公开(公告)号：EP2405726B1

公开(公告)日：2013-10-23

申请号：EP11173152.7

申请日：2011-07-07

Applicant: Kabushiki Kaisha Toshiba

Inventor： Kajio, Hiroshi

IPC: H05K3/36 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/429 ,  H05K1/0251 ,  H05K3/4611 ,  H05K2201/0347 ,  H05K2201/09845 ,  H05K2203/1476 ,  H05K2203/308

公开(公告)号：EP2367966B1

公开(公告)日：2013-07-31

申请号：EP09807487.5

申请日：2009-12-04

Applicant: Bundesdruckerei GmbH

Inventor： MUTH, Oliver ,  HAGEMANN, Michael ,  PAESCHKE, Manfred ,  FLEISCHER, Peter ,  WEFRINGHAUS, Eckhardt

IPC: C23C18/16 ,  C23C18/20 ,  C23C18/30 ,  C23C18/08 ,  C23C18/12 ,  H05K3/18 ,  H05K3/38 ,  H05K3/24

CPC classification number: C23C18/208 ,  C23C18/08 ,  C23C18/1208 ,  C23C18/1644 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/30 ,  H05K3/246 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0347 ,  H05K2203/0716 ,  H05K2203/072

公开(公告)号：EP2351472B1

公开(公告)日：2012-09-12

申请号：EP09744438.4

申请日：2009-10-28

Applicant: BAE Systems PLC

Inventor： SIDHU, Jagit

IPC: H05K3/24 ,  C25D5/04 ,  C25D5/02 ,  H05K3/18

CPC classification number: C25D5/04 ,  B33Y10/00 ,  B33Y30/00 ,  C25D5/02 ,  H05K3/1241 ,  H05K3/188 ,  H05K3/241 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0195 ,  H05K2203/092 ,  H05K2203/101

公开(公告)号：EP1878812B1

公开(公告)日：2012-08-29

申请号：EP06728896.9

申请日：2006-03-10

Applicant: Hitachi Chemical Company, Ltd.

Inventor： YAMASHITA, Tomoaki c/o Hitachi Chemical Co.Ltd. ,  INOUE, Yasuo c/o Hitachi Chemical Co.Ltd. ,  MATSUURA, Masaharu c/o Hitachi Chemical Co.Ltd. ,  ITO, Toyoki c/o Hitachi Chemical Co.Ltd. ,  SHIMIZU, Akira c/o Hitachi Chemical Co.Ltd. ,  INOUE, Fumio c/o Hitachi Chemical Co.Ltd. ,  NAKASO, Akishi c/o Hitachi Chemical Co.Ltd.

IPC: C23C22/78 ,  C23C22/63 ,  C23C22/83 ,  C23C30/00 ,  C23C28/00

CPC classification number: H05K3/385 ,  C23C8/02 ,  C23C8/40 ,  C23C22/63 ,  C23C28/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/384 ,  H05K3/389 ,  H05K3/4644 ,  H05K2201/0347 ,  H05K2201/0373 ,  H05K2203/0315 ,  H05K2203/1157 ,  Y10T428/12438 ,  Y10T428/12771 ,  Y10T428/12875 ,  Y10T428/12903 ,  Y10T428/12993 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP2073261B1

公开(公告)日：2012-06-27

申请号：EP07828463.5

申请日：2007-09-26

Applicant: Hitachi Metals, Ltd.

Inventor： TANIGUCHI, Fumitake

IPC: H05K3/24 ,  H01L23/12

CPC classification number: H05K3/244 ,  H01L23/15 ,  H01L23/3677 ,  H01L23/498 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/049 ,  Y10T428/12438 ,  Y10T428/12944 ,  Y10T428/24917 ,  Y10T428/31663 ,  H01L2924/00012 ,  H01L2924/2076 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: Disclosed is a ceramic substrate component having two or more external electrodes on its upper surface. Each of the external electrodes comprises a wire-bonding electrode to which a bonding wire is to be jointed. The wire-bonding electrode comprises an under layer mainly composed of Ag or Cu, a lower layer mainly composed of Ni, an intermediate layer mainly composed of a Pd-P alloy containing 0.4 to 5 mass% of P, and a top layer mainly composed of Au, formed on a ceramic substrate in this order, wherein the top layer contains Pd after a heat is applied during soldering. In the ceramic substrate component, the content of Au is 80 atm% or more relative to 100 atm% of the sum total of the contents of Au and Pd.

公开(公告)号：EP1932952A4

公开(公告)日：2012-01-18

申请号：EP06811016

申请日：2006-10-02

Applicant: UYEMURA C & CO LTD ,  UNIV OSAKA

Inventor： TSUJIMOTO MASANOBU ,  YANADA ISAMU ,  SUGANUMA KATSUAKI ,  KIM KEUNSOO

IPC: C25D5/10 ,  C25D5/02 ,  C25D7/00 ,  H01L23/50 ,  H01R13/03 ,  H05K3/24

CPC classification number: C25D5/10 ,  B32B15/01 ,  B32B15/018 ,  C22C13/00 ,  C22C13/02 ,  C25D5/02 ,  C25D7/00 ,  H01L2924/0002 ,  H01R13/03 ,  H05K3/244 ,  H05K2201/0347 ,  H05K2201/0769 ,  H01L2924/00

公开(公告)号：EP2107863B1

公开(公告)日：2011-06-22

申请号：EP09157079.6

申请日：2009-04-01

Applicant: Hitachi Metals, Ltd.

Inventor： Ikeda, Hatsuo ,  Ichikawa, Koji

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K1/113 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0347 ,  H05K2201/09745 ,  H01L2224/05599

公开(公告)号：EP2330872A1

公开(公告)日：2011-06-08

申请号：EP09014978.2

申请日：2009-12-03

Applicant: Chen, Yi-Chang

Inventor： Chen, Yi-Chang

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0204 ,  H05K1/053 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/244 ,  H05K3/28 ,  H05K3/385 ,  H05K3/44 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2203/0315 ,  H05K2203/049 ,  H05K2203/063 ,  H05K2203/072 ,  H05K2203/073

Abstract: A method for producing the LED substrate has steps of: providing a conductive metallic board (10), forming multiple grooves (11) in a top (12) of the conductive metallic board (10); protecting the conductive metallic board (10) from corrosion, forming an etched substrate (10a) with circuits and wires for plating on the conductive metallic board, electroless plating the etched substrate (10a) to form an electroless plated substrate (10b), plating an metal layer on the electroless plated substrate (10b), and coating solder mask (90) to obtain the LED substrate (10c). Because LED chips are mounted on the surfaces of the metal layer without insulating adhesive (30) below, heat from LED chips can be dissipated efficiently. The LED substrate (10c) of the present invention can be soldered directly onto a dissipation module to further enhance dissipation efficiency.

Abstract translation: 一种LED基板的制造方法，其特征在于，在导电性金属板（10）的顶部（12）上设置导电性金属板（10），形成多个槽（11）。 保护导电性金属板（10）免受腐蚀，在导电性金属板上形成用于电镀的电路和电线的蚀刻基板（10a），对蚀刻后的基板（10a）进行化学镀以形成化学镀基板（10b） 金属层，并且涂覆焊料掩模（90）以获得LED基板（10c）。 由于LED芯片安装在没有绝缘粘合剂（30）的金属层的表面上，所以可以有效地散发来自LED芯片的热量。 本发明的LED基板（10c）可直接焊接在散热模块上，以进一步提高散热效率。

公开(公告)号：EP1845762B1

公开(公告)日：2011-05-25

申请号：EP06712598.9

申请日：2006-01-30

Applicant: IBIDEN CO., LTD.

Inventor： WU, Youhong

IPC: H05K3/46 ,  H05K3/18

CPC classification number: H05K1/115 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/0352 ,  H05K2201/09454 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09627 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: [PROBLEMS] To provide a multilayer printed wiring board which does not deteriorate connection reliability by forming a filled via directly above a small-diameter filled via. [MEANS FOR SOLVING PROBLEMS] A stress applied on the filled via (60) formed on covering plating layers (36a, 36d) is larger than that applied on a filled via (160) formed on a second interlayer resin insulating layer (150) during a heat cycle. Thus, a bottom diameter (d1) of the filled via (60) is made larger than a bottom diameter (d2) of the filled via (160) formed directly above.

Abstract translation: 本发明提供一种多层印刷线路板，其通过在小直径填充通路正上方形成填充通路而不会使连接可靠性降低。 [解决问题的方法]施加在形成在覆盖镀层（36a，36d）上的填充通孔（60）上的应力大于施加在形成在第二层间树脂绝缘层（150）上的填充通孔（160） 一个热循环。 因此，填充通孔（60）的底部直径（d1）大于直接形成在上方的填充通孔（160）的底部直径（d2）。

公开(公告)号：EP1445795B1

公开(公告)日：2011-04-27

申请号：EP04001264.3

申请日：2004-01-21

Applicant: FRIWO Gerätebau GmbH

Inventor： Bothe, Michael ,  Mörbe, Stefan

IPC: H05K1/16 ,  H01L21/02

CPC classification number: H01L21/00 ,  H01L27/08 ,  H01L28/40 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/162 ,  H05K1/167 ,  H05K3/06 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0187 ,  H05K2201/0347 ,  H05K2201/09036 ,  H05K2201/09672 ,  H05K2201/09763 ,  H05K2203/0369 ,  H05K2203/063 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128