公开(公告)号：EP2711399A1

公开(公告)日：2014-03-26

申请号：EP13764808.5

申请日：2013-03-15

Applicant: Mitsubishi Engineering-Plastics Corporation

Inventor： TAKANO Takahiro ,  SUMINO Takahiko ,  ISHIHARA Kentarou

IPC: C08L101/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40

CPC classification number: C08K3/00 ,  C08K3/22 ,  C08K3/2279 ,  C08K3/40 ,  C08K7/14 ,  C08K9/02 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08L23/06 ,  C08L77/06 ,  C08L91/06 ,  C08L101/12 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/32 ,  C23C18/38 ,  C23C18/42 ,  F21V7/22 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/0293 ,  H05K2201/0347 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0723 ,  H05K2203/107

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10°C/min, of 250°C or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Abstract translation: 本发明提供一种热塑性树脂组合物的所有其具有优异的可镀性（电镀的外观），甚至热老化后保持高反射率。 一种热塑性树脂组合物，包括：由（A）100重量份的具有熔点的结晶性热塑性树脂，以速率10℃/ min的加热通过差示扫描量热法（DSC）测定的250℃或以上，; （B）10至80重量份的玻璃填料; （C）1至30份（重量）具有在25％或以上450nm的反射率的激光直接结构化添加剂; 和（D）20至150份（重量）氧化钛。

公开(公告)号：EP2640173A2

公开(公告)日：2013-09-18

申请号：EP13171999.9

申请日：2006-12-08

Applicant: Trillion Science, Inc.

Inventor： Liang, Rong-chang ,  Ho, Shih-wei ,  Liu, Eric H. ,  Xu, Qianfei

IPC: H05K3/32 ,  B32B27/00 ,  H01B1/22 ,  H01B1/24 ,  H01R13/24

CPC classification number: H05K3/323 ,  H01B1/22 ,  H01B1/24 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01R13/2414 ,  H05K2201/0221 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y10T428/24612 ,  Y10T428/2462 ,  H01L2924/00

Abstract: An anisotropic conductive film (ACF) comprising:
a plurality of conductive particles disposed in predefined non-random particle locations as a non-random array in or on an adhesive layer wherein said non-random particle locations corresponding to a plurality of predefined micro-cavity locations of an array of micro-cavities for carrying and transferring said conductive particles to said adhesive layer.

Abstract translation: 一种各向异性导电膜（ACF），包括：多个导电颗粒，其布置在预定义的非随机颗粒位置中，作为粘合剂层中或粘合剂层上的非随机阵列，其中所述非随机颗粒位置对应于多个预定义的微腔 微孔阵列的位置，用于将所述导电颗粒携带并转移到所述粘合剂层。

公开(公告)号：EP2308904A4

公开(公告)日：2012-11-14

申请号：EP09802911

申请日：2009-07-27

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： WADA TAKUYA ,  NAGATANI NAOYUKI

IPC: C08F220/10 ,  C08J3/12

CPC classification number: H05K3/323 ,  C01P2004/84 ,  C08F220/18 ,  C08F222/1006 ,  C09C3/10 ,  H05K2201/0218 ,  H05K2201/0221

公开(公告)号：EP2148393A1

公开(公告)日：2010-01-27

申请号：EP08752686.9

申请日：2008-05-14

Applicant: Hitachi Chemical Company, Ltd.

Inventor： KOJIMA, Kazuyoshi ,  KOBAYASHI, Kouji ,  ARIFUKU, Motohiro ,  MOCHIZUKI, Nichiomi

IPC: H01R11/01 ,  C09J9/02 ,  C09J201/00 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H01L21/60 ,  H05K3/36

CPC classification number: H05K3/323 ,  C08K7/16 ,  C08K9/02 ,  C09J9/02 ,  C09J11/02 ,  H01B1/02 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/13016 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/29499 ,  H01L2224/2989 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01R4/04 ,  H01R12/714 ,  H01R13/03 ,  H05K3/361 ,  H05K2201/0221 ,  Y10T428/2998 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 µm and the thickness of the metal layer being 65-125 nm.

Abstract translation: 一种电路连接材料，用于将两个电路部件与其上形成有电路电极的电连接，电路电极相对，其中电路连接材料包括粘合剂组合物和导电颗粒，并且导电颗粒是具有多个突起 由表面上由包含由镍或镍合金构成的金属层覆盖的有机高分子化合物制成的芯构成，芯的平均粒径为1-4μm，金属层的厚度为65〜 125 nm。

公开(公告)号：EP2120525A1

公开(公告)日：2009-11-18

申请号：EP08721360.9

申请日：2008-03-05

Applicant: Bridgestone Corporation

Inventor： KOTSUBO, Hidefumi ,  FUNAKI, Tatsuya ,  SASAKI, Kiyomi ,  HANZAWA, Kentaro

IPC: H05K9/00 ,  B32B15/08 ,  E04B1/92 ,  G09F9/00

CPC classification number: H05K9/0096 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1669 ,  C23C18/30 ,  C23C18/31 ,  C23C18/405 ,  H05K9/0005 ,  H05K2201/0221 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: The present invention provides a process for efficiently preparing a light transmissive electromagnetic wave shielding material enhanced in light transmissive property, electromagnetic wave shielding property, appearance and legibility, and having high-accuracy mesh-pattern. The process for the preparation of a light transmissive electromagnetic wave shielding material comprising; printing in the form of mesh a pretreatment agent for electroless plating on a transparent substrate to form a mesh-shaped pretreatment layer, the pretreatment agent comprising a fine particle having an extremely-thin film of noble metal on its surface, and subjecting the mesh-shaped pretreatment layer to electroless plating to form a mesh-shaped metal conductive layer on the pretreatment layer.

Abstract translation: 本发明提供有效制备在透光性，电磁波屏蔽性，外观及识别性提高的透光电磁波屏蔽材料，并具有高精确度的网状图案的方法。 对于包括一个透光性电磁波屏蔽材料的制备方法; 在啮合的用于化学镀的前处理剂上的透明的基板的形式印刷，以形成网状的前处理层，前处理剂，其包含具有对贵金属的极薄的膜在其表面上，以及使所述网的细颗粒 成形前处理层，以无电解电镀，以形成预处理层上形成网状的金属导电层。

公开(公告)号：EP1831897A1

公开(公告)日：2007-09-12

申请号：EP05822819.8

申请日：2005-12-28

Applicant: Dongbu Hitek Co., Ltd.

Inventor： MIN, Byung Hoon ,  KIM, Kyung Heum ,  KIM, Seung Bum ,  LEE, Sung Soo ,  PARK, Kyoung Bae Dongbu Chemical Co., Ltd. ,  KIM, Nam Gyol ,  YOO, Byoung Jae Dongbu Chemical Co., Ltd.

IPC: H01B1/00

CPC classification number: H01B1/02 ,  C23C18/1635 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/22 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  C23C18/405 ,  C23C28/00 ,  C23C28/021 ,  C23C28/023 ,  C25D3/60 ,  C25D7/00 ,  C25D17/20 ,  H01L23/49816 ,  H01L24/01 ,  H01L24/80 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/2989 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/0221 ,  Y02P70/613 ,  Y10T428/2991 ,  Y10T428/2993 ,  H01L2924/00

Abstract: This invention relates to plastic conductive particles having an outer diameter of 2.5 μm~l mm obtained by sequentially plating a 0.1-10 W thick a metal plating layer and a 1-100 W thick Pb solder layer or a Pb-free solder layer on plastic core beads having a high elastic modulus of compression, and to a method of manufacturing thereof . The method of manufacturing the plastic conductive particles according to this invention includes preparing plastic core beads having excellent thermal properties and a high elastic modulus of compression, etching surfaces of the plastic core beads for surface treatment thereof, forming a metal plating layer via electroless plating to improve adhesion between the bead surface and the metal plating layer, and then forming a solder layer in a manner such that a sealed hexagonal barrel is immersed in an electroplating solution and then an electroplating process is conducted using a mesh barrel rotating 360 °at 6~10 rpm or a mesh barrel having a structure in which one surface of a conventional sealed hexagonal barrel is open, and rotating 200° in right and left directions at 1~5 rpm, to manufacture plastic conductive particles having a size of 1 mm or less. The plastic conductive particles of this invention enable the maintenance of packaging gaps, and thus can be applied to IC packaging, LCD packaging and other conductive materials.

公开(公告)号：EP1002844B1

公开(公告)日：2004-01-07

申请号：EP99119499.4

申请日：1999-10-01

Applicant: Tesa AG

Inventor： Pfaff, Ronald, Dr.

IPC: C09J7/00 ,  H01L21/60 ,  H01L23/498 ,  H01R4/04 ,  H01R13/03 ,  H05K3/32

CPC classification number: H01L24/83 ,  C09J7/10 ,  H01B1/22 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/19043 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0329 ,  H05K2201/2036 ,  Y10T428/2813 ,  Y10T428/2817 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2996 ,  H01L2924/00

公开(公告)号：EP0692137A1

公开(公告)日：1996-01-17

申请号：EP95907808.0

申请日：1995-01-26

Applicant: LOCTITE (IRELAND) LIMITED

Inventor： McARDLE, Ciaran, Bernard ,  BURKE, Joseph

IPC: H05K1 ,  C09J5 ,  C09J9 ,  C09J11 ,  C09J201 ,  H01B1 ,  H01B5 ,  H01F1 ,  H01F41 ,  H01L21 ,  H01R4 ,  H05K3

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R4/04 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347 ,  H01L2924/00

Abstract: The invention provides a composition (3) comprising: (i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles (5) having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electrically-conductive particles (5) are described. Application of a substantially uniform magnetic field by magnet means (8) to the composition (3) causes the electrically-conductive particles (5) to form a regular pattern (9). The composition is used for providing anisotropic conductive pathways (9a, 9b) between two sets of conductors (2a, 2b; 7a, 7b) in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

公开(公告)号：EP0691660A1

公开(公告)日：1996-01-10

申请号：EP95303147.3

申请日：1995-05-10

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Goto, Yasushi ,  Tsukagoshi, Isao ,  Ohta, Tomohisa

IPC: H01B1/22 ,  C09J7/02

CPC classification number: H01R13/2414 ,  C09J7/20 ,  C09J9/02 ,  H01B1/22 ,  H01L2224/11003 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01R4/04 ,  H05K3/102 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/09945 ,  H05K2203/0307 ,  H05K2203/0338 ,  H01L2924/00

Abstract: Anisotropically electroconductive resin film material, produced by adhering electroconductive particles to an adhering layer formed on a support and fixing therein, and introducing a film-forming resin incompatible with the adhering material between the electroconductive particles, has electroconductivity only in the film thickness direction via the electroconductive particles uniformly dispersed in the plane direction, and is suitable for electrically connecting oppositely placed circuits and fine electrodes of a plurality of electronic parts, and for testing electronic parts.

Abstract translation: 通过将导电颗粒粘附到形成在支撑体上并固定在其中的粘合层并将与粘合材料不相容的成膜树脂引入到导电颗粒之间而产生的各向异性导电树脂膜材料仅通过膜厚方向具有导电性 导电颗粒在平面方向上均匀分散，并且适用于电连接多个电子部件的相对放置的电路和精细电极，并用于测试电子部件。

公开(公告)号：EP0662256A1

公开(公告)日：1995-07-12

申请号：EP94921825.0

申请日：1994-07-27

Applicant: CITIZEN WATCH CO. LTD.

Inventor： OKANO, Akihiko ,  OKANO, Terutaka

IPC: H01R43 ,  H01R4 ,  H01R11 ,  H01R12 ,  H05K3 ,  G02F1

CPC classification number: H01R4/04 ,  G02F1/13452 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2203/0425 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A connection terminal portion of a substrate and a terminal portion of an external circuit substrate or a terminal portion of a part are electrically connected together using an anisotropic electrically conducting film. A structure in which a first substrate (100) having a connection terminal portion (31) and a second substrate (200) having a connection terminal portion (13) or a connection terminal portion of a part are connected together with an anisotropic electrically conducting adhesive (22) containing electrically conducting particles (21), wherein the thickness of the electrically conducting film (14) provided for the connection terminal of the first substrate (100), the second substrate (200) or the part is smaller than the diameter of the electrically conducting particles (21). The invention is further concerned with a method of accomplishing the electrical connection.