公开(公告)号：EP1722411A3

公开(公告)日：2007-01-24

申请号：EP06013121.6

申请日：2000-09-27

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Naba, Takayuki ,  Komorita, Hiroshi ,  Nakayama, Noritaka ,  Iyogi, Kiyoshi

IPC分类号： H01L23/373 ,  H01L23/13

CPC分类号： H05K1/0271 ,  C04B37/026 ,  C04B2235/786 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/13 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/38 ,  H05K3/4629 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2201/09745 ,  Y10T428/12028 ,  Y10T428/12069 ,  Y10T428/12201 ,  Y10T428/12396 ,  Y10T428/12528 ,  Y10T428/12576 ,  Y10T428/1259 ,  H01L2924/00

摘要： A ceramic circuit board comprising: a ceramic substrate and a metal circuit plate bonded to said ceramic substrate through a brazing material layer;
wherein said brazing material layer is composed of Al and an alkaline earth metal element or compound thereof and the amount of Al and an alkaline earth metal element or compound thereof contained in the brazing material layer is 12 wt% or less.

公开(公告)号：EP1741686A1

公开(公告)日：2007-01-10

申请号：EP05736747.6

申请日：2005-04-27

申请人： NGK INSULATORS, LTD.

发明人： Masukawa, Naoshi ,  Ichikawa, Shuichi

IPC分类号： C04B37/00 ,  B01D39/20 ,  B01J35/04

CPC分类号： C04B38/0009 ,  B01J35/04 ,  C04B35/565 ,  C04B37/005 ,  C04B2235/6567 ,  C04B2237/062 ,  C04B2237/064 ,  C04B2237/068 ,  C04B2237/08 ,  C04B2237/083 ,  C04B2237/09 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/346 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/597 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/76 ,  F01N3/0222 ,  F01N3/2828 ,  F01N2450/28 ,  Y02T10/20 ,  Y10T428/1314 ,  Y10T428/24149 ,  Y10T428/249953

摘要： There is provided a honeycomb structured body having improved durability in a honeycomb structure body obtained by unitarily bonding a plurality of honeycomb segments. There is provided a honeycomb structure body 1 including a plurality of honeycomb segments 12 each having an outer wall 7, partition walls 2 disposed in the outer wall 7, and a plurality of cells 3 separated from each other by the partition walls 2 and extending in an axial direction, a bonding layer 8 interposed between the plurality of honeycomb segments 12 to unitarily bond the honeycomb segments 12, and an intermediate layer 9 interposed between the bonding layer 8 and the honeycomb segments 9. In the honeycomb structure body 1, pores having a diameter of 0.5 µm or more of the intermediate layer 9 occupies 25% by volume or less of the whole volume of the intermediate layer 9.

摘要翻译： 提供了一种蜂窝结构体，其通过将多个蜂窝片整体结合而获得的蜂窝结构体的耐久性提高。 提供了一种蜂窝结构体1，其包括多个蜂窝段12，每个蜂窝段12具有外壁7，分隔壁2设置在外壁7中，多个孔3通过分隔壁2彼此分开并延伸到 插入在多个蜂窝片12之间的结合层8，以将蜂窝片12整体结合，并且插入在接合层8和蜂窝片9之间的中间层9.在蜂窝结构体1中， 中间层9的直径为0.5μm以上占中间层9的整体体积的25体积％以下。

公开(公告)号：EP1710219A1

公开(公告)日：2006-10-11

申请号：EP06290463.6

申请日：2006-03-22

申请人： IBIDEN CO., LTD.

发明人： Yoshida, Yutaka c/o Ibiden Co., Ltd.

IPC分类号： C04B38/00 ,  C04B37/00 ,  B01J35/04

CPC分类号： C04B28/24 ,  B01J35/04 ,  B32B3/12 ,  B32B7/10 ,  B32B9/005 ,  B32B2605/08 ,  C04B35/195 ,  C04B35/565 ,  C04B37/005 ,  C04B38/0019 ,  C04B2111/80 ,  C04B2235/6567 ,  C04B2235/80 ,  C04B2237/062 ,  C04B2237/064 ,  C04B2237/068 ,  C04B2237/083 ,  C04B2237/09 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/38 ,  C04B2237/52 ,  C04B2237/708 ,  C04B2237/76 ,  Y10T428/24149 ,  Y10T428/24157 ,  C04B14/30

摘要： In a honeycomb structure made of a honeycomb block including a plurality of honeycomb units joined to each other across a seal layer laid between adjacent ones and each of which is formed from a plurality of cells laid longitudinally side by side and cell walls each separating the adjacent cells from each other, or in a honeycomb structure made of a honeycomb monolith including a plurality of cells disposed longitudinally side by side and cell walls each separating the adjacent cells from each other and a seal layer provided over the outer surface of the honeycomb monolith, the seal layer has a color of 60 or more in CIE (1976) psychometric lightness (L*).

摘要翻译： 在由包括多个蜂窝单元的蜂窝块构成的蜂窝结构体中，所述蜂窝块包括跨越相邻的密封层彼此连接的多个蜂窝单元，并且每个蜂窝块由纵向并排放置的多个单元形成，每个单元分隔相邻的 或由蜂窝状整体构成的蜂窝状结构体，该蜂窝结构体包括纵向并排配置的多个单元以及将相邻的单元彼此分离的单元壁以及设置在蜂窝状整料的外表面上的密封层， 密封层在CIE（1976）心理测量亮度（L *）中具有60以上的颜色。

公开(公告)号：EP1278631A4

公开(公告)日：2006-03-29

申请号：EP01934961

申请日：2001-05-01

申请人： UNIV JOHNS HOPKINS

发明人： WIEHS TIMOTHY P ,  REISS MICHAEL

IPC分类号： B21C37/00 ,  B23K1/00 ,  B23K20/00 ,  B23K20/06 ,  B23K20/08 ,  B23K28/00 ,  B23K35/02 ,  B23K35/34 ,  B32B15/01 ,  B32B18/00 ,  B32B37/00 ,  C04B37/02 ,  C06B21/00 ,  C06B33/00 ,  C06B45/14 ,  C06C7/00 ,  C06C7/02 ,  C23C14/14 ,  F24V30/00 ,  H05K3/34 ,  B32B9/00

CPC分类号： B32B18/00 ,  B23K1/0006 ,  B23K20/00 ,  B23K20/06 ,  B23K20/08 ,  B23K20/165 ,  B23K28/00 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/34 ,  B32B15/01 ,  B32B15/017 ,  B32B2311/24 ,  C04B37/006 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/368 ,  C04B2237/40 ,  C04B2237/402 ,  C04B2237/60 ,  C04B2237/68 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/78 ,  C06B21/0083 ,  C06B45/14 ,  C21D2211/008 ,  C23C14/14 ,  F24J1/00 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y10S72/70 ,  Y10S228/902 ,  Y10S428/94 ,  Y10T29/49925 ,  Y10T29/49929 ,  Y10T428/12028 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/1209 ,  Y10T428/12229 ,  Y10T428/12361 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12493 ,  Y10T428/1259 ,  Y10T428/12632 ,  Y10T428/1275 ,  Y10T428/12819 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/25 ,  Y10T428/265 ,  Y10T428/2993

摘要： Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil (14) is preferably a freestanding multilayered foil structure made up of alternating layers (16, 18) selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually an environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt the joining materials. If no joining material is used, the foil reaction supplies heat directly to at least two bulk materials, melting a portion of each bulk, which upon cooling, form a strong bond. Additionally, the foil (14) may be designed with openings that allow extrusion of the joining (or bulk) material through the foil to enhance bonding.

摘要翻译： 活性箔及其用途作为局部热源提供，例如在点燃，接合和推进中有用。 改进的反应性箔（14）优选是由选自在放热和自蔓延反应中将彼此反应的材料的交替层（16,18）组成的独立多层箔结构。 当箔反应时，该箔片提供高度局部化的热能，其可以被应用于例如接合层，或直接地应用于待连接的散装材料。 这种箔片热源允许在几乎环境（例如空气，真空，水等）中在室温下快速结合。 如果使用接合材料，则箔反应将提供足够的热量来熔化接合材料。 如果不使用接合材料，箔反应将热量直接提供给至少两种散装材料，从而熔化每个体积的一部分，其在冷却时形成强键。 另外，箔（14）可以被设计成允许通过箔挤出接合（或本体）材料以增强粘合的开口。

公开(公告)号：EP1617966A2

公开(公告)日：2006-01-25

申请号：EP04749506.4

申请日：2004-03-30

申请人： Litton Systems, Inc.

发明人： SALDANA, Miguel Northrop Grumman Elec.-Opt. Syst. ,  TUCKER, Jay Northrop Grumman Elec.-Opt. Syst. ,  IOSUE, Michael Northrop Grumman Elec.-Opt. Syst.

IPC分类号： B23K31/00 ,  H04N5/74 ,  H04N5/225

CPC分类号： B23K20/023 ,  B23K20/16 ,  C04B37/006 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/368 ,  H01J31/507 ,  H01J43/246 ,  H01J2231/5016

摘要： A microchannel plate (MCP) (50) and a dielectric insulator (80) are deposited with a thin film (54, 84) using a suitable metal selected for optimum diffusion. The metallized MCP (50) and dielectric insulator (80) are then aligned and placed in a bonding fixture (36) that provides the necessary force applied to the components to initiate a diffusion bond. The bonding fixture (36) is then placed in a vacuum heat chamber to accelerate the diffusion bonding process between the MCP (50) and the dielectric insulator (80).

公开(公告)号：EP1089334A3

公开(公告)日：2005-11-09

申请号：EP00120263.9

申请日：2000-09-27

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Naba, Takayuki ,  Komorita, Hiroshi ,  Nakayama, Noritaka ,  Iyogi, Kiyoshi

IPC分类号： H01L23/373 ,  H01L23/13

CPC分类号： H05K1/0271 ,  C04B37/026 ,  C04B2235/786 ,  C04B2237/12 ,  C04B2237/121 ,  C04B2237/123 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  H01L23/13 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/38 ,  H05K3/4629 ,  H05K2201/0355 ,  H05K2201/0969 ,  H05K2201/09745 ,  Y10T428/12028 ,  Y10T428/12069 ,  Y10T428/12201 ,  Y10T428/12396 ,  Y10T428/12528 ,  Y10T428/12576 ,  Y10T428/1259 ,  H01L2924/00

摘要： The present invention provides a ceramic circuit board comprising: a ceramic substrate and a metal circuit plate bonded to the ceramic substrate through a brazing material layer; wherein the brazing material layer is composed of Al-Si group brazing material and an amount of Si contained in the brazing material is 7 wt% or less. In addition, it is preferable to form a thinned portion, holes, or grooves to outer peripheral portion of the metal circuit plate. According to the above structure of the present invention, there can be provided a ceramic circuit board having both high bonding strength and high heat-cycle resistance, and capable of increasing an operating reliability as electronic device.

摘要翻译： 本发明提供一种陶瓷电路板，其特征在于，包括：陶瓷基板和金属电路板，其通过钎料层与所述陶瓷基板接合; 其特征在于，所述钎焊材料层由Al-Si基钎焊材料构成，所述钎料中含有的Si的量为7重量％以下。 此外，优选在金属电路板的外周部形成薄壁部，孔或槽。 根据本发明的上述结构，可以提供一种具有高接合强度和高耐热循环性的陶瓷电路板，并且能够提高作为电子设备的操作可靠性。

公开(公告)号：EP1051371B1

公开(公告)日：2004-09-01

申请号：EP99960892.0

申请日：1999-11-11

申请人： ROBERT BOSCH GMBH

发明人： LINDEMANN, Gert ,  LINDNER, Friederike

IPC分类号： C04B37/00 ,  C04B35/58 ,  C04B35/593 ,  F23Q7/00 ,  H05B3/14

CPC分类号： C04B35/58092 ,  B32B18/00 ,  C04B35/5935 ,  C04B35/645 ,  C04B2235/656 ,  C04B2235/658 ,  C04B2237/36 ,  C04B2237/368 ,  C04B2237/765 ,  C04B2237/84 ,  H05B3/141 ,  H05B3/146 ,  H05B3/148

公开(公告)号：EP1119041A3

公开(公告)日：2004-02-04

申请号：EP01300422.1

申请日：2001-01-18

申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Kuibira, Akira ,  Nakata, Hirohiko ,  Higaki, Kenjiro ,  Natsuhara, Masuhiro ,  Ishii, Takashi ,  Matsui, Yasuyuki

IPC分类号： H01L21/68 ,  H01L21/48 ,  C04B37/00 ,  C04B41/52

CPC分类号： H01L21/6835 ,  C04B37/005 ,  C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  C04B2237/06 ,  C04B2237/062 ,  C04B2237/064 ,  C04B2237/066 ,  C04B2237/08 ,  C04B2237/10 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/52 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/72 ,  C04B2237/80 ,  H01L21/4857 ,  H01L21/67103 ,  C04B41/0072 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5133 ,  C04B41/5022 ,  C04B35/581

摘要： A wafer holder for a semiconductor manufacturing apparatus that has a high heat conductivity and includes a conductive layer such as heater circuit pattern which can be formed with a high precision pattern, a method of manufacturing the wafer holder, and a semiconductor manufacturing apparatus having therein the wafer holder are provided. On a surface of a sintered aluminum nitride piece (10a), paste containing metal particles is applied and fired to form a heater circuit pattern (11) as a conductive layer. Between the surface of the sintered aluminum nitride piece (10a) having the heater circuit pattern (11) formed thereon and another sintered aluminum nitride piece (10b), a glass layer (14) is provided as a joint layer to be heated for joining the sintered aluminum nitride pieces (10a and 10b) together.

公开(公告)号：EP1382444A2

公开(公告)日：2004-01-21

申请号：EP03022577.5

申请日：1996-01-12

申请人： IBIDEN CO, LTD. ,  Nissan Diesel Motor Co., Ltd.

发明人： Naruse, Kazuya, Ibiden Co., Ltd. ,  Okazoe, Hiroshi, Nissan Diesel Motor Co., Ltd. ,  Ohno, Satoshi, Ibiden Co., Ltd. ,  Iwahiro, Seiko, Nissan Diesel Motor Co., Ltd. ,  Shimato, Koji, Ibiden Co., Ltd.

IPC分类号： B32B18/00 ,  C04B38/00 ,  C04B37/00 ,  F01N3/02 ,  B01J35/04

CPC分类号： C04B35/6264 ,  B01J27/224 ,  B01J35/04 ,  B01J37/0009 ,  B32B18/00 ,  B32B2315/02 ,  B82Y30/00 ,  C04B28/24 ,  C04B30/02 ,  C04B35/565 ,  C04B35/583 ,  C04B35/584 ,  C04B35/6303 ,  C04B35/6316 ,  C04B35/63416 ,  C04B35/636 ,  C04B35/6365 ,  C04B35/80 ,  C04B35/806 ,  C04B37/005 ,  C04B38/0019 ,  C04B41/009 ,  C04B41/50 ,  C04B2111/00637 ,  C04B2111/00793 ,  C04B2111/0081 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/3445 ,  C04B2235/3481 ,  C04B2235/3826 ,  C04B2235/383 ,  C04B2235/3834 ,  C04B2235/386 ,  C04B2235/3873 ,  C04B2235/5224 ,  C04B2235/5228 ,  C04B2235/526 ,  C04B2235/5276 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/6021 ,  C04B2235/668 ,  C04B2235/9607 ,  C04B2237/083 ,  C04B2237/361 ,  C04B2237/365 ,  C04B2237/368 ,  C04B2237/84 ,  F01N3/0222 ,  F01N13/017 ,  F01N2330/06 ,  F01N2450/28 ,  Y02T10/20 ,  Y10S428/913 ,  Y10T428/24149 ,  Y10T428/24157 ,  Y10T428/24174 ,  Y10T428/24744 ,  Y10T428/254 ,  C04B14/324 ,  C04B14/327 ,  C04B14/328 ,  C04B14/4656 ,  C04B24/383 ,  C04B24/2623 ,  C04B14/32 ,  C04B14/4687 ,  C04B24/38 ,  C04B12/04 ,  C04B41/4596 ,  C04B41/48 ,  C04B38/0006

摘要： A filter for purifying exhaust gas comprising an assembly of plural united ceramic members each having a plurality of through-holes arranged side by side along a longitudinal direction, in which end faces at either side of these through-holes are closed in a checkered pattern so as to have a reverse relation of open end close between gas inlet side and gas outlet side and adjacent through-holes are permeable to each other through porous partition walls, characterized in that each ceramic member has a prismatic shape, and the plural ceramic members are integrally adhered by interposing a sealing member.

摘要翻译： 一种排气净化用过滤器，其特征在于，具有多个由多个贯通孔沿着长度方向排列而成的贯通孔的组合而成的组合体，在贯通孔的两侧的端面以格子状封闭 在气体入口侧和气体出口侧之间具有开口端关闭的相反关系，并且相邻的通孔经由多孔隔壁彼此可渗透，其特征在于每个陶瓷构件具有棱柱形状，并且多个陶瓷构件是 通过插入密封件而整体粘附。

公开(公告)号：EP1122780A3

公开(公告)日：2004-01-02

申请号：EP01300797.6

申请日：2001-01-30

申请人： NGK INSULATORS, LTD.

发明人： Araki, Kiyoshi ,  Kida, Masahiro ,  Ishikawa, Takahiro ,  Bessyo, Yuki ,  Makino, Takuma

IPC分类号： H01L23/373

CPC分类号： H01L24/32 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/3873 ,  C04B2235/616 ,  C04B2235/6565 ,  C04B2235/9607 ,  C04B2237/064 ,  C04B2237/083 ,  C04B2237/121 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/56 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/72 ,  C23C4/02 ,  C23C4/08 ,  C23C6/00 ,  C23C24/10 ,  C23C24/106 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/473 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/351 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01022 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00015

摘要： The object is to provide a laminated radiation member and a power semiconductor apparatus in which no cracks occur due to thermal stress caused by cooling and thermal cycle and which are low in thermal resistance. This is attained by a laminated radiation member comprising a radiation plate, an insulation substrate bonded to the upper surface of the radiation plate and an electrode provided on the upper surface of the insulation substrate, which can be made by a method including a step of, if necessary, previously surface treating a bonding surface of the radiation plate and/or the insulation substrate to assure wettability with a hard solder or a metal, a step of interposing ceramic particles previously surface treated to assure wettability with a hard solder or a metal between the radiation plate and the insulation substrate, a step of disposing a hard solder above and/or below the ceramic particles, a step of heating the hard solder to a temperature higher than the melting point of the solder to melt the solder, a step of penetrating the molten hard solder into spaces between the ceramic particles to react the ceramic particles with the solder to produce a metal base composite material, and a step of bonding the radiation plate and the insulation substrate with the metal base composite material.

摘要翻译： 本发明的目的是提供一种层叠辐射构件和功率半导体装置，其中由于由冷却和热循环引起的热应力并且耐热性低而不会产生裂纹。 这是通过包括辐射板，粘合到辐射板的上表面的绝缘基板和设置在绝缘基板的上表面上的电极的层叠辐射构件来实现的，其可以通过包括以下步骤的方法制成： 如果需要，预先对辐射板和/或绝缘基板的接合表面进行表面处理，以确保用硬焊料或金属的润湿性;将预先表面处理的陶瓷颗粒插入以确保与硬焊料或金属之间的润湿性的步骤 辐射板和绝缘基板，在陶瓷颗粒上方和/或下方设置硬焊料的步骤，将硬焊料加热到高于焊料熔点的温度以熔化焊料的步骤， 将熔融的硬焊料穿透到陶瓷颗粒之间的空间中，以使陶瓷颗粒与焊料反应以产生金属基复合材料，以及a 用金属基复合材料接合辐射板和绝缘基板的步骤。