公开(公告)号：EP1897103A1

公开(公告)日：2008-03-12

申请号：EP06785199.8

申请日：2006-06-21

Applicant: E. I. DU PONT DE NEMOURS AND COMPANY

Inventor： BORLAND, William J. ,  BURN, Ian ,  IHLEFELD, Jon, Fredrick ,  MARIA, Jon-Paul ,  SUH, Seigi

IPC: H01G4/33 ,  H01G4/10 ,  H01G4/12

CPC classification number: H01L21/02197 ,  C01G23/006 ,  C01P2004/82 ,  C01P2006/40 ,  H01G4/1227 ,  H01G4/33 ,  H01L21/02337 ,  H01L21/31691 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355 ,  Y10T29/417 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T428/31678

Abstract: The present invention is directed to a dielectric thin film composition comprising: (1) one or more barium/titanium-containing selected from (a) barium titanate, (b) any composition that can form barium titanate during firing, and (c) mixtures thereof; dissolved in (2) organic medium; and wherein said thin film composition is doped with 0.002 to 0.05 atom percent of a manganese-containing additive.

公开(公告)号：EP1887590A1

公开(公告)日：2008-02-13

申请号：EP07253149.4

申请日：2007-08-10

Applicant: E.I. du Pont de Nemours and Company

Inventor： Borland, William ,  Amey, Daniel Irwin, Jr. ,  McGregor, David Ross ,  Onken, Matthew T.

IPC: H01G4/33 ,  H01G4/12

CPC classification number: H01G4/33 ,  H01G4/12 ,  H05K1/162 ,  H05K3/0044 ,  H05K3/04 ,  H05K3/064 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09763 ,  H05K2203/025 ,  Y10T29/417

Abstract: Disclosed is a method of forming individual thin-film capacitors for embedding inside printed wiring boards or organic semiconductor package substrates, which includes removal of selected portions of the capacitor by sandblasting or other means so that the ceramic dielectric does not come into contact with acid etching solutions.

Abstract translation: 公开了一种形成用于嵌入印刷线路板或有机半导体封装基板内的各种薄膜电容器的方法，其包括通过喷砂或其它方式去除电容器的选定部分，使得陶瓷电介质不与酸蚀刻接触 解决方案。

公开(公告)号：EP1859490A1

公开(公告)日：2007-11-28

申请号：EP06710108.9

申请日：2006-03-16

Applicant: Dupont Teijin Films U.S. Limited Partnership

Inventor： MCDONALD, William, Alasdair ,  PLACIDO, Frank ,  EVESON, Robert William

IPC: H01L51/00 ,  B29C55/06 ,  C08L67/03

CPC classification number: H01L51/52 ,  B29C55/04 ,  H01L51/0097 ,  H01L51/5253 ,  H01L51/56 ,  H01L2251/5338 ,  H05K1/0393 ,  H05K3/0011 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2203/0271 ,  H05K2203/1105 ,  H05K2203/165 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/265

Abstract: A method of manufacture of a composite film, and a method of manufacturing an electronic or opto-electronic device, said method comprising the steps of (i) forming a polymeric substrate layer; (ii) stretching the substrate layer in at least one direction; (iii) heat-setting under dimensional restraint at a tension in the range of about 19 to about 75 kg/m of film width, at a temperature above the glass transition temperature of the polymer of the substrate layer but below the melting temperature thereof; (iv) heat-stabilising the film at a temperature above the glass transition temperature of the polymer of the substrate layer but below the melting temperature thereof; (v) applying a planarising coating composition such that the surface of said coated substrate exhibits an Ra value of less than 0.6 nm, and/or an Rq value of less than 0.8 nm; and (vi) providing an inorganic barrier layer of thickness from 2 to l000nm by high-energy vapour deposition; and optionally (vii) providing the composite film comprising said polymeric substrate layer, said planarising coating layer and said inorganic barrier layer as a substrate in said electronic or opto- electronic device; and said composite film and said electronic or opto-electronic device, per se.

公开(公告)号：EP1777713A3

公开(公告)日：2007-10-24

申请号：EP06255336.7

申请日：2006-10-17

Applicant: E.I. du Pont de Nemours and Company

Inventor： Borland, William J. ,  Maria, Jon-Paul ,  Ihlefeld, Jon Frederick

IPC: H01G4/12

CPC classification number: C01G23/006 ,  C01G25/00 ,  C01P2006/42 ,  C04B35/4682 ,  C04B35/49 ,  C04B35/632 ,  C04B2235/3215 ,  C04B2235/3293 ,  C04B2235/441 ,  C04B2235/449 ,  C04B2235/6584 ,  C04B2235/663 ,  C23C18/1216 ,  C23C18/1241 ,  C23C18/1279 ,  C23C18/1295 ,  H01G4/1227 ,  H01G4/33 ,  H01L21/31691 ,  H01L28/55 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0355

Abstract: Disclosed are high permittivity (dielectric constant), thin film CSD barium titanate based dielectric precursor solution comprising barium acetate, a titanium source and a B site cation source. The dielectrics show capacitance as a function of temperature that better satisfies the X7R requirements. A method of making a capacitor with this barium titanate based dielectric precursor solution is disclosed.

公开(公告)号：EP1556897A2

公开(公告)日：2005-07-27

申请号：EP03748414.4

申请日：2003-10-04

Applicant: Koninklijke Philips Electronics N.V.

Inventor： WYLAND, Chris

IPC: H01L23/373

CPC classification number: H01L23/49822 ,  H01L23/3733 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K1/0366 ,  H05K2201/0175 ,  Y10S428/901 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A substrate material (130) for mounting an integrated circuit (100) contains a non-electrically-conductive mesh (135) of thermally-conductive material. Because the mesh is electrically-non-conductive, it can purposely be configured to contact any and all of the circuit traces (155) that are proximate to the substrate, thereby using the circuit traces (155) as thermally-coupled heat sinks. In a preferred embodiment, the thermally-conductive mesh (135) replaces the structural fiberglass mesh that is conventionally used in substrates, thereby allowing the mesh (135) to serve a dual structural and thermal function.

公开(公告)号：EP1005260A3

公开(公告)日：2004-04-07

申请号：EP99309146.1

申请日：1999-11-17

Applicant: MicroCoating Technologies, Inc.

Inventor： Hunt, Andrew Tye ,  Flanagan, John Scott ,  Neuman, George Andrew

IPC: H05K1/16 ,  H01G4/10 ,  H01G4/08 ,  C23C16/453

CPC classification number: H05K1/162 ,  H01G4/085 ,  H05K3/388 ,  H05K3/467 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09309

Abstract: Thin layer capacitors are formed from a first flexible metal layer (402,502), a dielectric layer (404,504) between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer (406,506) deposited on the dielectric layer (404,504). The first flexible metal layer may either be a metal foil (402), such as a copper, aluminum, or nickel foil, or a metal layer (502) deposited on a polymeric support sheet (501). Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.

公开(公告)号：EP0732713B1

公开(公告)日：2003-10-22

申请号：EP96104179.5

申请日：1996-03-15

Applicant: OMRON CORPORATION

Inventor： Kawai, Wakahiro

IPC: H01G4/33 ,  H01G4/008 ,  H05K1/16

CPC classification number: H01G4/08 ,  H05K1/162 ,  H05K3/102 ,  H05K3/245 ,  H05K3/38 ,  H05K3/383 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09763 ,  Y10T29/43 ,  Y10T29/435

公开(公告)号：EP1111970A3

公开(公告)日：2003-03-12

申请号：EP00307630.4

申请日：2000-09-04

Applicant: Hitachi, Ltd.

Inventor： Kusukawa, Junpei, Hitachi, Ltd. ,  Takeuchi, Ryozo, Hitachi, Ltd.

IPC: H05K1/02 ,  H05K3/22

CPC classification number: H05K3/22 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0257 ,  H05K1/0306 ,  H05K3/244 ,  H05K3/38 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09145 ,  H05K2201/098 ,  H05K2203/0346 ,  H05K2203/105 ,  H05K2203/107 ,  H05K2203/128 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2924/00

Abstract: In order to restrict a local concentration of an electric field in a conductor layer end portion (11a, 15a) of an insulating circuit board and increase a partial electric discharge starting voltage, thereby improving an insulating reliability of the insulating circuit board and a power semiconductor apparatus employing the same, the present invention provides a method of manufacturing a insulating circuit board comprising the step of applying a voltage between the circuit patterns of the insulating circuit board in an atmospheric or depressurized gas so as to allow the circuit board to discharge electricity, or irradiating a laser beam, thereby a projection shape of the end portion (11a, 15a) of the electrode conductor (3, 6) is melted and smoothened so as to restrict the concentration of the electric field.

Abstract translation: 为了限制绝缘电路板的导体层端部（11a，15a）中的电场的局部浓度，并且增加了部分放电起始电压，从而提高了绝缘电路板和功率半导体的绝缘可靠性 本发明提供一种制造绝缘电路板的方法，该方法包括以下步骤：在绝缘电路板的电路图形之间在大气压或减压气体中施加电压，以允许电路板放电， 或照射激光束，由此使电极导体（3,6）的端部（11a，15a）的突起形状熔化并平滑，从而限制电场的浓度。

公开(公告)号：EP1154480A3

公开(公告)日：2003-01-29

申请号：EP01304076.1

申请日：2001-05-04

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Mashino, Naohiro

IPC: H01L23/498 ,  H01L23/50

CPC classification number: H01L23/49822 ,  H01L23/642 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/053 ,  H05K1/056 ,  H05K1/141 ,  H05K1/162 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09809 ,  H05K2203/0315

Abstract: A multilayer wiring board (101) comprises: a metal substrate (102) as a core, a condenser dielectric layer (102a) formed to cover the metal layer (102) and a condenser electrode metal layer (104) formed to cover the condenser dielectric layer (102a), so that a condenser is defined by the metal substrate (102), the condenser dielectric layer (102a) and the condenser electrode metal layer (104). The condenser dielectric layer (102a) is provided with a first contact hole (102b) to communicate with the metal substrate (102) and the condenser electrode metal layer (104) is provided with a second contact hole (104b) to communicate with the first contact hole, the diameter of the second contact hole (104b) being larger than that of the first contact hole (102b). An insulating layer (111) is formed on the condenser electrode metal layer (104) and is provided with a via hole to communicate with the metal substrate through the second and first contact holes (102b,104b). A metal substrate contact metal layer (112a) is formed on an inner wall of the via hole, so that the metal substrate contact metal layer (112a) comes into electrical contact with the metal substrate (102).

公开(公告)号：EP1060141B1

公开(公告)日：2002-10-30

申请号：EP99908438.7

申请日：1999-02-25

Applicant: PPG Industries Ohio, Inc.

Inventor： NOVICH, Bruce E. ,  ROBERTSON, Walter, J.

IPC: C03C25/10 ,  C08J5/08 ,  H05K1/03

CPC classification number: H05K1/0366 ,  C03C25/26 ,  C03C25/42 ,  C03C25/47 ,  C08J5/08 ,  H05K3/0047 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0254 ,  H05K2203/127

Abstract: The present invention provides glass fiber strands impregnated with non-abrasive solid particles which provide interstitial spaces of at least 3 micrometers between adjacent fibers within a strand which are useful for reinforcing composites.

Abstract translation: 本发明提供了用非研磨固体颗粒浸渍的玻璃纤维丝束，其在丝束内的相邻纤维之间提供至少3微米的间隙，这对于增强复合材料是有用的。