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公开(公告)号：JPWO2014181883A1
公开(公告)日：2017-02-23
申请号：JP2015515915
申请日：2014-05-09
申请人： 富士電機株式会社
CPC分类号： H01L24/29 , B23K1/00 , B23K1/0008 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K1/19 , B23K1/203 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , B23K2201/42 , B23K2203/56 , C22C13/02 , H01L21/52 , H01L23/051 , H01L24/32 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2224/29111 , H01L2224/2932 , H01L2224/32225 , H01L2224/32501 , H01L2224/45124 , H01L2224/73265 , H01L2224/83447 , H01L2224/83815 , H01L2924/351 , H01L2924/00014 , H01L2924/20107 , H01L2924/00 , H01L2924/01047 , H01L2924/01051 , H01L2924/01029 , H01L2924/01013 , H01L2924/01049 , H01L2924/01028 , H01L2924/01083 , H01L2924/01027 , H01L2924/01032 , H01L2924/01014 , H01L2924/01005 , H01L2924/01034 , H01L2924/01015 , H01L2924/0103 , H01L2924/01025 , H01L2924/01026 , H01L2924/01024 , H01L2924/01012 , H01L2924/01046 , H01L2924/01038 , H01L2924/01052 , H01L2924/013
摘要： はんだ接合層は、マトリクスに分散した第1結晶部(21)同士の結晶粒界に微細粒状の複数の第2結晶部(22)が析出した構造を有する。第1結晶部(21)は、錫とアンチモンとを所定の割合で含む複数のSn結晶粒である。第2結晶部(22)は、Sn原子に対してAg原子を所定の割合で含む第1部分、または、Sn原子に対してCu原子を所定の割合で含む第2部分、もしくはその両方で構成される。また、はんだ接合層は、Sn原子に対してSb原子を所定の割合で含む結晶粒である第3結晶部(23)を有しても良い。これにより、低融点でのはんだ接合を可能とし、実質的に均一な金属組織を有し、信頼性の高いはんだ接合層を形成することができる。
摘要翻译： 焊料接合层具有第一晶体部分（21）分散在基体（22）中沉淀结构之间的多个细粒状的第二晶体部分晶界。 第一晶体部分（21）是由多个含有锡和锑中的预定比率的Sn晶粒。 第二晶体部分（22）具有含有以预定比例的Ag原子相对于Sn原子或以规定的比例含有铜原子的第二部分相对于Sn原子的第一部分或由两者的， 是的。 此外，焊料结合层，所述第三可具有结晶部（23）是含有Sb的原子在相对于Sn原子的预定比率的晶粒。 因此，允许在低的熔点的焊料接头，它具有基本上均匀的金属结构，它能够形成可靠的钎焊接合部的层。
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公开(公告)号：JPWO2012121292A1
公开(公告)日：2014-07-17
申请号：JP2013503580
申请日：2012-03-07
申请人： 日立化成株式会社
CPC分类号： B65H75/14 , B65H26/066 , C09J7/22 , C09J2203/326 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/27436 , H01L2224/2929 , H01L2224/29311 , H01L2224/2932 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29384 , H01L2224/29386 , H01L2224/2939 , H01L2224/294 , H01L2224/32225 , H01L2224/73104 , H01L2224/81903 , H01L2224/83191 , H01L2224/83203 , H01L2224/83851 , H01L2224/83862 , H01L2224/9211 , H01L2924/15788 , H01L2924/00014 , H01L2924/00012 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： 接着剤リール(10)は、巻芯(1)と、巻芯(1)上に巻かれた異方導電テープ(5A)とを有する。異方導電テープ(5A)は、テープ状の基材(6)と、その一方面上に形成された接着剤層(8)とを有する。接着剤層(8)の表面には、接着剤層(8)と異なる色のエンドマーク(18)が設けられる。巻芯(1)と基材(6)とは、エンドテープ(12)で接続される。カバーテープ(14)は、基材(6)のうち接着剤層(8)が形成されていない領域(5b)を覆う。カバーテープ(14)及びエンドマーク(18)には、基材(6)の背面(6c)との摩擦を大きくするために、滑り止め加工が施される。この摩擦は、巻芯(1)上に巻かれた異方導電テープ(5A)同士の間の滑りを抑制する。
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公开(公告)号：JP2012089847A
公开(公告)日：2012-05-10
申请号：JP2011229921
申请日：2011-10-19
发明人： KIM WON-KUN
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/585 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/26122 , H01L2224/26152 , H01L2224/29083 , H01L2224/291 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/2932 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/83851 , H01L2224/83862 , H01L2224/83888 , H01L2224/83986 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package and a method of manufacturing the same.SOLUTION: At least one of a substrate insulation layer and a chip insulation layer includes a dummy opening. During a self-assembly solder bonding process for flip chip bonding, dummy solder is formed by filling the dummy opening with solder particles which do not become an inner solder ball connecting a substrate connection terminal to a chip connection terminal, and remains on a peripheral region. Therefore, problems such as electrical short circuit and leakage current by remaining solder particles can be solved, so that a reliable semiconductor package can be provided. Since the dummy opening is formed to expose a predetermined portion of a circuit pattern, which is a signal transmission path, a dummy metal pattern does not need to be formed purposely, and a signal wiring design of a circuit board does not need to be changed.
摘要翻译： 要解决的问题：提供一种半导体封装及其制造方法。 解决方案：衬底绝缘层和芯片绝缘层中的至少一个包括虚拟开口。 在用于倒装芯片接合的自组装焊接工艺期间，通过用不连接衬底连接端子的芯片连接端子不成为内部焊球的焊料颗粒填充虚拟开口来形成虚拟焊料，并且保留在外围区域 。 因此，可以解决诸如剩余焊料颗粒的电短路和漏电流的问题，从而可以提供可靠的半导体封装。 由于形成虚拟开口以暴露作为信号传输路径的电路图案的预定部分，因此不需要有意地形成虚设金属图案，并且不需要改变电路板的信号布线设计 。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP6128211B2
公开(公告)日：2017-05-17
申请号：JP2015515915
申请日：2014-05-09
申请人： 富士電機株式会社
IPC分类号： B23K1/00 , B23K101/40 , H01L21/52
CPC分类号： H01L24/29 , B23K1/00 , B23K1/0008 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K1/19 , B23K1/203 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/262 , C22C13/02 , H01L21/52 , H01L24/32 , H01L24/83 , B23K2201/42 , B23K2203/56 , H01L2224/29111 , H01L2224/2932 , H01L2224/32225 , H01L2224/32501 , H01L2224/45124 , H01L2224/73265 , H01L2224/83447 , H01L2224/83815 , H01L23/051 , H01L24/45 , H01L24/73 , H01L2924/351
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公开(公告)号：JPWO2015053193A1
公开(公告)日：2017-03-09
申请号：JP2015512823
申请日：2014-10-03
申请人： 古河電気工業株式会社
IPC分类号： H01L21/52
CPC分类号： H01L24/83 , B22F7/004 , H01L21/4846 , H01L21/4871 , H01L23/142 , H01L23/3735 , H01L23/49866 , H01L24/29 , H01L24/32 , H01L24/75 , H01L2224/04026 , H01L2224/05155 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05669 , H01L2224/29294 , H01L2224/29311 , H01L2224/2932 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/29387 , H01L2224/32227 , H01L2224/32245 , H01L2224/75101 , H01L2224/75102 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/75986 , H01L2224/83075 , H01L2224/8309 , H01L2224/83192 , H01L2224/83203 , H01L2224/83385 , H01L2224/83439 , H01L2224/83447 , H01L2224/8384 , H01L2224/83948 , H01L2924/0544 , H01L2924/15787 , H01L2924/351 , H01L2924/3512 , H01L2924/35121 , H01L2924/00 , H01L2924/00014 , H01L2924/0541 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/05432 , H01L2924/054 , H01L2924/01028 , H01L2924/01069 , H01L2924/0105 , H01L2924/053 , H01L2924/01051 , H01L2924/01046 , H01L2924/01022 , H01L2924/00012
摘要： 金属部材と金属多孔質体との接合部でのクラック発生を防止して、信頼性の高い接合を実現することができる接合構造を提供すること。本発明の接合構造は、金属部材1と、該金属部材1上に形成された金属多孔質体2とを有する。金属部材1は、一方の主面1aを含み金属多孔質体2側に形成された外部層1bと、外部層1bよりも厚み方向において金属多孔質体2から離れた位置に形成された内部層1cとを有し、外部層1bの平均結晶粒径dsが、内部層1cの平均結晶粒径diよりも小さく、金属多孔質体2の平均結晶粒径dpが、外部層1bの平均結晶粒径dsよりも小さい又は同じである。
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公开(公告)号：JP5614440B2
公开(公告)日：2014-10-29
申请号：JP2012236903
申请日：2012-10-26
申请人： 日立化成株式会社
CPC分类号： H05K1/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/16225 , H01L2224/2929 , H01L2224/29311 , H01L2224/2932 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29384 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29393 , H01L2224/29411 , H01L2224/2942 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29469 , H01L2224/29484 , H01L2224/29493 , H01L2224/73204 , H01L2224/81203 , H01L2224/81345 , H01L2224/81409 , H01L2224/83192 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/3511 , H05K1/0306 , H05K3/323 , H05K3/3436 , H01L2924/00
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公开(公告)号：JP2013110404A
公开(公告)日：2013-06-06
申请号：JP2012236903
申请日：2012-10-26
申请人： Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： SATO KAZUYA
CPC分类号： H05K1/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/13144 , H01L2224/16225 , H01L2224/2929 , H01L2224/29311 , H01L2224/2932 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29384 , H01L2224/29387 , H01L2224/29388 , H01L2224/2939 , H01L2224/29393 , H01L2224/29411 , H01L2224/2942 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29469 , H01L2224/29484 , H01L2224/29493 , H01L2224/73204 , H01L2224/81203 , H01L2224/81345 , H01L2224/81409 , H01L2224/83192 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/3511 , H05K1/0306 , H05K3/323 , H05K3/3436 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit component capable of connecting a substrate and an IC chip well, and to provide a manufacturing method therefor.SOLUTION: In a circuit component 1 obtained by connecting an IC chip 4 to a glass substrate 31 by means of a conductive adhesive 5 containing conductive particles, a bump electrode 42 and a non-electrode surface 43 excepting the part where the bump electrode 42 is formed are provided on the mounting surface 41 of the IC chip 4. In such a circuit component 1, conductive particles in a first state of coming into contact with both the surface of the glass substrate 31 and the non-electrode surface 43 are placed between the surface of the glass substrate 31 and the non-electrode surface 43. Furthermore, conductive particles biting into the bump electrode 42 in a second state flatter than the first state are placed between the surface of the glass substrate 31 and the bump electrode 42.
摘要翻译： 要解决的问题：提供能够良好地连接基板和IC芯片的电路部件，并提供其制造方法。 解决方案：在通过包含导电颗粒的导电粘合剂5将IC芯片4连接到玻璃基板31而获得的电路部件1中，凸块电极42和非电极表面43，除了凸块 电极42形成在IC芯片4的安装面41上。在这样的电路部件1中，与玻璃基板31的表面和非电极面43接触的第一状态的导电粒子 放置在玻璃基板31的表面和非电极表面43之间。此外，以比第一状态更平坦的第二状态咬入凸块电极42的导电颗粒被放置在玻璃基板31的表面和凸块之间 电极42.版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2014179419A
公开(公告)日：2014-09-25
申请号：JP2013051679
申请日：2013-03-14
申请人： Alpha- Design Kk , アルファーデザイン株式会社 , Tadatomo Suga , 唯知 須賀 , Masataka Mizukoshi , 正孝 水越
CPC分类号： H05K3/32 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/50 , H01L2224/29006 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29318 , H01L2224/2932 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32013 , H01L2224/75281 , H01L2224/75315 , H01L2224/75317 , H01L2224/7598 , H01L2224/83001 , H01L2224/83192 , H01L2224/83203 , H01L2224/83205 , H01L2224/83409 , H01L2224/83411 , H01L2224/83413 , H01L2224/83418 , H01L2224/8342 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8382 , H01L2224/8384 , H01L2924/12041 , H05K13/046 , H05K2203/0173 , H05K2203/0278 , H05K2203/1131 , H01L2924/00 , H01L2924/00014 , H01L2924/00015
摘要： PROBLEM TO BE SOLVED: To secure a good bonding state between an electronic component and an electrode terminal, to improve productivity, and to downsize a substrate.SOLUTION: A method for bonding an electronic component comprises steps of: applying a metal fine powder paste 4 to each of a plurality of electrodes 2 provided on a substrate 1 (application step); mounting each of a plurality of electronic components 5 having different heights on the plurality of electrodes (component mounting step); mounting an organic film 6 on the plurality of electronic components; uniforming the height of the organic film by applying a first pressure to the electronic component side by a pressing member 58 (organic film pressurizing step); and bonding each electrode terminal of the plurality of electronic components to each electrode of the substrate by applying a second pressure to the electronic component side by a pressurizing member 58 and by sintering the metal fine powder paste by heating the electronic component side for a prescribed time (bonding step).
摘要翻译： 要解决的问题：确保电子部件和电极端子之间的良好的接合状态，以提高生产率和减小基板的尺寸。解决方案：一种用于接合电子部件的方法包括以下步骤：将金属细粉末膏4 到设置在基板1上的多个电极2的各个（涂敷工序）。 在多个电极上安装具有不同高度的多个电子部件5中的每一个（部件安装步骤）; 将有机膜6安装在所述多个电子部件上; 通过按压部件58向电子部件侧施加第一压力使有机膜的高度均匀化（有机膜加压工序）; 并且通过加压构件58向电子部件侧施加第二压力并且通过将电子部件侧加热规定时间来烧结金属细粉末糊料，将多个电子部件的各电极端子接合到基板的各个电极 （接合工序）。
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公开(公告)号：JPWO2011114751A1
公开(公告)日：2013-06-27
申请号：JP2011535810
申请日：2011-03-18
申请人： 古河電気工業株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05166 , H01L2224/05644 , H01L2224/1132 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13294 , H01L2224/13305 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13316 , H01L2224/13317 , H01L2224/13318 , H01L2224/1332 , H01L2224/13323 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13349 , H01L2224/13355 , H01L2224/13357 , H01L2224/13364 , H01L2224/13366 , H01L2224/13369 , H01L2224/1601 , H01L2224/16227 , H01L2224/16245 , H01L2224/2732 , H01L2224/2747 , H01L2224/29294 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/29317 , H01L2224/29318 , H01L2224/2932 , H01L2224/29323 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29349 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/3201 , H01L2224/32227 , H01L2224/32245 , H01L2224/81075 , H01L2224/81125 , H01L2224/81127 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/8184 , H01L2224/83075 , H01L2224/83125 , H01L2224/83127 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83447 , H01L2224/8384 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： 熱サイクル特性に優れる金属多孔質体からなる導電性バンプ、導電性ダイボンド部等の導電接続部材を提供する。半導体素子の電極端子又は回路基板の電極端子の接合面に形成された導電接続部材であって、該導電接続部材が平均一次粒子径10〜500nmの金属微粒子(P)と、有機溶剤(S)、又は有機溶剤(S)及び有機バインダー(R)からなる有機分散媒(D)とを含む導電性ペーストを加熱処理して金属微粒子同士が結合して形成された金属多孔質体であり、該金属多孔質体の空隙率が5〜35体積%であり、該金属多孔質体を構成している金属微粒子の平均粒子径が10〜500nmの範囲であり、かつ該金属微粒子間に存在する平均空孔径が1〜200nmの範囲である、ことを特徴とする導電接続部材。
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10.发明专利
公开(公告)号：JP5158904B2
公开(公告)日：2013-03-06
申请号：JP2011535810
申请日：2011-03-18
申请人： 古河電気工業株式会社
IPC分类号： H01L21/60
CPC分类号： H01L24/13 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05166 , H01L2224/05644 , H01L2224/1132 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13294 , H01L2224/13305 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13316 , H01L2224/13317 , H01L2224/13318 , H01L2224/1332 , H01L2224/13323 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13349 , H01L2224/13355 , H01L2224/13357 , H01L2224/13364 , H01L2224/13366 , H01L2224/13369 , H01L2224/1601 , H01L2224/16227 , H01L2224/16245 , H01L2224/2732 , H01L2224/2747 , H01L2224/29294 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/29317 , H01L2224/29318 , H01L2224/2932 , H01L2224/29323 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29349 , H01L2224/29355 , H01L2224/29357 , H01L2224/29364 , H01L2224/29366 , H01L2224/29369 , H01L2224/3201 , H01L2224/32227 , H01L2224/32245 , H01L2224/81075 , H01L2224/81125 , H01L2224/81127 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81447 , H01L2224/8184 , H01L2224/83075 , H01L2224/83125 , H01L2224/83127 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83447 , H01L2224/8384 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01021 , H01L2924/01022 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15787 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A conductive connecting member formed on a bonded face of an electrode terminal of a semiconductor or an electrode terminal of a circuit board, the conductive connecting member comprising a porous body formed in such manner that a conductive paste containing metal fine particles (P) having mean primary particle diameter from 10 to 500 nm and an organic solvent (S), or a conductive paste containing the metal fine particles (P) and an organic dispersion medium (D) comprising the organic solvent (S) and an organic binder (R) is heating-treated so as for the metal fine particles (P) to be bonded, the porous body being formed by bonded metal fine particles (P) having mean primary particle diameter from 10 to 500 nm, a porosity thereof being from 5 to 35 volume%, and mean pore diameter being from 1 to 200 nm.
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搜索结果
10 条记录 (耗时 0.017 秒)
