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    Inverter apparatus
    31.
    发明专利
    Inverter apparatus 有权
    逆变器装置

    公开(公告)号：JP2010074935A

    公开(公告)日：2010-04-02

    申请号：JP2008239038

    申请日：2008-09-18

    Applicant: Mitsubishi Heavy Ind Ltd ,  三菱重工業株式会社

    Inventor： TEJIMA KAZUNORI ,  TOYAMA KOJI ,  NAKANO KOUJI ,  SATO HIDETAKA

    IPC: H02M7/48 ,  H01L25/07 ,  H01L25/18

    CPC classification number: H05K7/1432 ,  H05K1/144 ,  H05K3/284 ,  H05K5/064 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1476

    Abstract: PROBLEM TO BE SOLVED: To provide a small inverter apparatus having durability against use accompanying by long term vibration.
    SOLUTION: A power substrate 20 is arranged at a base of a box-like module case 11, and a control substrate 30 becomes a lid of an opening part of the module case 11. Thus, the inverter apparatus 10 can be lowered since it is modularized. In the inverter apparatus 10, a capacitor 22 is installed between the power substrate 20 and the control substrate 30. A resin mold layer 12 covers the capacitor 22 and the capacitor 22 is fixed into the module case 11. Since the capacitor 22 is fixed into the module case 11 by the resin mold layer 12, durability against vibration is higher compared to conventional screwing.
    COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供具有长期振动伴随使用的耐久性的小型逆变器装置。 解决方案：电源基板20布置在盒状模块壳体11的基部，控制基板30成为模块壳体11的开口部分的盖子。因此，可以降低逆变器装置10 因为它是模块化的。 在逆变器装置10中，电容器22安装在电源基板20和控制基板30之间。树脂模制层12覆盖电容器22，电容器22固定在模块壳体11中。由于电容器22固定 通过树脂模制层12的模块壳体11，与传统的螺纹连接相比，抗振动的耐久性更高。 版权所有（C）2010，JPO＆INPIT

    Wiring board
    34.
    发明专利
    Wiring board 审中-公开
    接线板

    公开(公告)号：JP2009224617A

    公开(公告)日：2009-10-01

    申请号：JP2008068533

    申请日：2008-03-17

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： KATAGIRI FUMIMASA ,  TOKUTAKE YASUE ,  KOIZUMI NAOYUKI ,  SUGANUMA SHIGEAKI ,  HORIUCHI MICHIO

    IPC: H01L23/12 ,  H01L23/14

    CPC classification number: H01L23/49833 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/111 ,  H05K3/103 ,  H05K3/222 ,  H05K2201/09418 ,  H05K2201/09709 ,  H05K2201/10287 ,  H05K2201/10674 ,  H01L2224/05599

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring board which includes pads electrically connected to chip connecting pads through conductive wires, the wiring board being reduced in size in a surface direction of the wiring board by efficiently arranging the pads electrically connected to the chip connecting pads. SOLUTION: The wiring board includes a resin member 12 formed in a plate shape, chip connecting pads 13 each having a connection surface electrically connected to the electrode pads provided to a semiconductor chip and incorporated in the resin member 12, pads 14 incorporated in the resin member 12 at a part positioned outside a formation region of the chip connecting pads 13, routing wiring 17 connected to the pads 14, and the conductive wire sealed with the resin member 12 and electrically connecting the chip connecting pads 13 and the pads 14 to each other, the pads 14 being disposed on a plurality of straight lines B 1 parallel to a first direction. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种布线板，其包括通过导线与芯片连接焊盘电连接的焊盘，布线板通过有效地布置电连接到布线板的焊盘而在布线板的表面方向上减小尺寸 芯片连接垫。 解决方案：布线板包括形成为板状的树脂构件12，芯片连接焊盘13，每个芯片连接焊盘13具有电连接到设置在半导体芯片上的电极焊盘的连接表面，并且结合到树脂构件12中，焊盘14被结合 在位于芯片连接焊盘13的形成区域外侧的部分的树脂部件12中，与焊盘14连接的布线布线17以及用树脂部件12密封的导线，并且将芯片连接焊盘13和焊盘 14彼此之间，焊盘14设置在与第一方向平行的多条直线B 1上。 版权所有（C）2010，JPO＆INPIT

    Speaker device and television
    35.
    发明专利
    Speaker device and television 审中-公开
    扬声器设备和电视

    公开(公告)号：JP2009177439A

    公开(公告)日：2009-08-06

    申请号：JP2008013238

    申请日：2008-01-24

    Applicant: Funai Electric Co Ltd ,  船井電機株式会社

    Inventor： YAMAKAMI SUSUMU

    IPC: H04R1/06 ,  H04N5/64 ,  H04R9/02 ,  H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/141 ,  H04N5/642 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10083 ,  H05K2201/10287

    Abstract: PROBLEM TO BE SOLVED: To obtain a speaker device that achieves improvement in connection workability between an input terminal part and a connection means and improvement in versatility by commonalization of the connection means, and a television.
    SOLUTION: A relay printed circuit board 8 includes a board body 81, a pair of terminal holes 82a, 82b drilled at the right and the left of the board body 81 and to which input terminals 6a, 6b are partially fitted by insertion, each terminal land 83a, 83b formed around each of the terminal holes 82a, 82b, each land lead 85a, 85b for a lead that is connected with each lead 71a, 71b, and a cutting part 86 for making the board body 81 laterally separable. When partially fitting the input terminals 6a, 6b to the terminal holes 82a, 82b by insertion and if a pitch L1 between the input terminals 6a, 6b and a pitch L2 between the terminal holes 82a, 82b are different from each other, and consequently, the input terminals 6a, 6b cannot be fitted to the terminal holes by insertion, the board body 81 is separated by the cutting part 86.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 解决的问题：获得实现输入端子部分和连接装置之间的连接可操作性的改进的扬声器装置，并且通过连接装置和电视机的普通化来提高多功能性。 解决方案：继电器印刷电路板8包括板主体81，在板主体81的右侧和左侧钻出的一对端子孔82a，82b，并且输入端子6a，6b通过插入部分地装配到该主体 形成在每个端子孔82a，82b周围的每个端子脊83a，83b，用于与每个引线71a，71b连接的引线的每个引导线85a，85b和用于使板体81横向分离的切割部86 。 当通过插入将输入端子6a，6b部分地装配到端子孔82a，82b上，并且如果输入端子6a，6b之间的间距L1和端子孔82a，82b之间的间距L2彼此不同， 输入端子6a，6b不能通过插入装配到端子孔，板体81被切割部分86分开。版权所有（C）2009，JPO＆INPIT

    Joining method for electrode core wire, and electronic unit constituted by joining electrode core wires
    39.
    发明专利
    Joining method for electrode core wire, and electronic unit constituted by joining electrode core wires 有权
    电极芯线的接合方法和电极芯线组成的电子单元

    公开(公告)号：JP2009004464A

    公开(公告)日：2009-01-08

    申请号：JP2007162072

    申请日：2007-06-20

    Applicant: Panasonic Corp ,  パナソニック株式会社

    Inventor： SAKAI TADAHIKO

    IPC: H05K3/34 ,  B23K1/00 ,  B23K3/04 ,  B23K101/38 ,  B23K101/42

    CPC classification number: H05K3/323 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45565 ,  H01L2224/4847 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H05K3/3405 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/0278 ,  H05K2203/0425 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01006

    Abstract: PROBLEM TO BE SOLVED: To provide a joining method for an electrode core wire in which an operation time can be shortened and joining strength can be improved, and an electronic unit constituted by joining the electrode core wires. SOLUTION: After thermosetting resin 8a containing solder particles 7a is supplied onto a substrate 2 so as to cover a plurality of electrodes 3, respective core wires 6 and electrodes are disposed above the substrate 2 vertically opposite each other, and a sheet member 11 is disposed above the core wires 6. Then the respective core wires 6 and thermosetting resin 8a are pressed and heated by a heat pressing tool 12 from above the sheet member 11 with the sheet member 11 interposed to thermally cure the thermosetting resin 8a and also fuse the solder particles 7a contained in the thermosetting resin 8a. Then the heat pressing tool 12 is put away from a heat cured body 8 of the thermosetting resin 8a, the electrodes 4 and core wires 6 are joined together with solder melts 7 formed by solidifying the melts (solder melts 7b) of the solder particles 7a, and the sheet member 11 is released from the heat cured body 8 lastly. COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 解决的问题：提供一种可以缩短操作时间并且可以提高接合强度的电极芯线的接合方法，以及通过连接电极芯线构成的电子单元。 解决方案：将含有焊料颗粒7a的热固性树脂8a以覆盖多个电极3的方式供应到基板2上，将相应的芯线6和电极设置在基板2上方相互相对的上方， 然后，将芯线6和热固化性树脂8a从板状部件11的上方按压加热，并将片状部件11插入，使热固性树脂8a热固化 熔化包含在热固性树脂8a中的焊料颗粒7a。 然后将热压工具12从热固性树脂8a的热固化体8放出，电极4和芯线6通过固化焊料颗粒7a的熔体（焊料熔融物7b）而形成的焊料熔融物7接合在一起 最后将片状部件11从热固化体8释放出来。 版权所有（C）2009，JPO＆INPIT

    Motor
    40.
    发明专利
    Motor 审中-公开
    发动机

    公开(公告)号：JP2008220068A

    公开(公告)日：2008-09-18

    申请号：JP2007054961

    申请日：2007-03-06

    Applicant: Matsushita Electric Ind Co Ltd ,  松下電器産業株式会社

    Inventor： HINO TOSHIFUMI ,  SATO NOBUHIKO

    IPC: H02K3/52 ,  H02K3/50 ,  H02K5/22

    CPC classification number: H05K3/445 ,  H02K3/522 ,  H02K5/225 ,  H02K11/33 ,  H05K3/0061 ,  H05K3/306 ,  H05K3/3421 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/0949 ,  H05K2201/10287

    Abstract: PROBLEM TO BE SOLVED: To provide a motor in which a lead wire can be fixed with an adhesive, in a state where the lead wire does not contact the wall face of a hole of a base, and the adhesive can be prevented from flowing out of the hole, and moreover the lead wire of a coil can properly pass through each hole of an insulating sheet, the base and a wiring board. SOLUTION: A plurality of notched lines 13b, 14b which are radially notched with lead wire draw-out holes 13a, 14a as centers are formed at least at either of the insulating sheet 13 and the wiring board 14. Accordingly, even if the ends of the lead wire 7a abut on outer sides of the lead wire draw-out holes 13a, 14a, the abutting place or the vicinity of the place is expanded in a valve shape along the notched lines 13b, 14b from the lead wire draw-out holes 13a, 14a and are tilted so as to lead the ends of the lead wire 7a to sides of the lead wire draw-out holes 13a, 14a, and thus the ends of the lead wire 7a are guided and led into the lead wire draw-out holes. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种电动机，其中引线可以用粘合剂固定，在引线不接触基座的孔的壁面的状态下，并且可以防止粘合剂 从孔流出，线圈的引线可以适当地穿过绝缘片，基座和布线板的每个孔。 解决方案：至少在绝缘片13和布线板14中的任一个处形成有以引线引出孔13a，14a为中心径向切口的多个切口线13b，14b。因此，即使 引线7a的端部与引线引出孔13a，14a的外侧邻接，该位置的邻接位置或附近沿着切口线13b，14b从引线拉伸以阀形状扩大 - 出孔13a，14a并且被倾斜以将引线7a的端部引导到引线引出孔13a，14a的侧面，因此引线7a的端部被引导并引导到引线 拉丝孔。 版权所有（C）2008，JPO＆INPIT

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