Patent search cpc:"H05K2201/0379" Page 2

11.

发明专利
Antenna sheet, a non-contact type ic with data carrier 有权

公开(公告)号：JP5605358B2

公开(公告)日：2014-10-15

申请号：JP2011511320

申请日：2010-04-28

Applicant: 凸版印刷株式会社

Inventor： 寛佳後藤

IPC: G06K19/077 , G06K19/07

CPC classification number: G06K19/07783 , G06K19/07754 , H05K3/4038 , H05K3/4084 , H05K2201/0129 , H05K2201/0355 , H05K2201/0379 , H05K2201/0382 , H05K2201/0394 , H05K2201/10098 , H05K2203/0195 , H05K2203/107 , Y10T29/49016 , Y10T29/49018

12.

发明专利
Connecting terminal, a semiconductor package, a wiring board, connector and a micro-contactor, 有权
Title translation: 空值

公开(公告)号：JP5313156B2

公开(公告)日：2013-10-09

申请号：JP2009538137

申请日：2008-10-16

Applicant: 日本発條株式会社

Inventor： 俊男風間 , 重樹石川

IPC: H01R13/24 , H01R33/76 , H05K1/02

CPC classification number: H05K3/326 , H01L23/49811 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/1461 , H01R12/714 , H01R13/2407 , H05K3/32 , H05K3/4015 , H05K3/4092 , H05K2201/0311 , H05K2201/0379 , H05K2201/0397 , H05K2201/1031 , H05K2201/10333 , H05K2201/1059 , H05K2201/10734 , Y02P70/611 , H01L2924/00 , H01L2224/05599

Abstract: A connecting terminal, a semiconductor package, a wiring board, a connector, and a microcontactor that can achieve a stable contact with a contact target are provided. To achieve the object and to establish an electrical connection to a contact target by making a physical contact with the contact target, there are provided a plurality of conductive terminal-forming members each having a terminal portion, which is extended in a band shape and at least a part of a surface of which forms a curved surface. Each terminal portion is configured so that a part of which is laminated on a part of at least one terminal portion in a thickness direction. All the terminal portions may be laminated at respective tip portions in the thickness direction.

Abstract translation: 提供了可以实现与接触目标的稳定接触的连接端子，半导体封装，布线板，连接器和微控制器。为了实现该目的并通过与接触目标物理接触来建立与接触靶的电连接，提供了多个导电端子形成部件，每个导体端子形成部件具有端部，该端子部分延伸成带状，其表面的至少一部分形成曲面。每个端子部分被构造为使得其一部分层压在厚度方向上的至少一个端子部分的一部分上。所有端子部分可以在厚度方向的各个尖端部分层叠。

13.

发明专利
Semiconductor device and method of manufacturing the same 有权
Title translation: 半导体器件及其制造方法

公开(公告)号：JP2011103441A

公开(公告)日：2011-05-26

申请号：JP2010190604

申请日：2010-08-27

Applicant: Fujitsu Ltd , 富士通株式会社

Inventor： MIZUTANI DAISUKE

IPC: H01L21/60 , H05K1/18 , H05K3/34

CPC classification number: H05K1/147 , H01L21/76898 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K1/0218 , H05K1/141 , H05K3/222 , H05K3/3436 , H05K3/363 , H05K2201/0379 , H05K2201/0715 , H05K2201/09063 , H05K2201/092 , H05K2201/10666 , H05K2201/10734 , H05K2203/167 , Y02P70/613 , H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing the same, which facilitate alignment between a semiconductor component and a circuit board. SOLUTION: The semiconductor device includes a first circuit base member 20 including a surface having multiple first electrodes 22 formed thereon, a second circuit base member 30 being provided above the first circuit base member 20 and having first through-holes 30a and second through-holes 30b formed respectively above the first electrodes 22, a semiconductor package 50 provided above the second circuit base member 30, and multiple first bumps 51 provided inside the first through-holes 30a and the second through-holes 30b to connect the first electrodes 22 to the semiconductor package 50. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题：提供一种半导体器件和电路板之间的对准的半导体器件及其制造方法。解决方案：半导体器件包括第一电路基底构件20，其包括形成有多个第一电极22的表面，第二电路基底构件30设置在第一电路基底构件20的上方，并具有第一通孔30a和第二通孔30a 设置在第一电极22上方的通孔30b，设置在第二电路基体30上方的半导体封装50以及设置在第一通孔30a和第二通孔30b内部的多个第一凸起51，以将第一电极（C）2011，JPO＆INPIT

14.

发明专利
接続端子、半導体パッケージ、配線基板、コネクタ、およびマイクロコンタクタ有权

公开(公告)号：JPWO2009051183A1

公开(公告)日：2011-03-03

申请号：JP2009538137

申请日：2008-10-16

Applicant: 日本発條株式会社

Inventor： 風間　俊男 , 俊男風間 , 重樹石川 , 重樹石川

IPC: H01R13/24 , H05K1/02

CPC classification number: H05K3/326 , H01L23/49811 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/1461 , H01R12/714 , H01R13/2407 , H05K3/32 , H05K3/4015 , H05K3/4092 , H05K2201/0311 , H05K2201/0379 , H05K2201/0397 , H05K2201/1031 , H05K2201/10333 , H05K2201/1059 , H05K2201/10734 , Y02P70/611 , H01L2924/00 , H01L2224/05599

Abstract: 接触対象との安定的な接触を実現することができる接続端子、半導体パッケージ、配線基板、コネクタ、およびマイクロコンタクタを提供する。この目的のため、接触対象と接触することによってその接触対象との電気的な接続を図るために、少なくとも一部の表面が曲面をなして帯状に延びる端子部を有する導電性の端子用部材を複数備え、端子部が、少なくとも一つの他の端子部と互いの一部が厚さ方向に積層するように構成する。全ての端子部の先端部を厚さ方向に積層してもよい。

15.

发明专利
Wiring circuit substrate 有权
Title translation: 接线电路

公开(公告)号：JP2007019261A

公开(公告)日：2007-01-25

申请号：JP2005199035

申请日：2005-07-07

Applicant: Nitto Denko Corp , 日東電工株式会社

Inventor： ISHII ATSUSHI , OWAKI YASUHITO , FUNADA YASUTO

IPC: H05K1/05 , G11B21/21 , H05K1/02

CPC classification number: H05K3/38 , H05K1/056 , H05K3/06 , H05K3/205 , H05K3/44 , H05K2201/0379 , H05K2201/0969 , H05K2201/09781 , H05K2201/2072 , H05K2203/0323

Abstract: PROBLEM TO BE SOLVED: To provide a wiring circuit substrate capable of preventing the separation of a metal support substrate by improving the adhesiveness of the metal support substrate with a simple configuration at the end rim of an opening formed on the metal support substrate. SOLUTION: In order to reduce the transmission loss of a conductor pattern 5 in a suspension substrate 1 with a circuit, a metal foil 6 buried in a base insulating layer 3 is formed as a pattern equipped with a first metal foil 9, and a second metal foil 10 surrounding the first metal foil 9 with a gap S1, while an opening unit 7 is formed on the metal support substrate 2 so that the opening end rim 8 thereof is arranged in the gap S1. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 解决的问题：提供一种能够通过在形成在金属支撑基板上的开口的端部边缘处以简单的配置改善金属支撑基板的粘合性来防止金属支撑基板分离的布线电路基板。解决方案：为了减少具有电路的悬挂基板1中的导体图案5的传输损耗，埋设在基底绝缘层3中的金属箔6形成为配备有第一金属箔9的图案，以及间隙S1围绕第一金属箔9的第二金属箔10，同时在金属支撑基板2上形成开口单元7，使其开口端边缘8布置在间隙S1中。版权所有（C）2007，JPO＆INPIT

16.

发明专利
Contact member and its production process 审中-公开
Title translation: 联系会员及其生产流程

公开(公告)号：JP2006229192A

公开(公告)日：2006-08-31

申请号：JP2005335666

申请日：2005-11-21

Applicant: Alps Electric Co Ltd , アルプス電気株式会社

Inventor： TAKAI DAISUKE , AIHARA MASAMI , TAKAHASHI KOICHI

IPC: H01L21/60 , G01R1/067

CPC classification number: H05K3/4092 , H01L21/563 , H01L23/49811 , H01L24/16 , H01L24/72 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/92 , H01L2224/13099 , H01L2224/2929 , H01L2224/293 , H01L2224/32014 , H01L2224/73203 , H01L2224/81136 , H01L2224/81192 , H01L2224/81801 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2224/83907 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H05K3/326 , H05K7/1069 , H05K2201/0379 , H05K2201/0397 , H01L2924/01024 , H01L2924/01042 , H01L2924/01028 , H01L2924/0104 , H01L2924/00014 , H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a contact member ensuring good conductive connection between an electronic component and a mother board even when the electronic component is shrunk, and to provide its fabrication process.
SOLUTION: Resilient arms 5b, 6b, 7b of contacts 5, 6, 7 can be deformed easily and surely utilizing internal stress. The resilient arm of the contact can be deformed easily and surely utilizing internal stress even if the contact is shrunk in accordance with shrinkage of an electronic component 2. Since the resilient arm deforms resiliently and appropriately and a plurality of stacked resilient arms can function as a resilient contact, distortion caused by difference in thermal expansion coefficient between the electronic component and the mother board 1 can be absorbed appropriately by the contact, and conductive connection between the electronic component 2 and the mother board can be ensured even if a plurality of resilient contacts cause a slight positional shift of the electronic component.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：即使当电子部件收缩时，也提供确保电子部件和母板之间的良好导电连接的接触部件，并提供其制造工艺。解决方案：触点5,6,7的弹性臂5b，6b，7b可以容易且可靠地利用内部应力而变形。即使根据电子部件2的收缩使触点收缩，接触件的弹性臂也可以容易且可靠地利用内部应力变形。由于弹性臂弹性变形并且多个叠置的弹性臂可以作为可以通过接触适当地吸收电子部件和母板1之间的热膨胀系数的差异引起的弹性接触，即使多个弹性接触，也能够确保电子部件2与母板之间的导电连接导致电子部件轻微的位置偏移。版权所有（C）2006，JPO＆NCIPI

17.

发明专利
Multilayer circuit and a method of manufacturing the same 审中-公开
Title translation: 空值

公开(公告)号：JP2005506713A

公开(公告)日：2005-03-03

申请号：JP2003539061

申请日：2002-10-23

Applicant: シャフナー・エーエムファウ・アクチェンゲゼルシャフト

Inventor： シッポラ・ミカ・マティ

IPC: H05K3/46 , H01F17/00 , H01F27/28 , H01F41/04 , H05K1/11 , H05K1/16 , H05K3/40

CPC classification number: H05K3/46 , H01F17/0013 , H01F27/2804 , H01F27/2847 , H01F41/041 , H01F2027/2861 , H05K1/118 , H05K1/165 , H05K3/4084 , H05K3/4092 , H05K2201/0379 , H05K2201/0394 , H05K2201/0397 , H05K2201/055

Abstract: 【課題】この発明は、多層構造の製造に関し、特に三次元構造の製造と、その電子部品基板および変成器と誘導器用巻線としての使用に関する。
【解決手段】互いに分離する導体層を、導体・絶縁体・導体の積層板の互いに連なる区域における反対の側面に互いに連ね、折り重ねた後に導体層を相互接続する個所から、絶縁体を除去し、導体・絶縁体・導体の積層板を折り重ねて、多層構造を製造することにより、広範囲の三次元多層構造を製造することができ、その際全体積に対する巻線が占める体積を最大化できる。これに代わって、この方法を用いて、部品を内部に埋め込んだ多層構造を製造することもできる。この方法により、柔軟な形で層間を接続することもできる。その他にも論点はあるが、この方法を容易に大量生産用に自動化することができる。

Abstract translation: 本发明涉及多层结构的制造，特别涉及三维结构的制造及其作为电子组装基板和用于变压器和电感器的绕组的用途。当通过折叠导体 - 绝缘体 - 导体层叠体来制造多层结构时，彼此分离的导体层在彼此相邻的部分中的导体 - 绝缘体 - 导体层叠体的相对侧彼此相对，并且其中绝缘体已经从折叠后导体层要连接在一起的地方去除，可以制造宽范围的三维多层结构，其中绕组占用的体积可以最大化。或者，通过使用该方法，也可以制造其中已经将部件埋入其中的多层结构。该方法还可以以灵活的方式在层之间进行连接。除了其他问题之外，该方法可以容易地自动化进行批量生产。