公开(公告)号：JP5154819B2

公开(公告)日：2013-02-27

申请号：JP2007097614

申请日：2007-04-03

Applicant: 新光電気工業株式会社

Inventor： 晶紀 白石 ,  啓 村山 ,  昌宏 春原 ,  直幸 小泉 ,  光敏 東

IPC: H01L23/04 ,  H01L23/12 ,  H01L33/22 ,  H01L33/62

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/16 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1147 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A substrate (101) includes a storage portion (101C) which is defined by a base for mounting a light emitting element (102) and a wall portion standing up on and from the base. A package (100) is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion (101C) is connected to a cover (103) to thereby seal a light emitting element. A seal structure (130; 330; 430) is composed of an uneven portion (140; 340) formed on the lower surface side surface of the base (101A), a close contact layer (150) formed on the surface of the uneven portion (140; 340), a power supply layer (160) formed on the close contact layer (150), and an electrode layer (170) formed on the surface of the power supply layer (160). The uneven portion(140; 340) includes a first recessed portion (180) formed at a position spaced in the radial direction from the outer periphery of a through electrode (107) or from the inner wall of a through hole (120), and a second recessed portion (190) formed at a position spaced further outwardly from the first recessed portion (180).

公开(公告)号：JP2013030807A

公开(公告)日：2013-02-07

申请号：JP2012235945

申请日：2012-10-25

Applicant: Samsung Electro-Mechanics Co Ltd ,  サムソン エレクトロ−メカニックス カンパニーリミテッド.

Inventor： MOK JEE SOO ,  YOO JE GWANG ,  RYU CHANG SUP

IPC: H01R12/50 ,  H05K3/46 ,  H01L23/12

CPC classification number: H05K3/4007 ,  H01R12/523 ,  H05K3/0017 ,  H05K3/207 ,  H05K3/4644 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2203/016 ,  H05K2203/1536

Abstract: PROBLEM TO BE SOLVED: To provide a multilayered printed circuit board and a method of manufacturing the same which can reduce thickness of the multilayered printed circuit board, shorten production processes thereof, and increase production efficiency.SOLUTION: A multilayered printed circuit board includes: a build-up layer (108) including a plurality of insulating layers and a plurality of circuit layers; an insulating resin layer (101) which includes bumps printed and is formed on the outermost circuit layer of one side of the build-up layer (108); and a solder resist layer (112) formed on the outermost layer of the other side of the build-up layer (108). The multilayered printed circuit board is manufactured by sequentially stacking the build-up layer (108) and the solder resist layer (112) on one side of the insulating resin layer (101), the other side of which is provided with the bumps printed.

Abstract translation: 解决的问题：提供一种可以减小多层印刷电路板的厚度的多层印刷电路板及其制造方法，缩短其制造工艺，提高生产效率。 解决方案：多层印刷电路板包括：包含多个绝缘层和多个电路层的堆积层（108）; 绝缘树脂层（101），其包括印刷并形成在所述堆积层（108）的一侧的最外侧电路层上的凸块; 以及形成在所述堆积层（108）的另一侧的最外层上的阻焊层（112）。 多层印刷电路板通过在绝缘树脂层（101）的一侧依次堆叠积层（108）和阻焊层（112），另一侧设置有凸块印刷而制造。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JPWO2011024790A1

公开(公告)日：2013-01-31

申请号：JP2011528791

申请日：2010-08-24

Applicant: 株式会社村田製作所

Inventor： 雅司 荒井 ,  雅司 荒井 ,  麻友子 西原 ,  麻友子 西原

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40

CPC classification number: H01L23/5389 ,  H01L23/49827 ,  H01L23/50 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2924/09701 ,  H05K1/186 ,  H05K3/4069 ,  H05K3/4652 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10636 ,  H05K2203/0191 ,  Y02P70/611 ,  Y10T29/4916

Abstract: 樹脂層から表面電極が剥離しにくい樹脂多層基板及び該樹脂多層基板の製造方法を提供する。樹脂多層基板1は、部品内蔵層(第1樹脂層)20と、部品内蔵層(第1樹脂層)20の一面に積層してある薄層樹脂層(第2樹脂層)30とを備える。薄層樹脂層30の、部品内蔵層20に積層されている面とは反対側の面に形成してある表面電極34と、部品内蔵層20に設けてあり、一端が部品内蔵層20の一面に至るビア導体(第1ビア導体)23と、薄層樹脂層30に設けてあり、一端が表面電極34と、他端がビア導体23とそれぞれ電気的に接続してあるビア導体(第2ビア導体)33とをさらに備える。ビア導体33と接する薄層樹脂層30の一部は、ビア導体23の内部へ突き出した形状35を形成している。

公开(公告)号：JP5117692B2

公开(公告)日：2013-01-16

申请号：JP2006194353

申请日：2006-07-14

Applicant: ルネサスエレクトロニクス株式会社 ,  日本電気株式会社

Inventor： 純 塚野 ,  健太 小川 ,  武彦 前田 ,  新太郎 山道 ,  克 菊池

IPC: H01L23/12 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H01L21/4846 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/09018 ,  H05K2201/09481 ,  H05K2201/09781 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via hole formed in the base insulating film, and a second interconnection provided on a bottom surface side of the base insulating film, the second interconnection being connected to the first interconnection via the via conductor. The wiring substrate includes divided-substrate-unit regions, in each of which the first interconnection, the via conductor, and the second interconnection are formed.

公开(公告)号：JP5006035B2

公开(公告)日：2012-08-22

申请号：JP2006519574

申请日：2005-05-23

Applicant: イビデン株式会社

Inventor： 幸信 三門 ,  博文 二村 ,  宗太郎 伊藤 ,  克雄 川口

IPC: H05K3/46 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/117 ,  H05K3/244 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/09063 ,  H05K2201/09481 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2203/063 ,  Y10T29/49126

公开(公告)号：JP5000540B2

公开(公告)日：2012-08-15

申请号：JP2008020598

申请日：2008-01-31

Applicant: 新光電気工業株式会社

Inventor： 昌宏 春原 ,  啓 村山

IPC: H05K1/02 ,  H01H37/52

CPC classification number: H01H37/52 ,  H01H11/00 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K1/16 ,  H05K3/4092 ,  H05K3/4602 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/09481 ,  H05K2201/10053 ,  H05K2203/308

公开(公告)号：JP4951153B2

公开(公告)日：2012-06-13

申请号：JP2011521866

申请日：2010-06-15

Applicant: シャープ株式会社

Inventor： 泰守 黒水

IPC: F21S2/00 ,  F21V19/00 ,  F21V23/00 ,  F21Y101/02 ,  G02F1/1333 ,  G02F1/13357

CPC classification number: G02F1/133603 ,  G02F2001/133612 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: The present invention aims at providing a lighting device configured to suppress uneven brightness, and a display device or a television receiver which includes the lighting device. The lighting device of the present invention includes a plurality of LEDs 16, an LED board 17S, a chassis 14, a connecting component 60, and a reflection sheet 21. The LEDs 16 are mounted on the LED board 17S. Both of the LED boards 17S and 17C are attached to the chassis 14. The connecting component 60 electrically connect the LED boards 17S and 17C to each other. The reflection sheet 21 is overlaid on light source mounted surfaces 17A. In the lighting device, the connecting component 60 is arranged on a connecting component attached surface 17B of the LED board 17S. The connecting component attached surface 17B is opposite to the surface on which the reflection sheet 21 is overlaid.

公开(公告)号：JP2012023858A

公开(公告)日：2012-02-02

申请号：JP2010159736

申请日：2010-07-14

Applicant: Jtekt Corp ,  株式会社ジェイテクト

Inventor： WAKITA YASUYUKI

IPC: H02K11/00 ,  B62D5/04 ,  H05K7/14 ,  H05K7/20

CPC classification number: H05K1/0206 ,  B62D5/0406 ,  H05K1/113 ,  H05K3/0061 ,  H05K2201/09481 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: PROBLEM TO BE SOLVED: To provide a controller which can ensure a larger space for mounting electric elements while minimizing increase in size.SOLUTION: A circuit board unit 61 of an ECU12 includes a top face 61a on which a semiconductor element 77 is mounted, an undersurface 61b opposed to the top face 61a, and a notch 91 formed under the top face 61a. A power supply module 62 includes a conductive projection piece 101 inserted into the notch 91 in order to support the circuit board unit 61 and connected electrically with the semiconductor element 77, and an insulating main body 65 which holds the projection piece 101.

Abstract translation: 要解决的问题：提供一种控制器，其可以确保用于安装电气元件的更大空间，同时最小化尺寸增加。 解决方案：ECU12的电路板单元61包括其上安装有半导体元件77的顶面61a，与顶面61a相对的下表面61b和形成在顶面61a下方的凹口91。 电源模块62包括插入到凹口91中以便支撑电路板单元61并与半导体元件77电连接的导电突起片101和保持突起片101的绝缘主体65。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP4793447B2

公开(公告)日：2011-10-12

申请号：JP2008534799

申请日：2008-03-25

Applicant: 株式会社村田製作所

Inventor： 安隆 杉本

IPC: H05K3/46

CPC classification number: H05K1/111 ,  C03C14/004 ,  H05K1/0306 ,  H05K3/285 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/017 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/099 ,  Y02P70/611 ,  Y10T428/24917 ,  Y10T428/24926

公开(公告)号：JP4790558B2

公开(公告)日：2011-10-12

申请号：JP2006271036

申请日：2006-10-02

Applicant: 日東電工株式会社

Inventor： ブーンイー ホー ,  ジョン マッカスリン マーティン ,  博司 山崎 ,  思漢 胡

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0221 ,  H05K1/117 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2203/0733