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    Multilayer board
    32.
    发明专利
    Multilayer board 有权

    公开(公告)号：JP5354018B2

    公开(公告)日：2013-11-27

    申请号：JP2011526723

    申请日：2010-08-05

    Applicant: 株式会社村田製作所

    Inventor： 登 加藤 ,  純 佐々木 ,  聡 石野

    IPC: H05K3/46 ,  H05K1/02

    CPC classification number: H05K1/0281 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/09 ,  H05K2201/0141 ,  H05K2201/057 ,  H05K2201/0715 ,  H05K2201/09018 ,  H05K2201/09409

    Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.

    Package for mounting light emitting element, light emitting element package, and manufacturing methods of package for mounting light emitting element and light emitting element package
    33.
    发明专利
    Package for mounting light emitting element, light emitting element package, and manufacturing methods of package for mounting light emitting element and light emitting element package 审中-公开
    安装发光元件，发光元件包装和安装发光元件和发光元件包装件的制造方法的包装

    公开(公告)号：JP2013149947A

    公开(公告)日：2013-08-01

    申请号：JP2012238318

    申请日：2012-10-29

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： DENDA TATSUAKI ,  KOBAYASHI KAZUKI

    IPC: H01L33/62

    CPC classification number: H01L33/60 ,  H01L21/50 ,  H01L2224/16245 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/0265 ,  H05K1/0274 ,  H05K1/111 ,  H05K2201/09409 ,  H05K2201/098 ,  H05K2201/099 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00012

    Abstract: PROBLEM TO BE SOLVED: To provide a package for mounting a light emitting element which is excellent in heat radiation performance and easily deals with a narrow pitch light emitting element, a light emitting element package where the multiple light emitting elements are mounted on the package for mounting the light emitting element, and manufacturing methods of the package for mounting the light emitting element and the light emitting element package.SOLUTION: A package for mounting a light emitting element includes: a light emitting element mounting part where multiple pieces of wiring are disposed at predetermined intervals; and an insulation layer where the light emitting element mounting part is provided. An upper surface of the light emitting element mounting part is exposed from the insulation layer, and a lower surface is embedded in the insulation layer. Cutout parts are respectively formed at the lower sides of facing side edge parts of the wiring located adjacent to each other.

    Abstract translation: 要解决的问题：为了提供一种用于安装散热性能优异且容易处理窄间距发光元件的发光元件的封装，其中多个发光元件安装在封装上的发光元件封装 安装发光元件，以及用于安装发光元件和发光元件封装的封装的制造方法。解决方案：用于安装发光元件的封装包括：发光元件安装部，其中布置有多条布线 以预定间隔; 以及设置有发光元件安装部的绝缘层。 发光元件安装部的上表面从绝缘层露出，下表面嵌入绝缘层。 切割部分分别形成在彼此相邻的布线的相对侧边缘部分的下侧。

    Wiring board, electronic device using the same and incorrect connection detector therefor
    39.
    发明专利
    Wiring board, electronic device using the same and incorrect connection detector therefor 审中-公开
    接线板，使用其的电子设备及其不正确的连接检测器

    公开(公告)号：JP2009224564A

    公开(公告)日：2009-10-01

    申请号：JP2008067530

    申请日：2008-03-17

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： SHIROMIZU TAKAHISA ,  SOEDA YOSHINOBU ,  INOUE MASAOMI

    IPC: H05K1/11 ,  G01R31/04 ,  H05K1/14

    CPC classification number: H05K1/117 ,  H05K1/0268 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/10189 ,  H05K2203/168 ,  H05K2203/173

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring board detecting the incomplete connection of an electrode of the wiring board to the connector terminal and detecting a connection failure, when the wiring board is inserted into the connector, and to provide an electronic device using the same and an incorrect connection detector therefor.
    SOLUTION: The wiring board has a terminal section, and a wiring section connected to the terminal section, and the terminal section is configured so as to have a plurality of long connection terminals placed at predetermined intervals along a direction orthogonal to a direction in which the wiring board is to be inserted, and short connection terminals arranged between adjacent long connection terminals so as to be located behind the respective long connection terminals with respect to the direction of insertion. At least one adjacent pair consisting of a long connection terminal and a short connection terminal is short-circuited, and the length of the thus-short-circuited short connection terminal is made shorter than non-short-circuit short connection terminals.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种布线板，其检测布线板的电极到连接器端子的不完全连接并检测连接故障，当布线板插入连接器中并提供电子装置 使用相同的和不正确的连接检测器。 解决方案：布线板具有端子部分和连接到端子部分的布线部分，并且端子部分被构造成具有沿着与方向正交的方向以预定间隔放置的多个长连接端子 其中布线板将被插入，并且短连接端子布置在相邻的长连接端子之间，以便相对于插入方向位于相应的长连接端子的后面。 由长连接端子和短连接端子构成的至少一个相邻的一对短路，使短路短路连接端子的长度短于非短路短路连接端子。 版权所有（C）2010，JPO＆INPIT

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