公开(公告)号：EP2568784A3

公开(公告)日：2013-12-11

申请号：EP11194944.2

申请日：2011-12-21

Applicant: Primax Electronics Ltd

Inventor： Su, Chun-nan ,  Peng, Chun-Ching

IPC: H05K5/02 ,  H01R24/60

CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

公开(公告)号：EP2092806B1

公开(公告)日：2013-09-11

申请号：EP07846547.3

申请日：2007-11-09

Applicant: Häusermann GmbH

Inventor： OBERENDER, Lothar ,  JANESCH, Rudolf ,  STRUMMER, Erich ,  HACKL, Johann

IPC: H05K3/10 ,  H05K3/22 ,  H05K1/02 ,  H05K3/32 ,  B23K20/00 ,  H01L23/00 ,  H05K3/46

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K2201/42 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/78313 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K1/0209 ,  H05K1/0263 ,  H05K3/103 ,  H05K3/222 ,  H05K3/328 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2203/0285 ,  H01L2224/48 ,  H01L2924/00

公开(公告)号：EP2491582A1

公开(公告)日：2012-08-29

申请号：EP10770711.9

申请日：2010-10-11

Applicant: Mühlbauer AG

Inventor： ZOLLNER, Franz

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/40

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K1/184 ,  H05K3/103 ,  H05K3/281 ,  H05K3/403 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/09645 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2203/063 ,  H01L2924/00

Abstract: The invention relates to a method for producing a number of vias (6) in order to create electrically and/or thermally conductive connections between different faces (3, 4) of a substrate (1). The invention further relates to a substrate (1) comprising at least one via (6) that is produced in such a manner. The aim of the invention is to produce vias (6) in a particularly easy manner. This is achieved in that at least one electrically and/or thermally conductive foil (7) is inserted into a through-opening (8, 16) that connects different substrate faces (3, 4), and areas (9) of the at least one foil (7) are fixed near the edges (11) of the opening (8, 16) on the surfaces of the substrate faces (3, 4).

公开(公告)号：EP2226747B1

公开(公告)日：2012-06-27

申请号：EP10155491.3

申请日：2010-03-04

Applicant: Smartrac IP B.V.

Inventor： Michalk, Manfred

IPC: H05K1/18 ,  F16B5/02 ,  G06K19/073 ,  G06K19/077 ,  H05K3/10 ,  H01F41/04 ,  F16B17/00 ,  F16B41/00

CPC classification number: G06K19/077 ,  G06K19/073 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  H01F41/074 ,  H01F41/096 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H05K1/183 ,  H05K1/184 ,  H05K3/103 ,  H05K3/28 ,  H05K3/281 ,  H05K3/328 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/1028 ,  H05K2203/0285 ,  H05K2203/1311 ,  Y10T29/49124 ,  Y10T29/53174 ,  H01L2224/0401

Abstract: The circuit assembly has a substrate (4) with an electronic component (6). A metallic and electrically conductive strip (2) is arranged in a circuit pattern on the substrate. Connections (19) of the electronic component are electrically connected with contacting areas (8) of the conductive strip. Independent claims are also included for the following: (1) a method for creating a wiring pattern on a substrate; and (2) a device for creating a wiring pattern on a substrate.

公开(公告)号：EP1489696B1

公开(公告)日：2012-01-18

申请号：EP04012943.9

申请日：2004-06-01

Applicant: Future-Shape GmbH

Inventor： Jung, Stefan ,  Lauterbach, Christl

IPC: H01R12/59 ,  H05K3/36

CPC classification number: H01R12/59 ,  H01R12/77 ,  H05K3/103 ,  H05K3/321 ,  H05K3/3405 ,  H05K3/363 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/1028 ,  H05K2201/1034 ,  Y10T29/49135 ,  Y10T29/49169

公开(公告)号：EP2380238A1

公开(公告)日：2011-10-26

申请号：EP08875968.3

申请日：2008-12-17

Applicant: FCI

Inventor： RADENNE, Jean Pierre ,  MATHIEU, Christophe ,  BERDALLE, Laurent

IPC: H01R4/04

CPC classification number: H05K3/4685 ,  G06K19/07749 ,  G06K19/07752 ,  H05K2201/1028 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A method of manufacture of an electrical bridge comprising the following steps: (a) providing a first flexible electrically insulating material (11), (b) laminating a pattern of a second electrically conductive material (12), on the first material, (c) separating a strap (15) having a connection portion (13) formed from the pattern of electrically conductive material (12).

公开(公告)号：EP2306512A2

公开(公告)日：2011-04-06

申请号：EP11150797.6

申请日：2006-07-05

Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI ,  SHOWA DENKO KABUSHIKI KAISHA

Inventor： Otoshi, Kota ,  Kono, Eiji ,  Toh, Keiji ,  Tanaka, Katsufumi ,  Furukawa, Yuichi ,  Yamauchi, Shinobu ,  Hoshino, Ryoichi ,  Wakabayashi, Nobuhiro ,  Nakagawa, Shintaro

IPC: H01L23/36 ,  H05K1/02 ,  H01L23/367

CPC classification number: H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00

Abstract: A heat radiator (20) includes an insulating substrate (3) whose first side serves as a heat-generating-element-mounting side, and a heat sink (5) fixed to a second side of the insulating substrate. Two stress relaxation members (4) formed of a high-thermal-conduction material are disposed between the insulating substrate and the heat sink and include each a plate-like body (10) and a plurality of projections (11) formed on one side of the plate-like body. A side of the plate-like body of one stress relaxation member on which the projections are not formed is metal-bonded to the insulating substrate, whereas a side of the plate-like body of the other stress relaxation member on which the projections are not formed is metal-bonded to the heat sink. The projections of one stress relaxation member are positioned in respective gaps between the projections of the other stress relaxation member, and the end faces of the projections of one stress relaxation member being metal-bonded to the plate-like body of the other stress relaxation member, and vice versa.

Abstract translation: 散热器（20）包括第一侧用作发热元件安装侧的绝缘基板（3）和固定在绝缘基板的第二面上的散热片（5）。 在绝热基板和散热器之间设置由高导热材料形成的两个应力松弛部件（4），并且包括：板状体（10）和形成在该散热片的一侧的多个突起（11） 板状体。 没有形成有突起的一个应力松弛部件的板状体的一侧金属接合到绝缘基板，而另一个应力松弛部件的板状体的不具有突起的侧面 形成的金属结合到散热器。 一个应力缓和构件的突起位于另一个应力松弛构件的突起之间的相应间隙中，并且一个应力松弛构件的突起的端面金属接合到另一个应力松弛构件的板状体 ，反之亦然。

公开(公告)号：EP0907308B1

公开(公告)日：2011-01-26

申请号：EP97924262.5

申请日：1997-05-28

Applicant: ROHM CO., LTD.

Inventor： NAKAMURA, Satoshi

IPC: H05K3/34

CPC classification number: H05K3/3405 ,  H05K1/111 ,  H05K3/0097 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3484 ,  H05K3/403 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2203/0545 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method for mounting terminal on circuit board includes an applying process for applying solder paste (3) to a desired circuit board (1), a laying process for laying the connecting ends (4a) of terminals (4) having the connecting ends (4a) and non-connecting ends (4b) on the parts coated with the paste (3), and a heating process for melting the paste (3) for soldering the connecting ends (4a) to the board (1). In the applying process, a plurality of sets of solder paste applying parts (3a-3d) which are separated from each other are provided on the board (1). In the laying process, each connecting end (4a) is laid across each set of parts (3a-3d).

公开(公告)号：EP2226747A2

公开(公告)日：2010-09-08

申请号：EP10155491.3

申请日：2010-03-04

Applicant: Michalk, Martin

Inventor： Michalk, Martin

IPC: G06K19/073 ,  G06K19/077 ,  H05K3/10

CPC classification number: G06K19/077 ,  G06K19/073 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07783 ,  H01F41/074 ,  H01F41/096 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H05K1/183 ,  H05K1/184 ,  H05K3/103 ,  H05K3/28 ,  H05K3/281 ,  H05K3/328 ,  H05K3/4084 ,  H05K2201/0129 ,  H05K2201/1028 ,  H05K2203/0285 ,  H05K2203/1311 ,  Y10T29/49124 ,  Y10T29/53174 ,  H01L2224/0401

Abstract: Die Erfindung betrifft eine Schaltungsanordnung, umfassend ein Substrat (4) mit zumindest einem elektronischen Bauelement (6). Erfindungsgemäß ist auf und/oder in dem Substrat (4) zumindest ein metallisches, elektrisch leitendes Leiterband (2, 2.1) in einem Schaltungsmuster (12) angeordnet, wobei Anschlüsse (19) des elektronischen Bauelements (6) mit Kontaktierbereichen (8) des Leiterbandes (2, 2.1) elektrisch verbunden sind.
Des Weiteren betrifft die Erfindung ein Verfahren zur Erzeugung eines Schaltungsmusters (12) auf einem Substrat (4). Erfindungsgemäß wird auf zumindest eine Oberflächenseite des Substrates (4) zumindest ein Leiterband (2, 2.1) aufgebracht, welches zumindest auf einer dem Substrat (4) zugewandten Oberflächenseite mit einem aufschmelzbaren Isolierlack (1) beschichtet ist, wobei der Isolierlack (1) durch thermische Energie oder mittels Ultraschall erwärmt und zumindest teilweise aufgeschmolzen wird und das Leiterband (2, 2.1) auf das Substrat (4) aufgepresst wird.
Die Erfindung betrifft des Weiteren eine Vorrichtung (11) zur Erzeugung eines Schaltungsmusters (12) auf einem Substrat (4), umfassend erfindungsgemäß eine Leiterbandspule (14) und ein zylinderförmiges oder konisches Verlegewerkzeug (10), welches zumindest über einen Teil seiner Länge eine das Leiterband (2, 2.1) führende Innenbohrung und eine ringförmige, in Innen- und Außenradius übergehende, senkrecht zu seiner Längsachse angeordnete Wirkfläche aufweist.

Abstract translation: 该电路组件具有一个基板（4），在电子部件（6）。 的金属和导电带（2）在基片上的电路图案被布置。 所述电子部件的连接（19）与所述导电带的电接触区（8）连接。 因此独立权利要求中包括了以下内容：（1）用于创建在基板的布线图案的方法; 和（2），用于创建在基板的布线图案的装置。

公开(公告)号：EP2191060A1

公开(公告)日：2010-06-02

申请号：EP08803776.7

申请日：2008-09-05

Applicant: Benecke-Kaliko AG

Inventor： RITTER, Wolfgang

IPC: D06N3/00 ,  H05K1/18 ,  H05B3/34 ,  H01B5/14 ,  A41D13/005 ,  B60N2/56 ,  D06M11/84

CPC classification number: H05K1/118 ,  A41D13/0051 ,  B60N2/5685 ,  D06M11/74 ,  D06M11/83 ,  D06M23/08 ,  D06N3/0056 ,  H05B3/342 ,  H05B2203/011 ,  H05B2203/016 ,  H05B2203/017 ,  H05B2203/029 ,  H05K1/0263 ,  H05K3/244 ,  H05K2201/056 ,  H05K2201/10272 ,  H05K2201/1028 ,  H05K2201/10598

Abstract: The present invention relates to an electrically conductive, flexible web material, comprising a polymer-bonded electrically conductive coating (2) on a flexible, electrically non-conductive carrier (1) and at least two electrodes (3) for feeding electric current, wherein the electrodes (3) are designed as a flexible band made of an electrically conductive material, and wherein each electrode is fixed on the flat carrier (2) by means of one or more stitches (5), such that at least one surface of each electrode (3) has a surface contact with the electrically conductive coating (2). The invention further relates to the use of the electrically conductive, flexible web material in heating elements and in clothing.