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    Original plate of metal printed circuit board, and method of manufacturing original plate
    96.
    发明专利
    Original plate of metal printed circuit board, and method of manufacturing original plate 有权
    金属印刷电路板原始印版及制作原版的方法

    公开(公告)号：JP2009253274A

    公开(公告)日：2009-10-29

    申请号：JP2009000848

    申请日：2009-01-06

    Applicant: Xi Max Co Ltd ,  ケイアイザャイマックス カンパニー リミテッド

    Inventor： KIM KAB SEOG ,  KIM YONG MO

    IPC: H05K3/44 ,  H01L23/12 ,  H05K1/09 ,  H05K3/14

    CPC classification number: H05K1/09 ,  H05K1/0306 ,  H05K3/16 ,  H05K3/388 ,  H05K3/4629 ,  H05K2201/0317 ,  H05K2201/0338

    Abstract: PROBLEM TO BE SOLVED: To provide an original plate of a metal printed circuit board which has superior heat dissipation characteristics and electric characteristics by forming an insulating layer and a thick electric conductive layer of high density on a metal board by a sputtering method for physical vapor deposition, and to provide a method of manufacturing the original plate.
    SOLUTION: The method of manufacturing the original plate includes a step of forming the insulating layer on the metal board by the sputtering method for physical vapor deposition, a step of vapor-depositing a first thin film made of a conductive metal and having compressive residual stress on the insulating layer by the sputtering method, a step of vapor-depositing a second thin film made of a conductive metal and having tensile residual stress on the first thin film by the sputtering method, and a step of repeating the steps of vapor-depositing the first thin film and second thin film to vapor-deposit the electric conductive layer of a thick film such that the total residual stress is controlled within a preset range.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：通过溅射法在金属板上形成绝缘层和高密度的厚导电层，提供具有优异的散热特性和电特性的金属印刷电路板的原版 用于物理气相沉积，并提供制造原版的方法。 解决方案：制造原版的方法包括通过用于物理气相沉积的溅射方法在金属板上形成绝缘层的步骤，气相沉积由导电金属制成的第一薄膜的步骤，并且具有 通过溅射法在绝缘层上的压缩残余应力，通过溅射法在第一薄膜上气相沉积由导电金属制成的第二薄膜并具有拉伸残余应力的步骤，以及重复步骤 气相沉积第一薄膜和第二薄膜以使厚膜的导电层气相沉积，使得总残余应力被控制在预设范围内。 版权所有（C）2010，JPO＆INPIT

    Wiring board, and manufacturing method thereof
    97.
    发明专利
    Wiring board, and manufacturing method thereof 有权
    接线板及其制造方法

    公开(公告)号：JP2009170849A

    公开(公告)日：2009-07-30

    申请号：JP2008010489

    申请日：2008-01-21

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： HARUHARA MASAHIRO ,  MURAYAMA HIROSHI ,  YAMANO KOJI

    IPC: H05K3/34 ,  H05K3/18 ,  H05K3/24

    CPC classification number: H05K3/4092 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81141 ,  H01L2924/01322 ,  H05K3/062 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0311 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/1059 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

    Abstract: PROBLEM TO BE SOLVED: To surely maintain a state of electric conduction to an electronic component to be mounted by effectively absorbing stress generated owing to a difference between a coefficient of thermal expansion of the electronic component to be mounted and that of a wiring board, and to contribute to cost reduction by substantially eliminating curvature of the wiring board after mounting. SOLUTION: The wiring board 10 has a cylindrical external connection terminal 20 to engage an electrode terminal 31 of the electronic component 30 to be mounted. The external connection terminal 20 has its part electrically connected to a pad portion 12P formed on an electronic component mounting surface side of the wiring board 10, and is curved in such a shape that when the electrode terminal 31 of the electronic component 30 is inserted, an outer peripheral surface of the electrode terminal comes into tight contact with an inner peripheral surface of its center portion. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：通过有效地吸收由于要安装的电子部件的热膨胀系数与布线的热膨胀系数之间的差异而产生的应力，可靠地保持要安装的电子部件的导电状态 并且通过在安装之后基本上消除布线板的曲率来有助于降低成本。 解决方案：布线板10具有圆筒形外部连接端子20，以与要安装的电子部件30的电极端子31接合。 外部连接端子20的一部分电连接到形成在布线板10的电子部件安装表面侧上的焊盘部分12P，并且弯曲成使得当电子部件30的电极端子31插入时， 电极端子的外周面与其中心部的内周面紧密接触。 版权所有（C）2009，JPO＆INPIT

    Method of forming wiring
    99.
    发明专利
    Method of forming wiring 审中-公开
    形成接线方法

    公开(公告)号：JP2007234889A

    公开(公告)日：2007-09-13

    申请号：JP2006055185

    申请日：2006-03-01

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： YAMANO KOJI

    IPC: H01L21/3205 ,  H05K3/18

    CPC classification number: H01L21/76879 ,  H01L21/2885 ,  H01L21/76873 ,  H01L2221/1089 ,  H05K3/048 ,  H05K3/108 ,  H05K3/388 ,  H05K2201/0338 ,  Y10T29/49156

    Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a wiring by which a productivity of the wiring can be improved while making it possible to thickly form a thickness of a detailed wiring in the method of forming the wiring using an electrolytic plating method. SOLUTION: The method of forming the wiring comprises the steps of: forming a resist film 19 for lift-off on an insulating layer 12 corresponding to a wiring formation region A, so as to expose the insulating layer 12 corresponding to a formation position of a first seed layer 14; forming a metallic film 21; forming first and second seed layers 14, 22 by removing the resist film 19 for lift-off; carrying out a deposit growth of a conductive metal 15 on the first seed layer 14 by the electrolytic plating method; and forming a wiring 13 consisting of the first seed layer 14 and the conductive metal 15 by removing the second seed layer 22. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种形成布线的方法，通过该布线可以提高布线的生产率，同时可以在使用电解电镀形成布线的方法中粗略地形成详细布线的厚度 方法。 解决方案：形成布线的方法包括以下步骤：在对应于布线形成区域A的绝缘层12上形成用于剥离的抗蚀剂膜19，以暴露对应于地层的绝缘层12 第一种子层14的位置; 形成金属膜21; 通过去除用于剥离的抗蚀剂膜19来形成第一种子层14和第二种子层22; 通过电镀法在第一种子层14上进行导电金属15的析出生长; 以及通过去除第二种子层22形成由第一种子层14和导电金属15组成的布线13.版权所有（C）2007，JPO＆INPIT

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