公开(公告)号：EP1313143A2

公开(公告)日：2003-05-21

申请号：EP02025833.1

申请日：2002-11-18

Applicant: GENNUM CORPORATION

Inventor： The designation of the inventor has not yet been filed

IPC: H01L23/498 ,  H01L23/538

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092 ,  H05K2201/09481 ,  H05K2201/099 ,  H01L2924/00

Abstract: A thick film circuit with a perimeter anchored thick film pad is provided. The thick film circuit includes a base substrate, a thick film bonding pad, and a solder mask layer. The thick film bonding pad is formed on the surface of the base substrate. The solder mask layer is also formed on the surface of the base substrate, and overlaps a portion of the thick film bonding pad in order to improve adhesion between the thick film bonding pad and the base substrate.

Abstract translation: 提供了具有周边锚定厚膜垫的厚膜电路。 厚膜电路包括基底基板，厚膜接合焊盘和焊接掩模层。 在基底基板的表面上形成厚膜接合焊盘。 焊接掩模层也形成在基底衬底的表面上，并与厚膜接合焊盘的一部分重叠，以便改善厚膜焊盘和基底衬底之间的密合性。

公开(公告)号：EP1026929A3

公开(公告)日：2002-06-12

申请号：EP00102407.4

申请日：2000-02-03

Applicant: Sony Chemicals Corporation

Inventor： Kurita, Hideyuki ,  Taniguchi, Masato ,  Hishinuma, Hiroyuki ,  Nakamura, Masayuki ,  Namiki, Hidetsugu

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4617 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A flexible printed wiring board constructed by using elemental pieces at a low cost. The elemental pieces 81a to 81c according to the present invention are provided respectively with supporting films 24a to 24c on one face and adhesive resin films 19a to 19c on the other face. The supporting films 24a to 24c have connecting openings on the bottom face of which the surface of metal wiring circuits are exposed as lands 23a to 23c. On the other hand, conductive bumps 16a to 16c, which are connected respectively to the metal wiring circuits 14a to 14c, project on the resin films 19a to 19c. To construct a flexible printed wiring board 83 by using plural elemental pieces 81a to 81c, the tips of the conductive bumps 16b and 16c are brought into contact respectively with the lands 23a and 23b on the bottom face of the openings and contact-bonded under heating. Thus, the elemental pieces 81a to 81c are adhered to each other owing to the adhesiveness of the resin film 19b and 19c. The connection among the elemental pieces 81a to 81c can be further enhanced by surface-roughing the supporting films 24a to 24c.

公开(公告)号：EP0834917B1

公开(公告)日：2002-02-13

申请号：EP96115745.0

申请日：1996-10-01

Applicant: NITTO DENKO CORPORATION

Inventor： Naito, Toshiki, Nitto Denko Corp. ,  Ouchi, Kazuo, Nitto Denko Corp.

IPC: H01L23/31 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1572 ,  H01L2924/00

公开(公告)号：EP1026929A2

公开(公告)日：2000-08-09

申请号：EP00102407.4

申请日：2000-02-03

Applicant: Sony Chemicals Corporation

Inventor： Kurita, Hideyuki ,  Taniguchi, Masato ,  Hishinuma, Hiroyuki ,  Nakamura, Masayuki ,  Namiki, Hidetsugu

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4617 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A flexible printed wiring board constructed by using elemental pieces at a low cost.
The elemental pieces 81a to 81c according to the present invention are provided respectively with supporting films 24a to 24c on one face and adhesive resin films 19a to 19c on the other face. The supporting films 24a to 24c have connecting openings on the bottom face of which the surface of metal wiring circuits are exposed as lands 23a to 23c. On the other hand, conductive bumps 16a to 16c, which are connected respectively to the metal wiring circuits 14a to 14c, project on the resin films 19a to 19c. To construct a flexible printed wiring board 83 by using plural elemental pieces 81a to 81c, the tips of the conductive bumps 16b and 16c are brought into contact respectively with the lands 23a and 23b on the bottom face of the openings and contact-bonded under heating. Thus, the elemental pieces 81a to 81c are adhered to each other owing to the adhesiveness of the resin film 19b and 19c. The connection among the elemental pieces 81a to 81c can be further enhanced by surface-roughing the supporting films 24a to 24c.

Abstract translation: 以低成本使用元件构成的柔性印刷电路板。 根据本发明的元件81a至81c分别在一个表面上设置有支撑膜24a至24c，而在另一个面上分别设置粘结树脂膜19a至19c。 支撑膜24a至24c在其底面上具有连接开口，金属布线电路的表面露出为接地片23a至23c。 另一方面，分别连接到金属布线电路14a至14c的导电凸块16a至16c突出在树脂膜19a至19c上。 为了通过使用多个元件片81a至81c来构造柔性印刷线路板83，导电凸块16b和16c的顶端分别与开口底面上的焊盘23a和23b接触并在加热下接触接合 。 因此，由于树脂膜19b和19c的粘附性，元件81a至81c彼此粘合。 通过对支撑膜24a〜24c进行表面粗化，能够进一步提高元件81a〜81c之间的连接。

公开(公告)号：EP0536418B1

公开(公告)日：1999-07-28

申请号：EP92909488.6

申请日：1992-04-23

Applicant: CITIZEN WATCH CO. LTD.

Inventor： MIMURA, Seiichi ,  SHIMIZU, Junichiro ,  TAJIRI, Takayuki ,  ICHIKAWA, Shingo ,  KANEKO, Hiroyuki ,  OHI, Masayuki

IPC: H01L23/13 ,  H05K3/24 ,  H01L23/498 ,  H01L23/31 ,  H05K3/06

CPC classification number: H05K3/4007 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3436 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1476 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor device si so configured that the circuit patterns formed on both sides of a copper-clad double-sided laminated board are connected to each other by through holes, and IC chips are mounted on the front side, and further, external-connection terminals are provided on the reverse side. In this semiconductor device, the connection terminals are copper core bumps on the land parts of the through holes which are made in diebond patterns. A method of manufacturing semiconductor devices in which copper core bumps are formed on circuit patterns formed on a circuit board, by plating using resist patterns. In this manufacturing method, the parts, where the bumps are to be formed, of the circuit patterns formed by the resist patterns are treated by the same kind of pattern etching as the one used for forming the circuit patterns.

公开(公告)号：EP0643440A2

公开(公告)日：1995-03-15

申请号：EP94203444.8

申请日：1992-06-03

Applicant: MOD-TAP W CORPORATION

Inventor： White, Rowland Spencer ,  Ivey, David Ernest ,  Jones, Keith Henry

IPC: H01R4/24 ,  H01R9/24

CPC classification number: H01R4/2429 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/142 ,  H05K3/42 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/09954

Abstract: An insulation displacement contact (10) comprises first and second contact portions each of which comprises a cantilevered split beam (19). The upper split beam, which receives insulated wires, comprises a pair of tynes (20,22) which are folded about the axis of a slot (25) separating the tynes such that the internal angle between the tynes is approximately 90°. The width of the tynes is larger than that of prior art devices resulting in increased stiffness and the length of the tynes is sufficiently long to receive two wires therebetween.
The contacts (10) are mounted in a housing which includes a plurality of teeth (90) provided with means for retaining lugs (32,34) on the end of the tynes to ensure bowed opening of the tynes on insertion of a wire. The contacts are arranged along the central axis (72) of the housing such that the folded tynes of alternate contacts extend on opposite sides of the central axis.

Abstract translation: 绝缘位移触点（10）包括第一和第二接触部分，每个接触部分包括悬臂分离梁（19）。 接收绝缘电线的上部开口梁包括一对围绕分隔台面的槽（25）的轴线折叠的台面（20,22），使得台面之间的内角约为90°。 台面的宽度大于现有技术装置的宽度，导致刚度增加，并且台面的长度足够长以在其间接收两根线。 触头（10）安装在包括多个齿（90）的壳体中，所述齿设置有用于将突耳（32,34）保持在触头的端部上的装置，以确保在插入电线时弓形打开。 触点沿外壳的中心轴线（72）布置，使得交替触点的折叠式触点在中心轴线的相对侧上延伸。

公开(公告)号：EP0593584A1

公开(公告)日：1994-04-27

申请号：EP92914485.0

申请日：1992-07-06

Applicant: MOD-TAP W CORPORATION

Inventor： WHITE, Rowland Spencer

IPC: H01R4 ,  H01R12 ,  H05K1 ,  H01R31 ,  H05K3

CPC classification number: H01R4/2429 ,  H01R12/721 ,  H01R24/62 ,  H01R31/06 ,  H05K1/0295 ,  H05K1/117 ,  H05K1/142 ,  H05K3/42 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/09954 ,  Y10S439/922 ,  Y10S439/951

Abstract: Un système de connexions électriques, par exemple un tableau de connexions à face rabattables, comporte un profilé de support (12) recevant des premiers connecteurs (14) dont les contacts sont orientés vers l'extérieur du profilé (12). Un câble introduit entre le profilé et les connecteurs se divise en conducteurs individuels aboutissant à des contacts (34, 36) via des fentes (30) dans les parois du profilé. Un second connecteur (16) porte des prises de communications vocales ou de données classiques (19) qui sont reliées aux premiers connecteurs par l'intermédiaire de cartes de circuits imprimés (38) qui s'enfichent dans des fentes (40) des premiers connecteurs. Les connecteurs plats des cartes ont une discontinuité sur une surface, et une moitié du contact est reliée au contact sur l'autre face pour permettre une connexion directe entre les rangées de contacts supérieures (34) et inférieures (36) des premiers connecteurs dans une première position des seconds connecteurs, et permettre également un contact entre les rangées de contacts supérieures et inférieures et les prises classiques (19) dans une seconde position.

公开(公告)号：EP0574206A3

公开(公告)日：1994-01-12

申请号：EP93304381.2

申请日：1993-06-04

Applicant: Nippon CMK Corp.

Inventor： Matsumoto, Masuo ,  Birukawa, Fusao ,  Takahashi, Takazo ,  Shirai, Junzaburo ,  Kojima, Mikiya

IPC: H05K3/46 ,  H05K1/18 ,  H05K1/16 ,  H05K1/00

CPC classification number: H05K1/162 ,  H05K1/095 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/096

Abstract: [Object] To provide a printed circuit board having electronic component functions buried in a substrate laminate. [Constitution] Holes of an inner substrate 2 are filled with a dielectric paste 6 and a resistor paste 7. These pastes are sealed with a plating layer 13. Thus, the functions of a capacitor and a resistor are buried in the inner substrate 2. Outer substrates 2, 3 are laminated to the inner substrate 2, and holes of the outer substrates 2, 3 are filled with a dielectric paste 6a and a resistor paste 7a, followed by sealing of these pastes with a plating layer 17. Thus, the functions of a capacitor and a resistor are buried in the outer substrates 2, 3. Therefore, the multilayer printed circuit board of the present invention has electronic component functions buried therein.

Abstract translation: 本发明的目的是提供一种具有埋入基板层叠体中的电子部件功能的印刷电路板。 [构成]内部基板2的孔填充有电介质膏6和电阻膏7.这些膏由电镀层13密封。因此，电容器和电阻器的功能被埋入内部基板2中。 将外衬底2,3层压到内衬底2上，并且用电介质浆料6a和电阻浆料7a填充外衬底2,3的孔，随后用电镀层17密封这些浆料。因此， 电容器和电阻器的功能被埋入外基板2,3中。因此，本发明的多层印刷电路板具有埋入其中的电子部件功能。

公开(公告)号：EP0421343A3

公开(公告)日：1993-03-17

申请号：EP90118860.7

申请日：1990-10-02

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Makino, Yutaka ,  Ishimoto, Kazumi ,  Izumi, Yasuo ,  Kitayama, Yoshifumi ,  Kumagai, Koichi

IPC: H01L23/552 ,  H01L23/498

CPC classification number: H05K1/181 ,  H01L23/49534 ,  H01L23/4985 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K2201/09481 ,  H05K2201/10477 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10681 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor element package (P) and a semiconductor element package mounting distributing circuit basic plate, wherein the shield metallic layer (60) is provided on the flexible insulating basic plate for constituting the package, so that the semiconductor element (30) mounted on the flexible insulating basic plate (10) may be kept electromagnetically shielded positively with the shield metallic layer, whereby troublesome operation such as mounting the bulk high box shaped electromagnetic shield member on the outside of the semiconductor element package mounted on the distributing circuit basic plate as in the conventional one is not required, and, also, since the shield metallic layer is provided on the face, which is not formed with the lead patterns, of the flexible insulating basic plate, no influences are applied at all upon the construction of the land pattern and the mounting construction of the semiconductor element.

Abstract translation: 半导体元件封装和半导体元件封装安装分配电路基板，其中屏蔽金属层设置在用于构成封装的柔性绝缘基板上，使得安装在柔性绝缘基板上的半导体元件可以被保持在电磁屏蔽 与屏蔽金属层正相反，因此不需要如常规的那样将散装高箱形电磁屏蔽构件安装在安装在分配电路基板上的半导体元件封装的外侧上的麻烦的操作，并且由于 在柔性绝缘基板的未形成引线图案的表面上设置屏蔽金属层，在构造焊盘图案和半导体元件的安装结构时，根本不施加影响。

公开(公告)号：EP0191434A3

公开(公告)日：1987-11-19

申请号：EP86101606

申请日：1986-02-07

Applicant: International Business Machines Corporation

Inventor： Blakeslee, Marybelle C. ,  Chance, Dudley Augustus ,  Eastman, Dean Eric ,  Gniewek, John J. ,  Ho, Chung Wen ,  Levine, Ernest N. ,  Ordonez, Jose E. ,  Reiley, Timothy Clark ,  Skarvinko, Eugene R.

IPC: H01L21/60

CPC classification number: H01L24/16 ,  H01L23/49822 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4053 ,  H05K2201/09472 ,  H05K2201/09481 ,  Y02P70/613 ,  H01L2924/00

Abstract: Microelectric chips are electrically connected to underlying substrates by means of elongated solder columns made possible by solder dams at the surface of the substrate, the dams being positioned about at least a portion of the connection pads on the surface. Substantial increases in the size of the matrix of such columns are achieved without exceeding applicable shear strain limits, due to the increased deformation of the connectors made possible by their increased length.