公开(公告)号：US20120213917A1

公开(公告)日：2012-08-23

申请号：US13365365

申请日：2012-02-03

Applicant: Christoph SIMONS ,  Martin SCHLOTT ,  Josef HEINDEL ,  Christoph STAHR

Inventor： Christoph SIMONS ,  Martin SCHLOTT ,  Josef HEINDEL ,  Christoph STAHR

IPC: B05D5/12 ,  B32B3/26 ,  B05D1/02

CPC classification number: C23C14/3414 ,  C22C28/00 ,  C23C4/08 ,  C23C4/123 ,  C23C14/3407 ,  H01J37/342 ,  H01J37/3426 ,  Y02E10/541 ,  Y10T428/12396

Abstract: A tube-shaped sputtering target is provided having a carrier tube and an indium-based sputtering material arranged on the carrier tube. The sputtering material has a microstructure having a mean grain size of less than 1 mm, measured as the mean diameter of the grains on the sputtering-roughened surface of the sputtering material.

Abstract translation: 提供了一种管状溅射靶，其具有布置在载体管上的载体管和铟基溅射材料。 溅射材料具有平均粒径小于1mm的微结构，作为溅射材料的溅射粗糙化表面上的晶粒的平均直径测量。

公开(公告)号：US20090183987A1

公开(公告)日：2009-07-23

申请号：US12302302

申请日：2007-06-06

Applicant: Martin Weigert ,  Christoph Simons ,  Eckehard Männle

Inventor： Martin Weigert ,  Christoph Simons ,  Eckehard Männle

IPC: C23C14/34 ,  C23C4/10

CPC classification number: C23C14/3414 ,  C04B35/46 ,  C04B35/462 ,  C04B35/495 ,  C04B35/62695 ,  C04B2235/3232 ,  C04B2235/3251 ,  C04B2235/3286 ,  C04B2235/786

Abstract: A sputter target is provided having a sputter material based on TiO2 and made such that the sputter material contains 15-60 mol. % Nb2O5. A method for the production of the sputter target includes the following steps: mixing of TiO2 and Nb2O5 powder in a liquid slurry; spray granulating this slurry to form TiO2:Nb2O5 mixed oxide granulate; and plasma spraying this granulate onto a sputter target base body.

Abstract translation: 提供溅射靶，其具有基于TiO 2的溅射材料，并使溅射材料含有15-60mol。 ％Nb2O5。 制备溅射靶的方法包括以下步骤：将TiO 2和Nb 2 O 5粉末混合在液体浆料中; 将该浆料喷雾造粒形成TiO 2 :Nb 2 O 5混合氧化物颗粒; 并将该颗粒等离子体喷涂到溅射靶基体上。

公开(公告)号：US06242106B1

公开(公告)日：2001-06-05

申请号：US09305767

申请日：1999-05-05

Applicant: Günter Herklotz ,  Lutz Schräpler ,  Christoph Simons ,  Jürgen Reuel ,  Y. C. Cho

Inventor： Günter Herklotz ,  Lutz Schräpler ,  Christoph Simons ,  Jürgen Reuel ,  Y. C. Cho

IPC: C22C502

CPC classification number: H01L24/45 ,  H01L24/43 ,  H01L2224/4321 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01063 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01105 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/30107 ,  Y10T428/12431 ,  H01L2924/01046 ,  H01L2924/01201 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01026 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01062 ,  H01L2924/01064 ,  H01L2924/01065 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01069 ,  H01L2924/0107 ,  H01L2924/01071 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00013

Abstract: A fine wire made of an alloy of gold which contains 0.6 to 2 weight % of nickel, or an alloy of gold which contains 0.1 to 2 weight % of nickel, 0.0001 to 0.1 weight % of alkaline earth metal and/or rare earth metal, and optionally 0.1 to 1.0 weight % of platinum and/or palladium . The fine wire is distinguished by a favorable electrical conductivity and a good ratio of strength to elongation. The fine wire is suitable both for wire bonding of semiconductor devices and for producing the ball bumps of flip-chips.

Abstract translation: 由含有0.6〜2重量％镍的金合金或含有0.1〜2重量％的镍的合金，0.0001〜0.1重量％的碱土金属和/或稀土金属制成的细线， 和任选的0.1至1.0重量％的铂和/或钯。 细线通过有利的导电性和良好的强度与伸长率的区别。 细线适用于半导体器件的引线接合和用于制造倒装芯片的球凸块。

公开(公告)号：US20090250337A1

公开(公告)日：2009-10-08

申请号：US11721677

申请日：2005-12-07

Applicant: Christoph Simons ,  Martin Schlott ,  Markus Schultheis ,  Martin Weigert ,  Lars Gusseck

Inventor： Christoph Simons ,  Martin Schlott ,  Markus Schultheis ,  Martin Weigert ,  Lars Gusseck

IPC: C23C14/34

CPC classification number: C23C14/3414 ,  H01J37/3435

Abstract: A tubular target is provided having a cylindrical carrier tube, at least one target tube arranged on its exterior surface, and a connecting layer arranged between the target tube and the carrier tube. The connecting layer is electrically conductive and has a wetting degree of >90%.

Abstract translation: 提供了一种管状靶，其具有圆柱形载体管，在其外表面上布置有至少一个靶管，以及布置在靶管和载体管之间的连接层。 连接层是导电的，并且具有> 90％的润湿度。

公开(公告)号：US07431808B2

公开(公告)日：2008-10-07

申请号：US10223531

申请日：2002-08-19

Applicant: Markus Schultheis ,  Christoph Simons ,  Martin Weigert

Inventor： Markus Schultheis ,  Christoph Simons ,  Martin Weigert

IPC: C23C14/35 ,  B28B1/00 ,  B22F1/00 ,  C04B35/00

CPC classification number: C23C14/3414 ,  Y02T50/67

Abstract: An electrically conductive titanium dioxide sputter target with an electrical resistivity of less than 5 Ω-cm, which contains as an additive at least one doping agent or a mixture of doping agents in an amount of less than 5 mole %. The doping agent or agents are selected from the group including indium oxide, zinc oxide, bismuth oxide, aluminum oxide, gallium oxide, antimony oxide, and zirconium oxide. This treatment renders the titanium dioxide sputter target suitable for use in a direct-current sputtering process without any negative effects on the properties of the coating.

Abstract translation: 导电二氧化钛溅射靶，其电阻率小于5欧姆 - 厘米，其中含有少于5摩尔％的至少一种掺杂剂或掺杂剂的混合物作为添加剂。 掺杂剂或试剂选自氧化铟，氧化锌，氧化铋，氧化铝，氧化镓，氧化锑和氧化锆。 该处理使二氧化钛溅射靶适用于直流溅射工艺，而对涂层的性能没有任何负面影响。

公开(公告)号：US20100038240A1

公开(公告)日：2010-02-18

申请号：US11993686

申请日：2006-06-13

Applicant: Christoph Simons ,  Martin Schlott ,  Peter Preissler ,  Josef Heindel Josef Heindel

Inventor： Christoph Simons ,  Martin Schlott ,  Peter Preissler ,  Josef Heindel Josef Heindel

IPC: C09J9/02 ,  B32B27/20 ,  C23C14/34 ,  H01B1/02

CPC classification number: C09J9/02 ,  C08L63/00 ,  C09J11/04 ,  C23C14/3407 ,  H01J37/3435 ,  H05K3/321 ,  Y10T442/2738

Abstract: An adhesive is provided, in particular for the adhesion of conductive materials, having at least one binder component and fillers, wherein the fillers contain fibers or a fiber-powder mixture and the fibers and/or powder contain an electrically conductive material. Further, an assembly is provided made of a sputtering target material and a carrier material with an adhesive.

Abstract translation: 提供粘合剂，特别是用于具有至少一种粘合剂组分和填料的导电材料的粘附，其中填料含有纤维或纤维粉末混合物，并且纤维和/或粉末含有导电材料。 此外，由溅射靶材料和具有粘合剂的载体材料制成组件。

公开(公告)号：US20070259191A1

公开(公告)日：2007-11-08

申请号：US11758153

申请日：2007-06-05

Applicant: Christoph SIMONS ,  Martin WEIGERT

Inventor： Christoph SIMONS ,  Martin WEIGERT

IPC: B32B15/00 ,  C23C14/00

CPC classification number: C03C17/36 ,  C03C17/3644 ,  C03C17/3681 ,  C22C5/06 ,  C23C14/185 ,  C23C14/3414

Abstract: A sputter target is provided having a sputter material made of a silver alloy comprising silver and at least one further element selected from the group of Mg, Ca, Co, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, and Lu. The at least one further element is present in the alloy in a proportion of >50 at. ppm, respectively, and a total proportion of the group of

Abstract translation: 提供溅射靶，其具有由银合金制成的溅射材料，所述溅射材料包含银和至少一种选自Mg，Ca，Co，Sc，Y，La，Ce，Pr，Nd，Sm，Eu，Gd ，Th，Dy，Ho，Er，Tm，Yb和Lu。 所述至少一种其它元素以≥50英寸的比例存在于合金中。 ppm，并且组的总比例<5。 ％。 溅射靶可用于制造具有绝热层的玻璃基板。

公开(公告)号：US6103025A

公开(公告)日：2000-08-15

申请号：US110905

申请日：1998-07-06

Applicant: Gunther Herklotz ,  Jurgen Reuel ,  Lutz Schrapler ,  Christoph Simons

Inventor： Gunther Herklotz ,  Jurgen Reuel ,  Lutz Schrapler ,  Christoph Simons

IPC: C22F1/00 ,  C22C5/02 ,  C22F1/14 ,  H01L21/60 ,  H01L23/485 ,  H01L23/49 ,  C22C5/00

CPC classification number: H01L24/10 ,  C22C5/02 ,  H01L24/13 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/4321 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/0106 ,  H01L2924/01063 ,  H01L2924/01066 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/3025

Abstract: Fine wires of a gold alloy of 0.05 to 0.95 wt % platinum, palladium or a mixture thereof; 0.001 to 0.1 wt % mischmetal containing at least 50 wt. % of cerium; and 0 to 0.1 wt % of alkaline earth metal. The wire has a favorable strength-to-elongation ratio and is suitable both for wire bonding and for making the ball bumps of flip chips.

Abstract translation: 0.05〜0.95重量％的铂，钯或其混合物的金合金细线; 0.001至0.1wt％含有至少50wt。 ％的铈; 和0〜0.1重量％的碱土金属。 线材具有有利的强度与伸长率，并且适用于引线接合和用于制造倒装芯片的球凸块。

公开(公告)号：US20060151320A1

公开(公告)日：2006-07-13

申请号：US11293544

申请日：2005-12-02

Applicant: Martin Weigert ,  Markus Schultheis ,  Martin Schlott ,  Christoph Simons

Inventor： Martin Weigert ,  Markus Schultheis ,  Martin Schlott ,  Christoph Simons

IPC: C23C14/00

CPC classification number: H01J37/3435 ,  C23C14/3407

Abstract: A tubular sputtering target with a target body and with an attachment device arranged at at least one end of the target body. The attachment device and/or an end cover are joined with the target body by material joining or positive locking.

Abstract translation: 具有目标体的管状溅射靶，并且具有布置在靶体的至少一端的附接装置。 附接装置和/或端盖通过材料接合或正锁定与目标主体接合。

公开(公告)号：US09334564B2

公开(公告)日：2016-05-10

申请号：US13365365

申请日：2012-02-03

Applicant: Christoph Simons ,  Martin Schlott ,  Josef Heindel ,  Christoph Stahr

Inventor： Christoph Simons ,  Martin Schlott ,  Josef Heindel ,  Christoph Stahr

IPC: C23C14/34 ,  C22C28/00 ,  H01J37/34

CPC classification number: C23C14/3414 ,  C22C28/00 ,  C23C4/08 ,  C23C4/123 ,  C23C14/3407 ,  H01J37/342 ,  H01J37/3426 ,  Y02E10/541 ,  Y10T428/12396

Abstract: A tube-shaped sputtering target is provided having a carrier tube and an indium-based sputtering material arranged on the carrier tube. The sputtering material has a microstructure having a mean grain size of less than 1 mm, measured as the mean diameter of the grains on the sputtering-roughened surface of the sputtering material.

Abstract translation: 提供了一种管状溅射靶，其具有布置在载体管上的载体管和铟基溅射材料。 溅射材料具有平均粒径小于1mm的微结构，作为溅射材料的溅射粗糙化表面上的晶粒的平均直径测量。