公开(公告)号：EP0865232B1

公开(公告)日：2003-08-27

申请号：EP98104452.2

申请日：1998-03-12

Applicant: HONEYWELL INC.

Inventor： Nichols, Randolph G.

IPC: H05K3/34 ,  H05K1/14

CPC classification number: H05K1/141 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/113 ,  H05K3/341 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/09781 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10992 ,  H05K2203/0415 ,  Y02P70/613

公开(公告)号：EP0822738B1

公开(公告)日：2003-04-23

申请号：EP97305034.7

申请日：1997-07-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Dockerty, Robert Charles ,  Fraga, Ronald Maurice ,  Ramirez, Ciro Neal ,  Ray, Sudipta Kumar ,  Robbins, Gordon Jay

IPC: H05K3/34 ,  H01L23/498

CPC classification number: H01L23/49811 ,  H01L2224/16 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/0465 ,  Y02P70/613

公开(公告)号：EP1205971A3

公开(公告)日：2003-01-02

申请号：EP01126395.1

申请日：2001-11-07

Applicant: Sharp Kabushiki Kaisha

Inventor： Yasuda, Masao ,  Sumikawa, Masato

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/10 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/013

Abstract: An electronic component having an electrode structure to increase an allowance positional deviation in a mounting process as well as a method and a structure for mounting a semiconductor device are provided. The semiconductor device (5) includes, on electrodes (4), connection materials (3, 9) connecting the semiconductor device (5) and a substrate (6). The connection materials include a composite connection material (9) formed of a core (1) and a conductor (2) covering the core, the core having an a low modulus of elasticity at room temperature smaller than that of the conductor at room temperature, and a single-layer connection material (3) formed of a conductor.

Abstract translation: 提供一种具有电极结构的电子部件，其具有用于增加安装过程中的容许位置偏差以及用于安装半导体器件的方法和结构。 半导体器件（5）在电极（4）上包括连接半导体器件（5）和衬底（6）的连接材料（3,9）。 连接材料包括由芯（1）和覆盖芯的导体（2）形成的复合连接材料（9），该芯在室温下的室温下的导电体的弹性模量低于室温下的低弹性模量， 和由导体形成的单层连接材料（3）。

公开(公告)号：EP1097478A2

公开(公告)日：2001-05-09

申请号：EP99947194.9

申请日：1999-07-06

Applicant: Infineon Technologies AG

Inventor： HACKE, Hans-Jürgen ,  GALUSCHKI, Klaus-Peter

IPC: H01L23/48 ,  H01L23/482 ,  H01L23/485 ,  H01L21/60 ,  H01L23/532 ,  H01L23/31

CPC classification number: H01L24/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49798 ,  Y10T156/1089 ,  H01L2924/00

Abstract: The invention relates to a semiconductor component in a chip format, comprising a chip with at least one first insulating layer (3) and electric contact surfaces (2) devoid of said insulating layer. Conductors (5) run from the electric contact surfaces (2) to the foot areas (10) of external connection elements (12) along the insulating layer (3). Another insulating layer (8) is also provided with through openings (9) leading from the outside to the foot areas (10) of the external connection elements (12). A conductive adhesive (11) is placed in said openings (9) and metallic globules (12) are placed at least on the outside thereon. The semiconductor element can also contain a solder paste instead of the conductive adhesive in the through openings (9), whereby the metallized synthetic globules are placed thereon. The invention also relates to a method for producing the semiconductor element thus described.

公开(公告)号：EP1009202A1

公开(公告)日：2000-06-14

申请号：EP98923088.3

申请日：1998-06-02

Applicant: IBIDEN CO., LTD.

Inventor： TSUKADA, Kiyotaka, Ibiden Co., Ltd., Gama Fact. ,  KOBAYASHI, Hiroyuki, Ibiden Co., Ltd., Gama Fact. ,  UKAI, Yoshikazu, Ibiden Co., Ltd., Gama Fact. ,  CHIHARA, Kenji, Ibiden Co., Ltd., Gama Fact. ,  TOHYAMA, Yoshihide, Ibiden Co., Ltd., Gama Fact, ,  OKUDA, Yasuyoshi, Ibiden Co., Ltd., Gama Fact. ,  KODERA, Yoshihiro, Ibiden Co., Ltd., Gama Fact.

IPC: H05K3/34

CPC classification number: H05K3/244 ,  B23K35/007 ,  B23K35/262 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T428/12028 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12875 ,  Y10T428/12903 ,  Y10T428/12944 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.

Abstract translation: 本发明涉及一种用于外部连接的焊接部件，其与形成在与导体图案对应的印刷电路板的表面上的连接端子接合，并且具有无电镀Ni / Au镀层，其中，焊料部件为包含 细铜粉，对连接端子具有优异的接合强度。

公开(公告)号：EP1008414A2

公开(公告)日：2000-06-14

申请号：EP99125772.6

申请日：1994-09-16

Applicant: International Business Machines Corporation

Inventor： Acocella, John ,  Banks, Donald Ray ,  Benenati, Joseph Angelo ,  Caulfield, Thomas ,  Corbin, John Saunders, Jr. ,  Hoebener, Karl Grant ,  Watson, David P.

IPC: B23K1/00

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/014

Abstract: High melting temperature Pb/Sn 95/5 solder balls (18) are connected to copper pads on the bottom of a ceramic chip carrier substrate (10) by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

公开(公告)号：EP0624053B1

公开(公告)日：1998-11-25

申请号：EP94105413.2

申请日：1994-04-07

Applicant: SONY CORPORATION

Inventor： Goodman,Thomas W. c/o Sony Corporation ,  Fujita, Hiroyuki, c/o Sony Corporation ,  Murakami, Yoshikazu, c/o Sony Corporation ,  Murphy, Arthur T.

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0126 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/044 ,  Y02P70/613 ,  Y10T29/49144

公开(公告)号：EP0804057A2

公开(公告)日：1997-10-29

申请号：EP97106928.1

申请日：1997-04-25

Applicant: NGK Spark Plug Co. Ltd.

Inventor： Yamasaki, Kozo, c/o NGK Spark Plug Co.,Ltd ,  Saiki, Hajime, c/o NGK Spark Plug Co.,Ltd

IPC: H05K3/34

CPC classification number: H01R43/0235 ,  H01R12/52 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/035 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  Y02P70/613

Abstract: A connecting board is provided for disposition between a base plate such a LGA base plate and a mounting board such as a printed circuit board. The connecting board has a substrate having a plurality of through holes. Each through hole extends between opposite first and second surfaces of the substrate. An easily deformable soft metal body is mounted in each through hole in such a way as to have protruded portions protruding from the first and second surfaces of the substrate. The protruded portions of the soft metal body are different in protruding height. The connecting board are connected at the protruded portions to the base plate and the mounting board. The heights of the protruded portions are set depending upon the materials and the coefficients of thermal expansion of the LGA base plate, printed circuit board and connecting board. By making the protruding heights of the protruded portions different from each other, the distance between the LGA base plate and the connecting board and the distance between the connecting board and the printed circuit board are set desiredly.

公开(公告)号：EP0757386A2

公开(公告)日：1997-02-05

申请号：EP96305563.7

申请日：1996-07-30

Applicant: International Business Machines Corporation

Inventor： Fallon, Kenneth Michael ,  Le Coz, Christian Robert ,  Pierson, Mark Vincent

IPC: H01L23/485 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L24/12 ,  B23K1/0016 ,  B23K2201/40 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/742 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05624 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2924/01004

Abstract: A substrate is provided with vias communicating with surface contacts or bumps. Joining material paste is forced through holes in a screen onto an area array of the contacts on the substrate then the screen is biased against the substrate as the paste is heated and cooled to transfer the joining material onto the contacts. Alternately, joining material paste is forced into the screen and then a substrate is placed onto the screen with an area array of bump contacts of the substrate in contact with the solder paste, and then the paste is heated and cooled to transfer the material onto the bumps. The joining material may be a solder paste, conductive adhesive paste, or transient liquid bond paste. The substrate may be a semiconductor chip substrate, flexible or rigid organic substrate, or a metal substrate coated to form a dielectric surface. Also, the substrate may be a computer chip, chip carrier substrate or a circuit board substrate. The process may be used to produce flip chips, ball grid array modules, column grid array modules, circuit boards, and attachment structures of the preceding components including information handling systems.

Abstract translation: 衬底设有与表面接触或凸起连通的通孔。 连接材料浆料被迫通过筛网中的孔到基板上的触点的区域阵列上，然后当膏被加热和冷却以将接合材料转移到触点上时，屏幕被偏压抵靠基板。 或者，将接合材料糊剂强制进入筛网，然后将基板放置在具有与焊膏接触的基板的凸起接触的区域阵列的屏幕上，然后将该浆料加热并冷却以将材料转移到 颠簸。 接合材料可以是焊膏，导电粘合剂糊或瞬态液体粘合膏。 衬底可以是半导体芯片衬底，柔性或刚性有机衬底或涂覆以形成电介质表面的金属衬底。 此外，基板可以是计算机芯片，芯片载体基板或电路板基板。 该方法可用于制造包括信息处理系统的前述组件的倒装芯片，球栅阵列模块，列网格阵列模块，电路板和附接结构。

公开(公告)号：EP0753990A1

公开(公告)日：1997-01-15

申请号：EP96401487.2

申请日：1996-07-05

Applicant: THOMSON-CSF

Inventor： Baumert, Eric ,  Chazelas, Jean

IPC: H05K3/34 ,  H01L21/60 ,  H01R9/09

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05611 ,  H01L2224/13 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13618 ,  H01L2224/13624 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R12/707 ,  H05K3/3436 ,  H05K2201/0308 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/01028 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: L'invention concerne un dispositif de connexion comportant un élément en matériau conducteur (2) à mémoire de forme comportant au moins partiellement, dans des zones destinées à être en contact avec des éléments à connecter, une surface présentant une bonne mouillabilité sur un matériau de brasure à base de plomb et/ou d'étain.
Applications : Connexion de circuits intégrés sous broche sur une plaque de circuits imprimés.

Abstract translation: 连接元件包括由形状保持材料制成的导电部件（2），其中两个区域旨在与待连接的两个元件接触。 该部件旨在通过使用在导电部件和上部部件（BGA）之间的焊接接头（1）和另一个焊接接头（2）之间将组件（BGA）的下表面与印刷电路（CI）连接 导电部件和印刷电路。 使用具有铅和锡的基底的焊料容易地润湿部件的表面。 组件可以是球形或圆柱形，典型尺寸为0.5mm。