公开(公告)号：US20060075434A1

公开(公告)日：2006-04-06

申请号：US11165156

申请日：2005-06-23

申请人： John Chaney ,  Bill Beyers ,  Michael Johnson ,  James Hailey ,  Kevin Bridgewater ,  Michael Deiss ,  Raymond Horton

发明人： John Chaney ,  Bill Beyers ,  Michael Johnson ,  James Hailey ,  Kevin Bridgewater ,  Michael Deiss ,  Raymond Horton

IPC分类号： H04N5/445 ,  G06F13/00 ,  G06F3/00

CPC分类号： H04N21/435 ,  H04N5/4401 ,  H04N5/44543 ,  H04N21/235 ,  H04N21/23614 ,  H04N21/26283 ,  H04N21/4348 ,  H04N21/482 ,  H04N21/4821 ,  H04N21/84

摘要： A television system for receiving a plurality of digitally-encoded television programs includes circuitry for selecting a particular digital data transmission channel from a plurality of digital data transmission channels containing a desired digitally-encoded television program in response to a control signal, at least one of the data transmission channels also including television program schedule data. The system also includes user-operable data entry circuitry for entering data, and a controller for generating the above-noted control signal in response to user-entered data. The controller selects a virtual channel from a plurality of virtual channels in response to user-entered data, each virtual channel being subject to reassignment to a different one of said a plurality of digital data transmission channels, the television program schedule data defining the relationship of each of the television programs to respective ones of the plurality of digital data transmission channels.

摘要翻译： 一种用于接收多个数字编码的电视节目的电视系统，包括用于响应于控制信号从包含期望的数字编码的电视节目的多个数字数据传输信道中选择特定数字数据传输信道的电路，至少一个 数据传输通道还包括电视节目安排数据。 该系统还包括用于输入数据的用户可操作的数据输入电路和用于响应于用户输入的数据产生上述控制信号的控制器。 控制器响应于用户输入的数据从多个虚拟通道中选择虚拟通道，每个虚拟通道被重新分配到所述多个数字数据传输通道中的不同的一个，电视节目安排数据定义了 每个电视节目分配给多个数字数据传输信道中的相应的数字数据传输信道。

公开(公告)号：US20050121768A1

公开(公告)日：2005-06-09

申请号：US10729254

申请日：2003-12-05

申请人： Daniel Edelstein ,  Paul Andry ,  Leena Buchwalter ,  Jon Casey ,  Sherif Goma ,  Raymond Horton ,  Gareth Hougham ,  Michael Lane ,  Xiao Liu ,  Chirag Patel ,  Edmund Sprogis ,  Michelle Steen ,  Brian Sundlof ,  Cornelia Tsang ,  George Walker

发明人： Daniel Edelstein ,  Paul Andry ,  Leena Buchwalter ,  Jon Casey ,  Sherif Goma ,  Raymond Horton ,  Gareth Hougham ,  Michael Lane ,  Xiao Liu ,  Chirag Patel ,  Edmund Sprogis ,  Michelle Steen ,  Brian Sundlof ,  Cornelia Tsang ,  George Walker

IPC分类号： H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/48 ,  H01L21/4763

CPC分类号： H01L23/49883 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.

摘要翻译： 一种载体结构和方法，用于制造具有通孔的载流子结构，每个导通孔具有导电结构，其有效热膨胀系数小于或接近于基板的热膨胀系数，并且具有小于或等于 或者与衬底的密切匹配。 导电结构可以包括同心的通孔填充区域，其具有同心设置的不同材料，由导电材料的环形环包围的衬底材料的芯，由导电材料的环形环包围的CTE匹配的非导电材料的芯， 具有低CTE的内部空隙的导电通孔，或已经烧结或熔合的诸如金属 - 陶瓷浆料的导电复合材料的完整填充物。

公开(公告)号：US20080067628A1

公开(公告)日：2008-03-20

申请号：US11930698

申请日：2007-10-31

申请人： Raymond Horton ,  John Knickerbocker ,  Edmund Sprogis ,  Cornelia Tsang

发明人： Raymond Horton ,  John Knickerbocker ,  Edmund Sprogis ,  Cornelia Tsang

IPC分类号： H01L29/00

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15311

摘要： Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or mote vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated

摘要翻译： 提供电子器件制造技术。 一方面，提供一种电子设备。 该电子设备包括具有一个或多个微通孔和集成在其中的多个去耦电容器的至少一个插入器结构，所述至少一个插入器结构被配置为允许选择性地去激活多个去耦电容器中的一个或多个。 在另一方面，一种制造电子器件的方法，包括至少一个具有一个或多个通孔的内插器结构和集成在其中的多个去耦电容器，其包括以下步骤。 选择性地去激活多个去耦电容器中的一个或多个

公开(公告)号：US20060027934A1

公开(公告)日：2006-02-09

申请号：US11242221

申请日：2005-10-03

申请人： Daniel Edelstein ,  Paul Andry ,  Leena Buchwalter ,  Jon Casey ,  Sherif Goma ,  Raymond Horton ,  Gareth Hougham ,  Michael Lane ,  Xiao Liu ,  Chirag Patel ,  Edmund Sprogis ,  Michelle Steen ,  Brian Sundlof ,  Cornelia Tsang ,  George Walker ,  Yu-Ting Cheng ,  Kenneth Ocheltree ,  Robert Montoye

发明人： Daniel Edelstein ,  Paul Andry ,  Leena Buchwalter ,  Jon Casey ,  Sherif Goma ,  Raymond Horton ,  Gareth Hougham ,  Michael Lane ,  Xiao Liu ,  Chirag Patel ,  Edmund Sprogis ,  Michelle Steen ,  Brian Sundlof ,  Cornelia Tsang ,  George Walker ,  Yu-Ting Cheng ,  Kenneth Ocheltree ,  Robert Montoye

IPC分类号： H01L23/48

CPC分类号： H01L23/49883 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.

摘要翻译： 一种载体结构和方法，用于制造具有通孔的载流子结构，每个导通孔具有导电结构，其有效热膨胀系数小于或接近于基板的热膨胀系数，并且具有小于或等于 或者与衬底的密切匹配。 导电结构可以包括同心的通孔填充区域，其具有同心设置的不同材料，由导电材料的环形环包围的衬底材料的芯，由导电材料的环形环包围的CTE匹配的非导电材料的芯， 具有低CTE的内部空隙的导电通孔，或已经烧结或熔合的诸如金属 - 陶瓷浆料的导电复合材料的完整填充物。

公开(公告)号：US20070035030A1

公开(公告)日：2007-02-15

申请号：US11201572

申请日：2005-08-11

申请人： Raymond Horton ,  John Knickerbocker ,  Edmund Sprogis ,  Cornelia Tsang

发明人： Raymond Horton ,  John Knickerbocker ,  Edmund Sprogis ,  Cornelia Tsang

IPC分类号： H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15311

摘要： Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.

摘要翻译： 提供电子器件制造技术。 一方面，提供一种电子设备。 电子设备包括具有一个或多个通孔和集成在其中的多个去耦电容器的至少一个插入器结构，所述至少一个插入器结构被配置为允许选择性地去激活多个去耦电容器中的一个或多个。 在另一方面，一种制造电子器件的方法，包括至少一个具有一个或多个通孔的内插器结构和集成在其中的多个去耦电容器，其包括以下步骤。 选择性地去激活多个去耦电容器中的一个或多个。

公开(公告)号：US20050106834A1

公开(公告)日：2005-05-19

申请号：US10700327

申请日：2003-11-03

申请人： Paul Andry ,  Jon Casey ,  Raymond Horton ,  Chiraq Patel ,  Edmund Sprogis ,  Brian Sundlof

发明人： Paul Andry ,  Jon Casey ,  Raymond Horton ,  Chiraq Patel ,  Edmund Sprogis ,  Brian Sundlof

IPC分类号： H01L23/12 ,  H01L21/48 ,  H01L21/60 ,  H01L21/76 ,  H01L23/14 ,  H01L25/04 ,  H01L25/18 ,  H05K3/34

CPC分类号： H01L21/486 ,  H01L23/147 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/00

摘要： A method for filling vias, and in particular initially blind vias, in a wafer, and various apparatus for performing the method, comprising evacuating air from the vias; trapping at least a portion of the wafer and a paste for filling the vias between two surfaces; and pressurizing the paste to fill the vias.

摘要翻译： 一种用于在晶片中填充通孔，特别是初始盲孔的方法，以及用于执行该方法的各种装置，包括从通孔排出空气; 捕获晶片的至少一部分和用于在两个表面之间填充通孔的糊状物; 并对该糊状物加压以填充通孔。

公开(公告)号：US20080036084A1

公开(公告)日：2008-02-14

申请号：US11341458

申请日：2006-01-30

申请人： Leena Buchwalter ,  Paul Andry ,  Matthew Farinelli ,  Sherif Goma ,  Raymond Horton ,  Edmund Sprogis

发明人： Leena Buchwalter ,  Paul Andry ,  Matthew Farinelli ,  Sherif Goma ,  Raymond Horton ,  Edmund Sprogis

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L21/67092 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2224/11003 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  Y10S414/139 ,  H01L2924/00 ,  H01L2224/0401

摘要： A laser release and glass chip removal process for a integrated circuit module avoiding carrier edge cracking is provided.

摘要翻译： 提供了用于避免载波边缘破裂的集成电路模块的激光释放和玻璃切屑去除工艺。

公开(公告)号：US20070222065A1

公开(公告)日：2007-09-27

申请号：US11385121

申请日：2006-03-21

申请人： Paul Andry ,  Leena Buchwalter ,  Raymond Horton ,  John Knickerbocker ,  Cornelia Tsang ,  Steven Wright

发明人： Paul Andry ,  Leena Buchwalter ,  Raymond Horton ,  John Knickerbocker ,  Cornelia Tsang ,  Steven Wright

IPC分类号： H01L21/00 ,  H01L23/34

CPC分类号： H01L24/81 ,  H01L23/544 ,  H01L24/48 ,  H01L24/97 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15157 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/20109 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.

摘要翻译： 一种电子潜水及其制造方法。 所述方法包括将放置引导件放置在模块基板的顶表面上，所述放置引导件具有引导开口，所述引导开口从所述放置引导件的顶表面延伸到所述放置引导件的底表面; 将所述放置引导件对准所述模块基板上的集成电路芯片位置; 将所述放置引导件固定到所述模块基板; 将集成电路芯片放置在引导开口中，放置引导开口的侧壁约束集成电路芯片的底表面上的导电接合结构，以与模块基板的顶表面上的导电模块衬底接触焊盘自对准 集成电路芯片位置; 以及在接合之后将结合结构粘合到模块衬底接触焊盘，接合结构和模块衬底接触焊盘，直接物理和电接触。

公开(公告)号：US20060255480A1

公开(公告)日：2006-11-16

申请号：US10908480

申请日：2005-05-13

申请人： Jon Casey ,  Michael Berger ,  Leena Buchwalter ,  Donald Canaperi ,  Raymond Horton ,  Anurag Jain ,  Eric Perfecto ,  James Tornello

发明人： Jon Casey ,  Michael Berger ,  Leena Buchwalter ,  Donald Canaperi ,  Raymond Horton ,  Anurag Jain ,  Eric Perfecto ,  James Tornello

IPC分类号： H01L23/29

CPC分类号： H01L23/147 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.

摘要翻译： 使用无粘性，低粘度，高温稳定的聚合物或低粘度的高固含量聚合物溶液密封通孔，其中聚合物材料在高温下浸渍在通孔内。 引入供应室以在升高的温度下施用聚合物材料，通常在高至足以液化聚合物材料的温度下。 聚合物材料通过来自泵，活塞或保持在所述供应室内的真空的力的加热供应管线引入。