔（9），而不会阻塞。 在LED中产生的热量被传导到管（1），从其通过对流消散。