公开(公告)号：US20120112343A1

公开(公告)日：2012-05-10

申请号：US13288161

申请日：2011-11-03

申请人： Manoj K. Jain ,  Sreenivasan Koduri

发明人： Manoj K. Jain ,  Sreenivasan Koduri

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02163 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least three sides of the planarizing dielectric structures. The planarizing dielectric structures can be used on integrated circuits having bond pads of different sizes to electroplate metal posts having the same height.

摘要翻译： 集成电路上的接合焊盘设置有平坦化电介质结构，以允许具有平坦顶表面的金属柱的电镀。 金属柱与平坦化电介质结构的至少三面接触。 平面化电介质结构可以用于具有不同尺寸的接合焊盘的集成电路以电镀具有相同高度的金属柱。

公开(公告)号：US08476760B2

公开(公告)日：2013-07-02

申请号：US13288161

申请日：2011-11-03

申请人： Manoj K. Jain ,  Sreenivasan Koduri

发明人： Manoj K. Jain ,  Sreenivasan Koduri

IPC分类号： H01L23/48 ,  H01L21/00 ,  H01L21/44

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/02163 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/05552 ,  H01L2224/05567 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/13147 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： Bond pads on an integrated circuit are provided with planarizing dielectric structures to permit the electroplating of metal posts having planar top surfaces. The metal posts contact at least three sides of the planarizing dielectric structures. The planarizing dielectric structures can be used on integrated circuits having bond pads of different sizes to electroplate metal posts having the same height.

摘要翻译： 集成电路上的接合焊盘设置有平坦化电介质结构，以允许具有平坦顶表面的金属柱的电镀。 金属柱与平坦化电介质结构的至少三面接触。 平面化电介质结构可以用于具有不同尺寸的接合焊盘的集成电路以电镀具有相同高度的金属柱。

公开(公告)号：US20080012101A1

公开(公告)日：2008-01-17

申请号：US11864233

申请日：2007-09-28

申请人： Edgar Zuniga-Ortiz ,  Sreenivasan Koduri ,  Donald Abbott

发明人： Edgar Zuniga-Ortiz ,  Sreenivasan Koduri ,  Donald Abbott

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/206

摘要： A leadframe with a base metal structure (for example, copper) and first and second surfaces. A first metal layer, which is adhesive to polymeric materials such as molding compounds, is adherent to the first leadframe surface. The second leadframe surface is covered by a second metal layer for affinity to reflow metals such as tin alloy; this second metal layer has a different composition from the first metal layer. One example of the first surface is a nickel layer (201) in contact with the base metal (105), a palladium layer (202) in contact with the nickel layer, and an outermost tin layer (203) in contact with the palladium. Another example is an oxidized surface of the base metal. The second metal layer, on the second leadframe surface, comprises a nickel layer (201) in contact with the base metal (105), a palladium layer (202) in contact with the nickel layer, and an outermost gold layer (204) in contact with the palladium layer.

摘要翻译： 具有贱金属结构（例如铜）和第一和第二表面的引线框架。 与聚合物材料如模塑料粘接的第一金属层与第一引线框表面贴附。 第二引线框表面被第二金属层覆盖，用于对诸如锡合金的回流金属进行亲和性; 该第二金属层与第一金属层具有不同的组成。 第一表面的一个实例是与贱金属（105）接触的镍层（201），与镍层接触的钯层（202）和与钯接触的最外层锡层（203）。 另一个例子是贱金属的氧化表面。 在第二引线框表面上的第二金属层包括与基底金属（105）接触的镍层（201），与镍层接触的钯层（202）和与镍层接触的最外层金属层 与钯层接触。

公开(公告)号：US5934543A

公开(公告)日：1999-08-10

申请号：US991723

申请日：1997-12-16

申请人： Sreenivasan Koduri

发明人： Sreenivasan Koduri

IPC分类号： B23K20/00 ,  H01L21/60 ,  B23K20/10

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/78302 ,  H01L2224/78822 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14

摘要： A capillary (10) is provided for use in wire bonding and may be incorporated into a wire bonding machine. The capillary (10) incorporates one or more indicators (100, 105, 110, 113) which may be positioned about the capillary. For example, the indicators may be affixed to an outer surface of the capillary. Sensing of a indicator may be achieved by a detector (160) to determine the angular position of the indicator. This may be used to determine and/or establish the angular alignment of the capillary. The angular alignment may correspond to a desired axis of a wire bonding machine table or lead frame, or to a longitudinal axis of a lead on a lead frame, in order to achieve optimum effectiveness in wire bonding between an integrated circuit chip and the leads of the lead frame. The capillary may be any of a number of differing types including those having circular and non-circular faces. The indicators may be any of a number of differing types including passive, active, contact, contactless, electrical, mechanical, magnetic, optical, or other types.

摘要翻译： 提供用于引线接合的毛细管（10），并且可以将毛细管（10）结合到引线接合机中。 毛细管（10）包括可以围绕毛细管定位的一个或多个指示器（100,105,110,113）。 例如，指示器可以固定在毛细管的外表面上。 指示器的感测可以通过检测器（160）来实现，以确定指示器的角位置。 这可以用于确定和/或建立毛细管的角度对准。 角度对准可以对应于引线接合机台或引线框架的所需轴线，或者对应于引线框架上的引线的纵向轴线，以便在集成电路芯片和引线之间的引线接合中实现最佳效果 引线框架。 毛细管可以是多种不同类型中的任何一种，包括具有圆形和非圆形面的那些。 指示器可以是多种不同类型中的任何一种，包括无源，有源，接触，非接触式，电气，机械，磁性，光学或其他类型。

公开(公告)号：US20060006532A1

公开(公告)日：2006-01-12

申请号：US11168052

申请日：2005-06-27

申请人： Edgar Zuniga-Ortiz ,  Sreenivasan Koduri

发明人： Edgar Zuniga-Ortiz ,  Sreenivasan Koduri

IPC分类号： H01L23/48

CPC分类号： H01L24/81 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/13006 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/81801 ,  H01L2224/8182 ,  H01L2224/81894 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/05552

摘要： A semiconductor chip having a planar active surface including an integrated circuit protected by an inorganic overcoat; the circuit has metallization patterns including a plurality of contact pads. Each of these contact pads has an added conductive layer on the circuit metallization. This added layer has a conformal surface adjacent the chip, including peripheral portions of the overcoat, and a planar outer surface; this outer surface is suitable to form metallurgical bonds without melting. The chip contact pads may have a distribution arrayed in the center of the chip in close proximity to the chip neutral line; the distribution may leave an area portion of the active chip surface available for attaching a thermally conductive plate. The chip may further have a non-conductive adhesive layer over the overcoat, filling the spaces between the added conductive layers on each contact pad.

公开(公告)号：US06273321B1

公开(公告)日：2001-08-14

申请号：US09678779

申请日：2000-10-04

申请人： Sreenivasan Koduri

发明人： Sreenivasan Koduri

IPC分类号： B23K3100

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/005 ,  B23K2101/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/78268 ,  H01L2224/78302 ,  H01L2224/78822 ,  H01L2224/78901 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to make a second wire bond at a second bond point. The realignment may be achieved by a system including an wire bonding capillary having an indicator located thereon. A detector detects a signal from the indicator. The signal corresponds to a rotational alignment of the capillary and, therefore, to a direction of alignment of the capillary face. A first signal indicates a first alignment of the capillary face and a second signal indicates a second alignment of the capillary face. The signals may each have a relative signal strength which indicates rotational an offset of the capillary face from a given direction.

公开(公告)号：US06215195B1

公开(公告)日：2001-04-10

申请号：US09395256

申请日：1999-09-13

申请人： Sreenivasan Koduri

发明人： Sreenivasan Koduri

IPC分类号： B23K3700

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/005 ,  B23K2101/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/49433 ,  H01L2224/78301 ,  H01L2224/78822 ,  H01L2224/78901 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00

摘要： A wire bonding method includes aligning the face of a capillary along a first direction to make a first wire bond at a first bond point. The capillary face is realigned to a second direction to make a second wire bond at a second bond point. The realignment may be achieved by a system including an wire bonding capillary having an indicator located thereon. A detector detects a signal from the indicator. The signal corresponds to a rotational alignment of the capillary and, therefore, to a direction of alignment of the capillary face. A first signal indicates a first alignment of the capillary face and a second signal indicates a second alignment of the capillary face. The signals may each have a relative signal strength which indicates rotational an offset of the capillary face from a given direction.

摘要翻译： 引线接合方法包括沿着第一方向对准毛细管的表面以在第一接合点进行第一引线接合。 毛细管面重新对准第二方向，以在第二接合点进行第二线接合。 重新排列可以通过包括位于其上的具有指示器的引线键合毛细管的系统来实现。 检测器检测到来自指示器的信号。 信号对应于毛细管的旋转对准，因此对应于毛细管面的对准方向。 第一信号表示毛细管面的第一对准，第二信号表示毛细管面的第二对准。 信号可以各自具有相对信号强度，其指示毛细管面与给定方向的偏移的旋转。

公开(公告)号：US08810023B2

公开(公告)日：2014-08-19

申请号：US13542827

申请日：2012-07-06

申请人： Sreenivasan Koduri

发明人： Sreenivasan Koduri

IPC分类号： H01L29/84

CPC分类号： G01P15/0802 ,  B81B7/0054 ,  H01L2224/16245 ,  H01L2924/1461 ,  H01L2924/00

摘要： A packaged sensor MEMS (100) has a semiconductor chip (101) with a protected cavity (102) including a sensor (105), the cavity surrounded by solder bumps (130) attached to the chip terminals; further a leadframe with elongated and radially positioned leads (131), the central lead ends (131a) attached to the bumps. Insulating material (120) encapsulates chip and central lead ends, leaving the chip surface (101a) opposite the cavity and the peripheral lead ends (131b) un-encapsulated. The un-encapsulated peripheral lead ends are bent into cantilevers for attachment to a horizontal substrate (160), the cantilevers having a geometry to accommodate, under a force lying in the plane of the substrate, elastic bending and stretching beyond the limit of simple elongation based upon inherent material characteristics, especially when supported by lead portions with curved, toroidal, or multiple-bendings geometries.

摘要翻译： 封装传感器MEMS（100）具有半导体芯片（101），其具有包括传感器（105）的保护腔（102），所述空腔被附接到芯片端子的焊料凸块（130）包围; 另外，具有细长且径向定位的引线（131）的引线框架，中心引线端（131a）附接到凸块。 绝缘材料（120）封装芯片和中心引线端，使芯片表面（101a）与空腔相对，并且外围引线端（131b）未被封装。 未封装的外围引线端部弯曲成悬臂以附接到水平基板（160），悬臂具有几何形状，以在位于基板平面内的力下容纳弹性弯曲和拉伸超出简单伸长极限 基于固有的材料特性，特别是当由具有弯曲，环形或多弯曲几何形状的引线部分支撑时。

公开(公告)号：US20060237828A1

公开(公告)日：2006-10-26

申请号：US11112336

申请日：2005-04-22

申请人： William Robinson ,  Sreenivasan Koduri

发明人： William Robinson ,  Sreenivasan Koduri

IPC分类号： H01L23/02

CPC分类号： H01L25/18 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16265 ,  H01L2225/06513 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/00

摘要： System and method for enhancing the performance of wafer chip scale packages (WCSP). A preferred embodiment comprises a parent electrical device 305 and a daughter electrical device 310 coupled to a bottom surface of the parent electrical device, wherein the bottom surface is also used to attach the parent electrical device to a circuit board. A passivation layer is formed over the daughter electrical device to protect it from environmental dangers. The passivation layer also prevents the detachment of the daughter electrical device when the parent electrical device is attached to the circuit board. Solder bumps attached to the parent electrical device permit the attachment of the parent electrical device to the circuit board. The inclusion of the daughter electrical device can add desired functionality as well as permit the use of optimized fabrication processes for different types of integrated circuitry.

摘要翻译： 用于提高晶片尺寸封装（WCSP）性能的系统和方法。 优选实施例包括母电装置305和耦合到母电装置的底表面的子电装置310，其中底表面也用于将母电装置附接到电路板。 在子电气设备上形成钝化层以保护其免受环境危害。 当母电装置附接到电路板时，钝化层还防止子电装置的分离。 连接到母电气设备的焊接凸起允许母电气设备连接到电路板。 包含子电子装置可以增加所需的功能，并且允许对不同类型的集成电路使用优化的制造工艺。

公开(公告)号：US20060189029A1

公开(公告)日：2006-08-24

申请号：US11065689

申请日：2005-02-24

申请人： Sreenivasan Koduri ,  Edgar Zuniga-Ortiz

发明人： Sreenivasan Koduri ,  Edgar Zuniga-Ortiz

IPC分类号： H01L21/44

CPC分类号： H01L21/56 ,  H01L23/49582 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for completing an assembled semiconductor device, which has metallic leads for connection to external parts. The method comprises the step (202) of encapsulating the assembled device with a polymeric precursor so that at least portions of the leads remain un-encapsulated. Without significant delay, these un-encapsulated lead portions are plated (203) with at least one metal layer suitable for connection to external parts; the plating step has no noticeable impact on the uncured mold compound. The encapsulated and plated device is then submitted (204) to a sequence of elevated temperatures for specified periods of time so that concurrently the precursor is polymerized and the at least one metal layer is annealed.

摘要翻译： 一种用于完成组装的半导体器件的方法，其具有用于连接到外部部件的金属引线。 该方法包括将组装的装置与聚合物前体封装的步骤（202），使得至少部分引线保持未包封。 没有显着的延迟，这些未封装的引线部分被电镀（203）与至少一个适于连接到外部部件的金属层; 电镀步骤对未固化的模塑料没有明显的影响。 然后将包封和镀覆的装置（204）提交到指定时间段的升高的温度序列，使得前体聚合并且至少一个金属层被退火。